Primavera
Alessandra Primavera, Udine IT
Patent application number | Description | Published |
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20100242990 | Apparatus and process for the dry removal of the scale found on the surface of the metal products - An apparatus and process for the dry removal of the scale from the surface of a metal product comprising at least one heating area that does not reduce the specific surface of the material to be treated and does not cause oxidation, at least one reducing area for performing the reaction between a specific reducing gas (normally hydrogen) and at least the scale, at least one cooling area for cooling the metal product, means for heating the metal product, means for heating the reducing gas, means for controlling the fluid dynamics of the boundary layer produced by the flow of said reducing gas over the surface of the metal product, means for removing the reaction products front the reducing gas after the reaction, means for cooling the metal product, and means for removing the reaction products from the treated surface of the metal product. | 09-30-2010 |
Alessandra Primavera, Faedis IT
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20100065167 | ANNEALING AND PICKLING PROCESS - A continuous annealing and pickling process of flat cold-rolled products, such as stainless steel strips, to obtain a high surface quality product at high production rates and with a low environmental impact. It comprises the following steps: heating, up to a temperature comprised in the range 650-1050° C., in an atmosphere with an oxygen content comprised in the range from 0.5 to 12%; heating for a time comprised from 10 to 200 sec up to a temperature comprised in the range from 650 to 1200° C. in presence of oxidizing agents and/or inert agents; cooling down to temperatures comprised in the range from 650° C. to ambient tempera in presence of oxidizing agents and/or inert agents; thermochemical or electrolytic descaling and finally possible pickling and/or passivation, by means of the use of pickling baths consisting of mineral acid solutions. | 03-18-2010 |
Anthony A. Primavera, Anoka, MN US
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20090000814 | MULTIPLE LAYER PRINTED CIRCUIT BOARD HAVING MISREGISTRATION TESTING PATTERN - A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the testing. A method of manufacturing a multiple layer board that is configured to facilitate non-destructive testing of layer-to-layer misregistration includes forming an electrical test pattern on a first layer and forming a corresponding electrical test reference on a second layer. Then, a connecting pathway is formed between the test reference and the test pattern, including the first and second layers, with testing for an electrical signal between the test reference and the test pattern determining layer-to-layer misregistration of the first layer with respect to the second layer. | 01-01-2009 |
20100019789 | SYSTEM FOR MULTIPLE LAYER PRINTED CIRCUIT BOARD MISREGISTRATION TESTING - A test apparatus for determining layer-to-layer misregistration of a multiple layer printed circuit board having an electrical test pattern formed on an inner layer and an electrical test reference formed on an outer layer with the reference electrically connected to the pattern. The apparatus includes a holder for the board, an electrical input device that moves into and out of connection with the reference when the board is in the holder, with the input device adapted to provide a signal to the reference, and an electrical output probe configured to move into and out of electrical connection with the pattern when the board is in the holder. The output probe is adapted to receive at least one signal from the pattern when a signal is provided to the reference, such that the signal received by the output probe conveys layer-to-layer misregistration between the inner layer and the outer layer. | 01-28-2010 |
Anthony A. Primavera, Newberg, OR US
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20120151758 | In-Situ Fold-Assisting Frame for Flexible Substrates - A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices. | 06-21-2012 |
20120319288 | Semiconductor Package - A semiconductor package and a carrier for a semiconductor package are provided, the carrier having a top surface and a bottom surface separated by side walls. The carrier includes a seat for a component, and at least one terminal region for electrically connecting the component to the carrier when mounted to the seat, wherein a test portal is arranged at an outer surface of the carrier, and wherein one or more routing paths are arranged in the carrier for routing one or more electrical contacts arranged at the carrier to the test portal. | 12-20-2012 |
20130044448 | Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement - A method for mounting a component to an electric circuit board ( | 02-21-2013 |
20140090243 | In-Situ Fold-Assisting Frame for Flexible Substrates - A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices. | 04-03-2014 |
Michael Primavera, Milford, CT US
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20090248046 | SURGICAL SUTURING APPARATUS WITH MEASUREMENT STRUCTURE - There is disclosed suture manipulating instrumentation having measuring structure to determine the length of suture during a given point in a surgery. The instrument is preferably a surgical suturing instrument capable of manipulating a suture carrying needle at the distal end. The measuring structure in the form of a scale is provided on the suturing instrument at a location remote from the distal end. The length of suture can easily be determined with the use of the scale at any point during a surgery. There is also disclosed a kit for providing the suture measuring structure on other suture manipulating instruments, as well as, methods of using suture manipulating instrumentation haying the disclosed measuring structure. | 10-01-2009 |