Patent application number | Description | Published |
20080206980 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD AND STRUCTURE FOR IMPLEMENTING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer electrically connected to the electrode. The conductive layer is extended to an upper surface of the projection. Therefore, productivity of the semiconductor is improved. | 08-28-2008 |
20090032944 | ELECTRONIC DEVICE, METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE - A semiconductor device includes n | 02-05-2009 |
20090045509 | ELECTRONIC DEVICE - An electronic device including: a semiconductor chip on which an integrated circuit is formed; an electrode formed on the semiconductor chip and electrically connected to the integrated circuit; a resin protrusion disposed on the semiconductor chip; an interconnect formed on the electrode and extending over the resin protrusion; a wiring board on which a wiring pattern is formed, the semiconductor chip being mounted on the wiring board so that part of the interconnect positioned over the resin protrusion faces and is electrically connected to the wiring pattern; and an adhesive that bonds the semiconductor chip and the wiring board. The resin protrusion is compressed in a direction in which the distance between the semiconductor chip and the wiring board decreases and is formed of a material having a negative coefficient of thermal expansion. | 02-19-2009 |
20090051028 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS - An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion. | 02-26-2009 |
20090242122 | METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AS WELL AS CIRCUIT BOARD, ELECTROOPTIC DEVICE, AND ELECTRONIC DEVICE - A method of forming a bonded structure comprises the steps of: mounting a semiconductor device having an electrode; a convexity protruding higher than the electrode and formed of a resin; and a conductive unit electrically coupled to the electrode and extending over the surface of the convexity, onto a specific substrate with an intermediary of a bonding material; and mounting the semiconductor device by hot pressing within a temperature range including the glass transition temperature of the resin. | 10-01-2009 |
20090317969 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD AND STRUCTURE FOR IMPLEMENTING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer electrically connected to the electrode. The conductive layer is extended to an upper surface of the projection. Therefore, productivity of the semiconductor is improved. | 12-24-2009 |
20100109144 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion. | 05-06-2010 |
20100171216 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS - An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion. | 07-08-2010 |
20100252829 | SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS - A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection. | 10-07-2010 |
20110011630 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion. | 01-20-2011 |
20110018110 | ELECTRONIC DEVICE, METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE - A semiconductor device includes n | 01-27-2011 |
20110121451 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS - An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion. | 05-26-2011 |
20120104633 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS - An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion. | 05-03-2012 |
20130075596 | OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS - An optical filter device includes a variable wavelength interference filter having a stationary substrate, a movable substrate, a stationary reflecting film, and a movable reflecting film, and a housing adapted to house the variable wavelength interference filter therein. The housing has a base substrate, a lid bonded to the base substrate, and forming an internal space between the base substrate and the lid, and a lid-side glass substrate adapted to block a light passage hole provided to the lid. Further, the lid-side glass substrate has a substrate edge located outside the outer peripheral edge of the light passage hole, and is bonded to the lid in an area extending from the outer peripheral edge of the light passage hole to the substrate edge. | 03-28-2013 |