Patent application number | Description | Published |
20080207037 | Chip actuator cover assembly - An improved IC chip actuator cover assembly for an IC socket includes a pedestal assembly spring-mounted to the bottom of a carrier housing and side leaf springs or other similar force transferring means on the pedestal assembly which transmit a z-axis force to the corner regions of the pedestal assembly for advancing the pedestal assembly in the z-axis direction against an IC chip in the IC socket. The compliance of the leaf springs maintains a constant and precise actuating force on the IC chip when the IC chip is contacted by the pusher end portion or portions of the pedestal assembly. In a preferred aspect of the invention, the front, back, and sides of the carrier housing define a central cavity region above the pedestal assembly for permitting air flow through the carrier housing to improve the heat dissipation capability of the cover assembly. | 08-28-2008 |
20080252324 | Active thermal control unit for maintaining the set point temperature of a DUT - A thermal control unit (TCU) for maintaining the set point temperature of an IC device under test (DUT) has a thermoelectric module (a Peltier device), a fluid circulation block, a lower pedestal assembly containing a thermal sensor, and an upper cover housing arranged in a stacked relationship along the z-axis of the TCU. A z-axis compliant force is supplied from the TCU's cover housing by means of a spring-loaded pusher mechanism that supplies a compliant spring force to the stacked arrangement of the fluid block, peltier device, and pedestal assembly. The z-axis compliant force provided by the spring-loaded pusher mechanism produces efficient thermal contact between the peltier device and the stacked components of the TCU containing the peltier device and allows the peltier device to expand and contract within the TCU to extend the life of the peltier device. An alternative quick disconnect feature allows the electrical leads of the thermal sensor in the pedestal assembly to automatically make electrical connection with associated wiring in the cover housing when the cover housing is secured to the pedestal assembly. | 10-16-2008 |
20080265924 | Contactor nest for an IC device and method - An improved contactor nest for receiving and holding IC devices against a pin board interposer during the test or burn-in of the devices includes a frame having an IC pocket with a top opening, which is oversized in relation to the footprint of the IC device for which the contactor is designed, and centering guide walls for guiding an IC device to be tested into the pocket from the oversized top opening to the IC device seating plane. The centering guide walls have a gradual angle relative to the insertion axis of the IC pocket, and extend down to a bottom perimeter portion of the IC pocket immediately adjacent the IC seating plane for gradually centering the IC device in the pocket as the IC device approaches the seating plane. Preferably, the angled guide walls extend far enough into the IC pocket to allow the spring pins of the pin board interposer to scrub the contact pads of the IC devices as the IC device is being centered. | 10-30-2008 |
20090279252 | Cooling air distribution scheme for communication boards - A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cooling air spaces are defined above and below the board, permitting cooling air to be drawn over both sides of the board. Notches extend inwardly from an edge of the board, the notches serving as air flow paths between the cooling air spaces and serving to distribute cooling air flowing into the housing from one or more intakes to the cooling air spaces. | 11-12-2009 |
20090279253 | Cooling configuration for communication boards - A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards. | 11-12-2009 |
20100277191 | SPRING CONTACT PIN FOR AN IC TEST SOCKET AND THE LIKE - A spring contact pin includes a depressible probe member having a tapered configuration that prevents contact between the projecting end of the probe member and the end of the spring barrel throughout the compression and release cycle of the probe. The tapered configuration of the depressible probe member improves the mechanical performance, reliability, and high-speed signal performance of the contact pin. | 11-04-2010 |
20110057676 | UNIVERSAL SPRING CONTACT PIN AND IC TEST SOCKET THEREFOR - A universal spring contact pin for use in an IC test Socket includes a depressible probe member at one end and a fixed probe member at the other end. The fixed probe member preferably has a projection length chosen to allow z-axis loading of different surface mount package types within the same test socket. It also can have a relatively large tip angle which preferably terminates at a relatively sharp termination point. Preferably, the tip angle is about 90 degrees and the radius of the termination point of the tip is about 0.001 inches (0.0254 millimeters) or less. The large tip angle on the contact pin's fixed probe member provides the pin with a robust probe end that operates reliably over a large number of test cycles, is better adapted for effective use with different surface mount chip packages, and better supports a sharp tip radius. A sharp tip radius will, in turn, provide for better penetration of oxide coatings and/or foreign material on the leads of the chip packages. A test socket can be provided for the universal spring contact pins, which can include an interface wall configuration for retaining the contact pins in a z-axis alignment and for improving the signal performance of the socket at high frequencies. | 03-10-2011 |
20110110038 | COOLING CONFIGURATION FOR COMMUNICATION BOARDS - A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards. | 05-12-2011 |
20110214843 | Systems and Methods for Thermal Control of Integrated Circuits During Testing - Thermal control units (TCU) for maintaining a set point temperature on an IC device under test (DUT) are provided. The units include a pedestal assembly comprising a heat-conductive pedestal, a fluid circulation block, a thermoelectric module (Peltier device) between the heat-conductive pedestal and the block for controlling heat flow between the pedestal and fluid circulation block, and a force distribution block for controllably distributing a z-axis force between different pushers of the TCU. Alternatively, instead of a thermoelectric module, a heater can provide heat to the DUT. Optionally, a swivelable temperature-control fluid inlet and outlet arms may be provided to reduce instability of the thermal control unit due to external forces exerted on the TCU such as by fluid lines attached to the fluid inlet and outlet arms. Also optionally, an integrated means for abating condensation on surfaces of the TCU during cold tests may be provided. | 09-08-2011 |
20130021049 | Systems and Methods for Conforming Device Testers to Integrated Circuit Device Profiles - A device tester for an IC device under test (DUT), the DUT having a substrate and an attached die. The device tester includes a thermal control unit and a test socket assembly which conforms to the DUT's profile. The thermal control unit includes a pedestal assembly, a heater having a fuse coupled to a heating element, a substrate pusher, and a force distributor for distributing force between the pedestal assembly and the substrate pusher. The test socket assembly includes a socket insert that supports and also conforms to the DUT's profile. | 01-24-2013 |
20130271170 | Systems and Methods for Conforming Device Testers to Integrated Circuit Device Profiles with Feedback Temperature Control - An integrated circuit (IC) device tester maintains a set point temperature on an IC device under test (DUT) having a die attached to a substrate. The tester includes a thermal control unit and a fluid management system configured to supply the thermal control unit with fluids for pneumatic actuation, cooling, and condensation abating. The tester can includes a box enclosing the thermal control unit thereby providing a substantially isolated dry environment during low humidity testing of the DUT. The heat exchange plate may include an inner structure for thermal conductivity enhancement. | 10-17-2013 |
20140015556 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH COMPLIANT PEDESTALS - A test socket assembly, useful in association with a thermal control unit used to maintain a set point temperature on an IC device under test, has at least one compliant pedestal is configured to facilitate the testing of integrated circuits where the device under test comprises a substrate having multiple IC chips with different heights and testing requirements. | 01-16-2014 |
20140021972 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH SOCKETS HAVING SECURED AND REPLACEABLE BUSHINGS - A test socket assembly, useful in association with a thermal control unit (TCU) used to maintain a set point temperature on an IC device under test, has alignment holes with bushings that are secured within the alignment holes by using retaining pins. The retaining pins can be easily screwed in and out of the socket. This provision allows the bushings to be replaced easily as they get worn out or deformed from repeated testing. | 01-23-2014 |
20140055154 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH EJECTION MECHANISMS - A test pusher assembly, useful in association with a thermal control unit used to maintain a set point temperature on an integrated circuit device under test, is provided with ejection mechanisms configured to facilitate the disengagement of the DUT at the end of the test. One example of the ejection mechanisms is to provide the substrate pusher assembly with spring-loaded pins that can push the substrate of the DUT away from the pedestal at the end of the test. Another example of the ejection mechanisms is to use a pressurized fluid that can push the substrate of the DUT away from the pedestal at the end of the test. | 02-27-2014 |
20140232426 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH CONVEX SUPPORT STRUCTURE - A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT. | 08-21-2014 |
20150022226 | SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH COAXIAL SOCKET - A coaxial socket useful in association with an integrated circuit (IC) device tester and having a conducting pin surrounded by an insulating layer and embedded in a conducting base. This coaxial pin configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits. | 01-22-2015 |