Patent application number | Description | Published |
20090002973 | Mount Board and Electronic Device - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board | 01-01-2009 |
20090096080 | SEMICONDUCTOR PACKAGE, ELECTRONIC PART AND ELECTRONIC DEVICE - Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip. | 04-16-2009 |
20090107703 | WIRING BOARD, PACKAGING BOARD AND ELECTRONIC DEVICE - To restrain the stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion even when the electronic component is mounted on the curved board. A flexible wiring board in which a plurality of insulation layers ( | 04-30-2009 |
20090135573 | Circuit board device, wiring board interconnection method, and circuit board module device - A circuit board device includes: plurality of wiring boards ( | 05-28-2009 |
20090161331 | Circuit Board Device, Wiring Board Connecting Method, and Circuit Board Module Device - A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards | 06-25-2009 |
20090266586 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE - An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer | 10-29-2009 |
20100148335 | SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SAME, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A highly reliable semiconductor package in which faulty connections do not occur even when an external substrate is curved. The semiconductor package includes a semiconductor chip | 06-17-2010 |
20100280241 | SPIROOXAZINE RADICAL DERIVATIVES AND REVERSIBLE ISOMERIZATION REACTION - The present invention can provide new spirooxazine radical derivatives of the following general formula (1) which have chromic property enabling the distinction between the radical species and the cation species on the basis of absorption wavelength: | 11-04-2010 |
20110242780 | MOUNT BOARD AND ELECTRONIC DEVICE - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board | 10-06-2011 |
20130072678 | SPIROOXAZINE RADICAL DERIVATIVES AND REVERSIBLE ISOMERIZATION REACTION - The present invention can provide new spirooxazine radical derivatives of the following general formula (1) which have chromic property enabling the distinction between the radical species and the cation species on the basis of absorption wavelength: | 03-21-2013 |
20140003015 | MOUNT BOARD AND ELECTRONIC DEVICE | 01-02-2014 |