Patent application number | Description | Published |
20090001584 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A method of fabricating a semiconductor device that may include at least one of the following steps: Forming a lower metal wiring on and/or over a semiconductor substrate. Forming an interlayer insulating film having a damascene hole on and/or over the semiconductor substrate and the lower metal wiring. Forming an anti-diffusion film on and/or over the exposed lower metal wiring below the damascene hole and/or on side surfaces of the damascene hole. Selectively removing the anti-diffusion film formed on and/or over the exposed lower metal wiring at the bottom of the damascene hole using a plasma process that uses an inert gas. | 01-01-2009 |
20090065684 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME - An image sensor and a method for fabricating the same having enhanced sensivity. The image sensor enhances sensitivity and minimizes optical loss by isolating color filters from each other using a metal that has superior light reflection properties while having no effect on the color filters during deposition of the metal. | 03-12-2009 |
20090134439 | CMOS IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - A CMOS Image Sensor (CIS) that minimizes light loss and achieves maximized performance. The CIS includes a plurality of metal wirings provided on and/or over a semiconductor substrate and surrounded, respectively, by a dielectric layer, a silicon layer deposited on and/or over the plurality of metal wirings, a photodiode and a plurality of transistors provided at the silicon layer, a color filter formed on and/or over the transistors, and via-contacts penetrated through the silicon layer, the photodiode being connected to the plurality of metal wirings by the via-contacts and gap-fillers. The photodiodes and the transistors are formed after forming the metal line. | 05-28-2009 |
20090136724 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - Embodiments relate to a semiconductor device and to a method of fabricating a semiconductor device. According to embodiments, reliability may be enhanced by removing oxide from a barrier metal surface. According to embodiments, a method may include forming an insulating layer on and/or over a metal layer formed on and/or over a substrate, forming a via hole by etching the insulating layer to expose the metal layer, forming a trench by etching a portion of the insulating layer in an area having the via hole formed therein, forming a barrier metal layer on and/or over the insulating layer including the trench and the via hole, performing plasma processing on the barrier metal layer, and forming a seed Cu layer on the barrier metal layer. | 05-28-2009 |
20090160012 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - Embodiments relate to a semiconductor device and a method for fabricating the same. According to embodiments, a semiconductor device may include a first device, a silicon epitaxial layer formed on and/or over the first device, a second device formed on and/or over the silicon epitaxial layer, and a connection via formed through the silicon epitaxial layer, which may electrically interconnect the first device and the second device. According to embodiments, a method for fabricating a semiconductor device may include forming a first device, forming a silicon epitaxial layer on and/or over the first device, forming a connection via through the silicon epitaxial layer, and forming a second device on and/or over the silicon epitaxial layer such that the second device may be electrically connected to the connection via. | 06-25-2009 |
20100112807 | METHOD OF FORMING METAL WIRING OF SEMICONDUCTOR DEVICE - A method of forming a metal wiring of a semiconductor device, and devices thereof. A method of forming a metal wiring, and devices thereof, may maximize semiconductor yield by substantially removing oxide on and/or over a trench and/or by substantially removing a by-product that may remain on and/or over a surface of a wafer. A method of forming a metal wiring of a semiconductor may include forming a dielectric layer on and/or over a metal wiring. A method of forming a metal wiring of a semiconductor may include forming a contact hole, which may expose a partial surface of metal wiring, on and/or over a dielectric layer. A method of forming a metal wiring of a semiconductor may include performing an oxide removing process on and/or over an inner side of a contact hole, and/or performing a by-product removing process on and/or over an inner side wall of a trench. | 05-06-2010 |
20100140806 | Method for Forming Super Contact in Semiconductor Device - A method for forming a super contact in a semiconductor device is disclosed. The method enables forming a barrier film selectively on the silicon substrate, leaving the metal contact exposed for perfect isolation of the metal pad from the silicon substrate after formation of the super contact. | 06-10-2010 |