Patent application number | Description | Published |
20090001611 | ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD - The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less. | 01-01-2009 |
20090032976 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - Provided are a semiconductor device producing method making production steps therein simple while preventing a matter that wire bonding cannot be attained due to contamination of a bonding pad and preventing the generation of a warp in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving the yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor element | 02-05-2009 |
20090149003 | DICING DIE-BONDING FILM - The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer ( | 06-11-2009 |
20090209089 | DICING DIE-BONDING FILM - The present invention provides a dicing die-bonding film including a dicing film having a pressure sensitive adhesive layer provided on a base material and a die-bonding film provided on the pressure sensitive adhesive layer, and having excellent storage stability of a product even at room temperature. The dicing die-bonding film in the present invention is a dicing die-bonding film having a dicing film including a radiation curable pressure sensitive adhesive layer provided onto a base material and a die-bonding film provided on the pressure sensitive adhesive layer, in which a pressure sensitive adhesive in the pressure sensitive adhesive layer is constituted by containing an acryl polymer, and in which the acid value of the acryl polymer is in a range of 0.01 to 1 and the iodine value is in a range of 5 to 10. | 08-20-2009 |
20100019365 | DICING/DIE BONDING FILM - The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer and a die bonding adhesive layer being sequentially laminated on a supporting substrate, wherein said pressure-sensitive adhesive layer has a thickness of 10 to 80 μm, and has a storage elastic modulus at 23° C. of 1×10 | 01-28-2010 |
20100028687 | DICING DIE-BONDING FILM - A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising an acrylic ester A represented by CH | 02-04-2010 |
20100029059 | DICING DIE-BONDING FILM - The present invention is a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on an ultraviolet-ray transmitting base and a die-bonding film provided on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is formed by laminating the die-bonding film onto a pressure-sensitive adhesive layer precursor formed from an acrylic polymer comprising an acrylic ester as a main monomer, a hydroxyl group-containing monomer at a ratio in the range of 10 to 40 mol % with respect to 100 mol % of the acrylic ester, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecular at a ratio in the range of 70 to 90 mol % with respect to 100 mol % of the hydroxyl group-containing monomer, and then curing by irradiating with an ultraviolet ray from the base side, and the die-bonding film is formed from an epoxy resin. | 02-04-2010 |
20100029060 | DICING DIE-BONDING FILM - A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH | 02-04-2010 |
20100029061 | DICING DIE-BONDING FILM - A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10-40 mol % to 100 mol % of the acrylic ester, an isocyanate compound having a radical reactive carbon-carbon double bond where a ratio is in a range of 70-90 mol % to 100 mol % of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds where a ratio is in a range of 10-60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer. | 02-04-2010 |
20100055842 | THERMOSETTING DIE-BONDING FILM - The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer. | 03-04-2010 |
20100093154 | DICING/DIE BONDING FILM - A dicing die-bonding film in which the adhesive properties during the dicing step and the peeling properties during the pickup step are controlled so that both become good, and a production method thereof, are provided. The dicing die-bonding film in the present invention is a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material and a die bond layer on the pressure-sensitive adhesive layer, in which the arithmetic mean roughness X (μm) on the pressure-sensitive adhesive layer side in the die bond layer is 0.015 μm to 1 μm, the arithmetic mean roughness Y (μm) on the die bond layer side in the pressure-sensitive adhesive layer is 0.03 μm to 1 μm, and the absolute value of the difference of the X and Y is 0.015 or more. | 04-15-2010 |
20100093155 | DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICONDUCTOR DEVICE - A dicing/die-bonding film including a pressure-sensitive adhesive layer ( | 04-15-2010 |
20100129986 | DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film has a laminated structure of a heat-expandable pressure-sensitive adhesive layer containing a foaming agent and an active energy ray-curable antifouling pressure-sensitive adhesive layer, which are laminated on the base material in this order, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film. | 05-27-2010 |
20100129987 | DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer of the dicing film is a heat-expandable pressure-sensitive adhesive layer formed of a heat-expandable pressure-sensitive adhesive containing an acrylic polymer A and a foaming agent. The acrylic polymer A is an acrylic polymer composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH | 05-27-2010 |
20100129989 | DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - The present invention relates to a dicing die-bonding film comprising: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable heat-expandable pressure-sensitive adhesive layer containing a foaming agent, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film. | 05-27-2010 |
20100193968 | DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM - The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | 08-05-2010 |
20100197080 | ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD - The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less. | 08-05-2010 |
20100219507 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - According to the invention, a process for producing a semiconductor device using an adhesive sheet for a spacer, comprising preparing an adhesive sheet having a spacer layer provided with an adhesive layer on at least one surface thereof as the adhesive sheet for a spacer, a step of sticking the adhesive sheet for a spacer onto a dicing sheet with the adhesive layer as a sticking surface, a step of dicing the adhesive sheet for a spacer to form a chip-shaped spacer provided with the adhesive layer, a step of peeling the spacer from the dicing sheet together with the adhesive layer, and a step of fixing the spacer onto an adherend with the adhesive layer interposed therebetween. | 09-02-2010 |
20100233409 | DICING DIE-BONDING FILM - A dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film on the pressure-sensitive adhesive layer, which, even if the semiconductor wafer is thin, is excellent in balance between holding strength of the semiconductor wafer during dicing and peeling property of its semiconductor chip obtained by dicing upon being peeled together with the die-bonding film. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer comprising an acrylic acid ester as a main monomer, 10 to 30 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and the die-bonding film comprises an epoxy resin. | 09-16-2010 |
20100236689 | ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SHEET - The present invention provides an adhesive sheet for manufacturing a semiconductor device, which, even when the adhesive sheet is made thin, makes it possible to easily identify the presence or absence of the adhesive sheet, thereby decreasing down time for the manufacturing apparatus and enabling an improvement of the yield, and to provide a semiconductor device manufacturing method using the sheet. The present invention relates to an adhesive sheet for manufacturing a semiconductor device which is used to adhere a semiconductor element to an adherend, wherein the adhesive sheet contains a pigment which adsorbs or reflects light having a wavelength in a range from 290 to 450 nm. | 09-23-2010 |
20100239866 | DICING DIE-BONDING FILM - The present invention provides a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film, wherein the pressure-sensitive adhesive layer contains a polymer that is obtained by the addition-reaction of an acrylic polymer containing 10 to 30 mol % of a hydroxyl group-containing monomer with 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and also contains 2 to 20 parts by weight of a crosslinking agent containing two or more functional groups having reactivity with a hydroxyl group in the molecule based on 100 parts by weight of the polymer, and the die-bonding film comprises an epoxy resin. | 09-23-2010 |
20100264531 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED THEREIN, AND SEMICONDUCTOR DEVICE OBTAINED THEREBY - The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175° C. is 2000 Pa or more. | 10-21-2010 |
20100273313 | MANUFACTURING METHOD OF LASER PROCESSED PARTS, AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING USED FOR THE SAME - A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency. | 10-28-2010 |
20100304092 | METHOD OF MANUFACTURING DICING DIE-BONDING FILM - A method of manufacturing a dicing die-bonding film having excellent adhesive properties during a dicing step and excellent peeling properties during a pickup. A method of manufacturing a dicing die-bonding film comprising a pressure-sensitive adhesive layer and an adhesive layer laminated sequentially on a base material, the method including the steps of forming the adhesive layer on a releasing film, the film containing an inorganic filler, having an arithmetic mean roughness Ra of 0.015 to 1 μm, and having an uneven surface and bonding the pressure-sensitive adhesive layer and the adhesive layer provided on the base material under the conditions of a temperature of 30 to 50° C. and a pressure of 0.1 to 0.6 MPa and making the contact area of the pressure-sensitive adhesive layer and the adhesive layer be in the range of 35 to 90% to the bonding area. | 12-02-2010 |
20100330745 | PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE - The process for producing a semiconductor device of the invention is a process for producing a semiconductor device, comprising: a temporarily bonding step of bonding a semiconductor element temporarily on an adherend through an adhesive sheet, a semi-curing step of heating the adhesive sheet under predetermined conditions, thereby turning the sheet into a semi-cured state that the shearing adhering strength of the sheet to the adherend is 0.5 MPa or more, and a wire bonding step of causing the semiconductor element to undergo wire bonding in the state that the adhesive sheet is semi-cured. | 12-30-2010 |
20110052853 | ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME - The present invention provides an adhesive film with a dicing sheet having a pressure-sensitive adhesive layer on a base material and also having a peelable adhesive film on the pressure-sensitive adhesive layer, that has an excellent peeling property when peeling a semiconductor chip obtained by dicing and an adhesive film attached thereto together without impairing the holding power even during dicing a thin semiconductor wafer, and a method of manufacturing the same. The adhesive film with a dicing sheet of the present invention is formed by sequentially laminating a pressure-sensitive adhesive layer and an adhesive layer on a base material, in which the intensity of an Si—Kα ray on at least one region on a surface of the pressure-sensitive adhesive layer to be pasted onto the adhesive layer is 0.01 to 100 kcps. | 03-03-2011 |
20110053346 | DICING/DIE BONDING FILM - A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film, wherein the pressure-sensitive adhesive layer contains a polymer obtained by the addition reaction of an acrylic polymer containing 10 to 40 mol % of a hydroxyl group-containing monomer with 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and 2 to 20 parts by weight of a crosslinking agent including in the molecule two or more functional groups having reactivity with a hydroxyl group based on 100 parts by weight of the polymer, and the pressure-sensitive adhesive layer is also cured by irradiation with ultraviolet rays under predetermined conditions, and wherein the die-bonding film comprises an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays. | 03-03-2011 |
20110104873 | DICING/DIE BONDING FILM - Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays. | 05-05-2011 |
20110147952 | DICING DIE-BONDING FILM - The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer ( | 06-23-2011 |
20110156277 | DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE - The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment. | 06-30-2011 |
20110156278 | FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE - The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has an elastic modulus (at 50° C.) of 10 MPa or less and the laser marking layer has an elastic modulus (at 50° C.) of 100 MPa or more. | 06-30-2011 |
20110156279 | FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE - The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm. | 06-30-2011 |
20110156280 | DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE - The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm. | 06-30-2011 |
20110159642 | TAPE FOR HOLDING CHIP, METHOD OF HOLDING CHIP-SHAPED WORKPIECE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING TAPE FOR HOLDING CHIP, AND METHOD OF MANUFACTURING TAPE FOR HOLDING CHIP - The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region. | 06-30-2011 |
20110189835 | FILM FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a new film for manufacturing a semiconductor device that is superior to prevent contamination of a semiconductor chip having an excellent balance of holding power during dicing a semiconductor wafer even where the semiconductor wafer is thin, peeling property when peeling the semiconductor chip that is obtained by dicing together with its adhesive layer, and low contamination property in which there is no attachment of cutting debris to the semiconductor chip. A film for manufacturing a semiconductor device that is used when manufacturing a semiconductor device has a base layer, a first pressure-sensitive adhesive layer that is provided on the base layer, a radiation curing-type second pressure-sensitive adhesive layer that is provided on the first pressure-sensitive adhesive layer and cured by radiation irradiation in advance, and an adhesive layer that is provided on the second pressure-sensitive adhesive layer. | 08-04-2011 |
20110190421 | ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE - Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation. | 08-04-2011 |
20120088333 | DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICONDUCTOR DEVICE - A dicing/die-bonding film including a pressure-sensitive adhesive layer ( | 04-12-2012 |
20120107576 | TAPE FOR HOLDING CHIP, METHOD OF HOLDING CHIP-SHAPED WORKPIECE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING TAPE FOR HOLDING CHIP, AND METHOD OF MANUFACTURING TAPE FOR HOLDING CHIP - The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region. | 05-03-2012 |
20120135242 | THERMOSETTING DIE-BONDING FILM - The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer. | 05-31-2012 |
20120189845 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - Provided are a semiconductor device producing method with simple production steps while preventing contamination of a bonding pad and preventing warp generation in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor element | 07-26-2012 |
20120231236 | DICING FILM WITH PROTECTING FILM - The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is provided a dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm. | 09-13-2012 |
20120261839 | DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM - The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | 10-18-2012 |
20130020724 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED THEREIN, AND SEMICONDUCTOR DEVICE OBTAINED THEREBY - The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is | 01-24-2013 |
20130034935 | DICING DIE-BONDING FILM - Provide is a dicing die-bonding film that prevents the occurrence of reflow cracking and that is capable of manufacturing a semiconductor device having excellent reliability with good productivity. The dicing die-bonding film of the present invention comprises at least: a dicing film in which a pressure-sensitive adhesive layer is provided on a support base material; and a die-bonding film that is provided on the pressure-sensitive adhesive layer, wherein the dicing die-bonding film has a water absorption rate of 1.5% by weight or less calculated from the following formula (1). | 02-07-2013 |
20130139874 | CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR ELECTRODE, AND SOLAR CELL MODULE - A conductive adhesive sheet includes a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction; a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer. | 06-06-2013 |
20130285262 | DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM - The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | 10-31-2013 |
20140084490 | DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM - The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | 03-27-2014 |
20140091480 | DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM - The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | 04-03-2014 |
20140106106 | DICING FILM WITH PROTECTING FILM - The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is provided a dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm. | 04-17-2014 |
20140159254 | DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE - The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm. | 06-12-2014 |
20140175677 | DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE - The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment. | 06-26-2014 |