Patent application number | Description | Published |
20090001458 | SEMICONDUCTOR DEVICE WITH SUBSTANTIAL DRIVING CURRENT AND DECREASED JUNCTION LEAKAGE CURRENT - The semiconductor device includes an active region, a stepped recess channel region including vertical channel structures, a gate insulating film, and a gate structure. The active region is defined by a device isolation structure formed in a semiconductor substrate. The stepped recess channel region is formed in the active region. The vertical silicon-on-insulator (SOI) channel structures are disposed at sidewalls of both device isolation structures in a longitudinal direction of a gate region. The gate insulating film is disposed over the active region including the stepped recess channel region. The gate structure is disposed over the stepped recess channel region of the gate region. | 01-01-2009 |
20090108341 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor device includes forming a first vertical pillar over a semiconductor substrate. A spacer is formed over a sidewall of the first vertical pillar. A portion of the semiconductor substrate exposed between the first vertical pillars is etched to form a recess that exposes a second vertical pillar extending below from the first vertical pillar. A sacrificial film is formed over the semiconductor substrate including the recess and a sidewall of the first vertical pillar to fill the recess, the second vertical pillar and the first vertical pillar. A supporting layer is deposited over the sacrificial film and the first vertical pillar. The supporting layer is patterned to form a supporting pattern connecting the first vertical pillar with each other. The sacrificial film is removed to expose the second vertical pillar. A surrounding gate is formed over a sidewall of the second vertical pillar. | 04-30-2009 |
20090173992 | SEMICONDUCTOR DEVICE WITH IMPROVED PERFORMANCE CHARACTERISTICS - The semiconductor device includes an active region, a recess, a Fin channel region, a gate insulating film, and a gate electrode. The active region is defined by a device isolation structure formed in a semiconductor substrate. The recess is formed by etching the active region and its neighboring device isolation structure using an island shaped recess gate mask as an etching mask. The Fin channel region is formed on the semiconductor substrate at a lower part of the recess. The gate insulating film is formed over the active region including the Fin channel region and the recess. The gate electrode is formed over the gate insulating film to fill up the Fin channel region and the recess. | 07-09-2009 |
20090273088 | Semiconductor Device and Method for Fabricating the Same - A method for fabricating a semiconductor device includes forming a metal word line additionally over a vertical transistor to obtain a multi-layered structure, thereby preventing degradation of the operating speed of the semiconductor device by preventing an increase of resistance of a damascene word line that connects a surrounding gate of a vertical transistor. As a result, the yield and reliability of the semiconductor device can be improved. | 11-05-2009 |
20090298242 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - Disclosed herein is a method for manufacturing a semiconductor device that includes forming a gate pattern on a substrate having a stacked structure including a lower silicon layer, an insulating layer, and an upper silicon layer. The method further includes forming spacers on sidewalls of the gate pattern. Still further, the method includes etching the upper silicon layer using the gate pattern as a mask to form a floating body and expose a portion of the insulating layer. The method further includes depositing a conductive layer over the gate pattern and exposed insulating layer, and performing a thermal process on the conductive layer to form a source/drain region in the floating body. | 12-03-2009 |
20100006939 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device comprises including a insulating pattern and a silicon film over a SOI substrate, thereby increasing a reduced volume of a floating body after forming a floating body fin transistor so as to secure a data storage space. The method comprises: forming a insulating pattern and a first silicon film over an upper silicon film of a SOI substrate; and forming a fin structure in the first silicon film. | 01-14-2010 |
20100022057 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A FIN CHANNEL TRANSISTOR - The semiconductor device includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof. The semiconductor device additionally has a fin channel region protruded over the device isolation structure in a longitudinal direction of a gate region; a gate insulating film formed over the semiconductor substrate including the protruded fin channel region; and a gate electrode formed over the gate insulating film to fill up the protruded fin channel region. | 01-28-2010 |
20100059837 | Spin Transfer Torque Memory Device Having Common Source Line and Method for Manufacturing the Same - A spin transfer torque memory device and a method for manufacturing the same. The spin transfer torque memory device comprises a MRAM cell using a MTJ and a vertical transistor. A common source line is formed in the bottom of the vertical transistor, thereby obtaining the high-integrated and simplified memory device. | 03-11-2010 |
20100072541 | SEMICONDUCTOR DEVICE WITH INCREASED CHANNEL AREA AND DECREASED LEAKAGE CURRENT - The semiconductor device includes an active region, a recess channel region including vertical channel structures, a gate insulating film, and a gate structure. The active region is defined by a device isolation structure formed in a semiconductor substrate. The recess channel region is formed in the active region. The vertical silicon-on-insulator (SOI) channel structures are disposed at sidewalls of both device isolation structures in a longitudinal direction of a gate region. The gate insulating film is disposed over the active region including the recess channel region. The gate structure is disposed over the recess channel region of the gate region. | 03-25-2010 |
20100117149 | SEMICONDUCTOR DEVICE HAVING A RECESS CHANNEL TRANSISTOR - The semiconductor device having a recess channel transistor includes a device isolation structure formed in a semiconductor substrate to define an active region having a recess region at a lower part of sidewalls thereof and a recess channel region formed in the semiconductor substrate under the active region. A method for fabricating the semiconductor device includes forming a device isolation structure in a semiconductor substrate to form an active region having a recess region at a lower part of sidewalls thereof, a gate insulating film formed over the semiconductor substrate including the recess channel region, and a gate electrode formed over the gate insulating film to fill up the recess channel region. | 05-13-2010 |
20100151635 | VERTICAL FLOATING BODY CELL OF A SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a tube-type channel formed over a semiconductor substrate. The tube-type channel is connected to first and second conductive lines. A bias electrode is formed in the tube-type channel. The bias electrode is connected to the semiconductor substrate. An insulating film is disposed between the tube-type channel and the bias electrode. A surrounding gate electrode is formed over the tube-type channel. | 06-17-2010 |
20100157664 | MAGNETORESISTIVE MEMORY CELL USING FLOATING BODY EFFECT, MEMORY DEVICE HAVING THE SAME, AND METHOD OF OPERATING THE MEMORY DEVICE - A magnetoresistive memory cell includes an MTJ device and a select transistor. The select transistor includes a first conduction-type semiconductor layer, a gate electrode formed by disposing a gate insulating layer on top of the semiconductor layer, and first and second diffusion regions formed in the semiconductor layer to be spaced apart from each other and to have a second conduction type. A part of the semiconductor layer between the first and second diffusion regions is formed as an electrically floating body region. By using a high-performance select transistor with a floating body effect, high integration of a magnetoresistive memory device may be achieved. | 06-24-2010 |
20110269251 | Spin Transfer Torque Memory Device Having Common Source Line and Method for Manufacturing the Same - A spin transfer torque memory device and a method for manufacturing the same. The spin transfer torque memory device comprises a MRAM cell using a MTJ and a vertical transistor. A common source line is formed in the bottom of the vertical transistor, thereby obtaining the high-integrated and simplified memory device. | 11-03-2011 |
20120061760 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device comprises including a insulating pattern and a silicon film over a SOI substrate, thereby increasing a reduced volume of a floating body after forming a floating body fin transistor so as to secure a data storage space. The method comprises: forming a insulating pattern and a first silicon film over an upper silicon film of a SOI substrate; and forming a fin structure in the first silicon film. | 03-15-2012 |
20120122295 | SEMICONDUCTOR DEVICE WITH RECESS AND FIN STRUCTURE - The semiconductor device includes an active region, a recess, a Fin channel region, a gate insulating film, and a gate electrode. The active region is defined by a device isolation structure formed in a semiconductor substrate. The recess is formed by etching the active region and its neighboring device isolation structure using an island shaped recess gate mask as an etching mask. The Fin channel region is formed on the semiconductor substrate at a lower part of the recess. The gate insulating film is formed over the active region including the Fin channel region and the recess. The gate electrode is formed over the gate insulating film to fill up the Fin channel region and the recess. | 05-17-2012 |
20140247647 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - Electronic devices having semiconductor elements and methods for fabricating such devices including, a method for fabricating an electronic device including a semiconductor memory, which includes: forming a sacrificial layer on a substrate including a first region and a second region; selectively etching the sacrificial layer and the substrate of the first region to form a trench; forming a first gate that fills a part of the trench in the first region; forming a gate protection layer on the first gate to fill the remaining part of the trench; removing the sacrificial layer of the first region to form a grooved portion surrounded by the gate protection layer; forming a conductive plug to cover the grooved portion; removing the sacrificial layer of the second region; and forming a second gate on the substrate of the second region. | 09-04-2014 |
20140293672 | ELECTRONIC DEVICE - This patent document relates to memory circuits or devices and their applications in electronic devices or systems. The disclosed technology in this patent document includes memory circuits or devices and their applications in electronic devices or systems and various implementations of an electronic device in which an electronic device capable of reducing an area, improving device characteristics due to a reduction in the resistance of a switching transistor, simplifying the process, and reducing a cost is provided. In accordance with the electronic device of this patent document, an area can be reduced, device characteristics can be improved due to a reduction in the resistance of the switching transistor, the process can be simplified, and a cost can be reduced. | 10-02-2014 |
20150055397 | ELECTRONIC DEVICE - An electronic device including a semiconductor memory. The semiconductor memory includes a bit line; a source line; a plurality of resistive memory cells among which a selected memory cell forms a current path between the bit line and the source line; a read current supply unit configured to supply read current to the bit line in a read operation; a sense amplifier configured to generate read data in response to a voltage level of the bit line in the read operation; and a variable switch element configured to flow current from the source line to a ground terminal in the read operation, and be decreased in its resistance value as a voltage level of the source line is high. | 02-26-2015 |