Patent application number | Description | Published |
20100034735 | TARGETED NANOPARTICLES FOR CANCER DIAGNOSIS AND TREATMENT - The invention provides modified gold nanoparticles that enable a non-invasive, real time, targeted cancer imaging-therapeutic in one step. After reaching the cancer targets, the designed targeted gold nanoparticles significantly enhance conventional treatment modalities at the cellular level. In this aspect the gold nanoparticles of the invention are modified to be bound to a Positron Emission Tomography (PET) tracer. | 02-11-2010 |
20110189748 | ULTRASOUND ENHANCED GROWTH OF MICROORGANISMS. - A method of increasing the rate of growth, useful product production, or protein expression of a microorganism includes the step of exposing the microorganism to ultrasound having a frequency greater than about 1 MHz. | 08-04-2011 |
20110275054 | ENHANCED ANIMAL CELL GROWTH USING ULTRASOUND - A method of increasing the rate of growth of an animal cell or cell culture include the use of ultrasound at a frequency greater than about 1 MHz. | 11-10-2011 |
20120059287 | ULTRASOUND STIMULATION DEVICES AND TECHNIQUES - Ultrasound stimulation devices and related techniques are disclosed. An ultrasound transducer for generating ultrasound energy is carried by a transducer housing that seals the transducer and may also include a positioning element for positioning the transducer proximate an application area to which generated ultrasound energy is to be applied. The transducer housing may also carry such components as a battery, a wireless receiver, and a controller. The same housing or a separate sensor housing may include an ultrasound sensor that provides feedback to the ultrasound transducer or its controller, illustratively through a wireless transmitter. | 03-08-2012 |
20120100525 | ULTRASOUND ENHANCED GROWTH OF MICROORGANISMS - A method of increasing the rate of growth, useful product production, or protein expression of a microorganism includes the step of exposing the microorganism to ultrasound having a frequency greater than about 1 MHz. | 04-26-2012 |
20120135392 | ULTRASOUND STIMULATION DEVICES AND TECHNIQUES - Ultrasound stimulation devices and related techniques are disclosed. An ultrasound transducer for generating ultrasound energy is carried by a transducer housing that seals the transducer and may also include a positioning element for positioning the transducer proximate an application area to which generated ultrasound energy is to be applied. The transducer housing may also carry such components as a battery, a wireless receiver, and a controller. The same housing or a separate sensor housing may include an ultrasound sensor that provides feedback to the ultrasound transducer or its controller, illustratively through a wireless transmitter. | 05-31-2012 |
20130022957 | ENHANCED ANIMAL CELL GROWTH USING ULTRASOUND - A method of increasing animal cell growth and monoclonal antibody production in an animal cell or cell culture includes the use of ultrasound at a frequency greater than about 1 MHz. | 01-24-2013 |
20130265856 | THERMOACOUSTIC SENSOR - A close-proximity thermoacoustic sensor that can determine radiated ultrasound intensities by directly coupling a transducer via a coupling medium. The sensor captures the beam, converts the ultrasound power into heat, and indirectly measures the spatial average time average ultrasound intensity (I | 10-10-2013 |
Patent application number | Description | Published |
20090287809 | SERVICE BANDWIDTH CONFIGURING METHOD AND NETWORK MANAGEMENT SYSTEM - A service bandwidth configuring method of is provided by this invention, which includes the following steps: defining various kinds of service classes according to the characteristics of various services provided by a network system; defining various kinds of bandwidth specifications of the network system; establishing the mapping relationships between the various kinds of service classes and various kinds of bandwidth specifications; and configuring the service bandwidth of the network system with the mapping relationships. Besides, this invention also provides a network management system. This invention is intended to be applied to the interfaces between NMS and EMS, or interfaces between EMS and NE, and it facilitates the intercommunication between the network management systems of different manufacturers, and the unified management on network management system or devices from different manufacturers by the upper layer network management system. | 11-19-2009 |
20130029705 | METHOD AND APPARATUS FOR IMPLEMENTING NETWORK COGNITION - The present invention discloses a method and an apparatus for implementing network cognition. The method includes: determining a type of a received network task; according to the type of the received network task, selecting at least one cognitive capability identifier corresponding to the type of the network task; using network devices with the at least one cognitive capability identifier as alternative network devices; determining an alternative network device that is among the alternative network devices and has a cognitive capability that meets a condition for performing the network task is a target network device; and controlling the target network device to perform the network task. | 01-31-2013 |
20130120121 | Radio frequency identification control device, system and method - The disclosure provides a Radio Frequency Identification (RFID) control device, system and method. The RFID control device includes a base station controller ( | 05-16-2013 |
20130223403 | METHOD, DEVICE, AND SYSTEM FOR OPTIMIZING RADIO NETWORK - The present invention provides a method, a device, and a system for optimizing a radio network. The method provided in the present invention includes: recognizing a terminal that needs optimization processing; according to a degree of influencing a network handover performance indicator or network load performance indicator by each terminal that needs optimization processing, performing handover priority sorting on the terminal that needs optimization processing to obtain a sorted handover priority result; according to the sorted handover priority result, and based on a configuration rule that a smaller handover parameter value is configured for a terminal with a higher handover priority, configuring a handover parameter for the terminal that needs optimization processing; and sending the handover parameter to a corresponding terminal. | 08-29-2013 |
20130316477 | Method for Manufacturing Liquid Crystal Display Device - The present invention provides a method for manufacturing a liquid crystal display device, which includes (1) providing a substrate; (2) forming a black matrix on a surface of the substrate; (3) sequentially forming R, G, B on the surface of the substrate; (4) forming spacers on the surface of the substrate and at the same time forming supports, the supports being arranged to correspond to a site where an enclosing frame is to be set; and (5) coating sealant on the site of the surface of the substrates where the enclosing frame is to be set to form the enclosing frame thereby forming the CF substrate. The spacers and the supports are simultaneously formed on a substrate through masking operation so that box thickness between a TFT substrate and a CF substrate can be supported by the supports. | 11-28-2013 |
20130316480 | Method for Manufacturing Liquid Crystal Display Device - The present invention provides a method for manufacturing liquid crystal display device, which includes (1) providing a substrate and (2) forming a black matrix on a surface of the substrate and at the same time forming support structures, wherein the support structures are arranged to correspond to the site where an enclosing frame is to be set. The method for manufacturing liquid crystal display device of the present invention forms, simultaneously with a process of forming black matrix, support structures to support box thickness so that the conventional process of adding fibers in sealant to support the box thickness used in the known techniques is replaced. The manufacture process is simplified, while labor deployment is reduced and manufacture cost is lowered down. | 11-28-2013 |
20140089554 | UNIVERSAL SERIAL BUS SIGNAL TEST DEVICE - A universal serial bus (USB) signal test device includes a printed circuit board. A first connector, a second connector, and a number of USB hub integrated circuit (ICs) are arranged on the printed circuit board. The USB hub ICs are connected in series. A USB signal is passed through the USB hub ICs and an auxiliary test device in that order. The USB signals are measured with an oscilloscope after being passed through the USB hub ICs and the auxiliary test device. | 03-27-2014 |
20140162765 | ONLINE TRADING OF VIRTUAL CHARACTERS - Automatic trading of virtual characters in online applications comprises publishing virtual characters by a first user in a trading system that involves verification at an application server and locking of the selected virtual characters at the application server. This can ensure that the trading of virtual characters is true, reliable and prompt, and reduces the loss to users arising from the trading of virtual characters. | 06-12-2014 |
20140372838 | Bad disk block self-detection method and apparatus, and computer storage medium - It is described a bad disk block self-detection method, including: each mounted chunk is partitioned into n sub-chunks, all sub-chunks having a same size, where n is an integer not less than 2; checking information is set at a fixed location of each sub-chunk, data is stored onto locations of each sub-chunk other than the fixed location, where the checking information is parity checking information for the data; and when the data is read or written, data verification is performed based on the checking information set at the fixed location of the read sub-chunk. It is also described a bad disk block self-detection apparatus and a computer storage medium. With the described above, the bad block on the disk can be detected rapidly, and it is able to instruct data migration and disk replacement. | 12-18-2014 |
20150074992 | REMOVAL DEVICE - A removal device includes a wrench part, a handle part, and a thrust control apparatus. The wrench part and the handle part are in a split structure. The wrench part is rotatably connected to a daughter-board panel, and the wrench part is rotatably connected to the handle part. The wrench part includes a bayonet end and a wrench connecting end. A bayonet is provided on the bayonet end, and the bayonet is clamped on the subrack. The handle part includes a handle connecting end and a handle end. A thrust control apparatus is disposed at a junction between the wrench connecting end and the handle connecting end. The thrust control apparatus is configured to restrict motion of the handle part relative to the wrench part, and control maximum thrust when force is applied to the handle end. | 03-19-2015 |
20150312617 | Method, apparatus and system for controlling focus on TV interface - Provided are a method, apparatus and system for controlling a focus on a television interface. The method includes that a remote control device generates a movement event and a corresponding movement path and notifies a TV controller, and the TV controller determines the location of a moved focus according to the movement event and the movement path. Through the technology for controlling a focus on a television interface, a button can be pressed for reduced times, the focus can be controlled in any direction conveniently, quickly and flexibly, and the user experience can be improved effectively. | 10-29-2015 |
20150363850 | METHOD FOR PROCESSING ORDER, TRANSACTION SERVER AND COMPUTER READABLE STORAGE MEDIUM - The present disclosure provides a method for processing a transaction order of virtual resources. The order for the virtual resources is received by a server from a first client, and the order records a specified quantity of the virtual resources to be purchased. All commodities including the virtual resources offered for sale are acquired from a database of a transaction system. All the commodities are traversed to select a commodity combination matching the specified quantity. The commodity combination comprises one or more of the commodities. A corresponding suborder is generated for each commodity in the selected commodity combination. The suborder is processed according to demand. Also provided are a transaction server and a computer readable storage medium. | 12-17-2015 |
20160105993 | Air Deflection System - An air deflection system includes a cabinet, where an air vent is disposed on a side of the cabinet, the air vent is located in a lower part of the side, an air vent is disposed at the top of the cabinet, and the cabinet is provided with a side for cool air to enter; and further includes at least one air deflection cabinet, where an air vent is disposed at the top of the air deflection cabinet, the air-vent-disposed side of the air deflection cabinet clings to the air-vent-disposed side of the cabinet, and the side air vent of the air deflection cabinet is in communication with the side air vent of the cabinet. By means of the air deflection system, bottom warm air is exhausted from the top, which improves efficiency of warm air processing of an equipment room. | 04-14-2016 |
Patent application number | Description | Published |
20080216500 | SYSTEM AND METHOD FOR CONTROLLING AN AIR CONDITIONER OR HEAT PUMP - A control procedure operates an expansion valve of an air conditioning system. The control procedure utilizes a first control procedure to bring a calculated superheat value within a range of a target superheat value, and a second control procedure to cause the calculated superheat value to match the target superheat value. Both the first and second control procedures preferably use Proportional, Integral, Derivative control algorithms. | 09-11-2008 |
20090084131 | Air Conditioning Units with Modular Heat Exchangers, Inventories, Buildings, and Methods - Air conditioning units, methods of manufacturing, inventories, and buildings wherein certain heat exchanger modules are combined to make air conditioning units. In some embodiments, different combinations of different size modules are used to produce air conditioning units having different capacities wherein some identical modules are used in different size units. Various heat exchanger assemblies include spacers between modules, bends formed after modules are assembled into heat exchanger assemblies, attachment rails at the ends of the modules, inactive multi-tubes at the top and bottom of the modules, copper tubing between aluminum modules to facilitate field replacement of individual modules, name plates that attach between modules, attachment clips or spacers that snap attach to the modules, or a combination thereof, as examples. | 04-02-2009 |
20120090337 | Heat Pumps With Unequal Cooling and Heating Capacities for Climates Where Demand for Cooling and Heating are Unequal, and Method of Adapting and Distributing Such Heat Pumps - Heat pumps for climates where demand for cooling and heating are unequal and methods of adapting and distributing heat pumps for such climates. Heat pumps include a compressor, compressor motor, variable-speed drive, and controller. In a number of embodiments, non-volatile memory stores sets of constant speeds for cooling and heating, and a person can select, via an input device, different sets of speeds for cooling and heating to provide the different cooling and heating capacities. The controller then operates the unit at the selected speeds, selecting from within the set based on demand for cooling or heating. In some embodiments, different sets of speeds may have the same minimum speed but different maximum speeds. Identical heat pumps can be configured to have different capacity ratings and different advertized efficiencies for different climates. | 04-19-2012 |
20130160985 | REFRIGERANT CHARGE MANAGEMENT IN A HEAT PUMP WATER HEATER - Heat pumps that heat or cool a space and that also heat water, refrigerant management systems for such heat pumps, methods of managing refrigerant charge, and methods for heating and cooling a space and for heating water. Various embodiments deliver refrigerant gas to a heat exchanger that is not needed for transferring heat, drive liquid refrigerant out of that heat exchanger, isolate that heat exchanger against additional refrigerant flowing into it, and operate the heat pump while the heat exchanger is isolated. The heat exchanger can be isolated by closing an electronic expansion valve, actuating a refrigerant management valve, or both. Refrigerant charge can be controlled or adjusted by controlling how much liquid refrigerant is driven from the heat exchanger, by letting refrigerant back into the heat exchanger, or both. Heat pumps can be operated in different modes of operation, and segments of refrigerant conduit can be interconnected with various components. | 06-27-2013 |
20130312436 | HEAT PUMP WITH IMPROVED DEFROST CYCLE AND METHOD OF DEFROSTING A HEAT EXCHANGER - Heat pumps with improved defrost cycles, methods of defrosting heat exchangers, and methods of improving the effectiveness of defrost cycles of heat pumps, for example, having a microchannel outdoor heat exchanger. A defrost valve in a refrigerant conduit opens during a defrost cycle to deliver hot refrigerant gas to a portion of the heat exchanger that otherwise defrosts more slowly or less completely than other portions of the heat exchanger. Particular embodiments pass hot refrigerant gas through a header of the heat exchanger, such as a bottom header. In a number of embodiments, the defrost valve is open only during a portion of the defrost cycle. Further, in some embodiments, the fan that is used to blow air through the heat exchanger is operated in a reversed direction during at least part of the defrost cycle to counteract natural convection through the heat exchanger. | 11-28-2013 |
20140026601 | Defrosting A Heat Exchanger In A Heat Pump By Diverting Warm Refrigerant To An Exhaust Header - Heat pumps with improved defrost cycles and methods of defrosting heat exchangers, for example, having microchannel outdoor heat exchangers. A heat exchanger has three types of connection points that are used during a defrost cycle. Two connection points are used to deliver hot refrigerant gas to the heat exchanger and one connection point is where refrigerant exits the heat exchanger. Two of the connection points are at the same header and during at least part of the defrost cycle, at least part of the hot refrigerant gas is passed through that header without passing through any cross tubes of the heat exchanger. A defrost valve in a refrigerant conduit opens during the defrost cycle to deliver hot refrigerant gas to the connection point on the header. In a number of embodiments, the defrost valve is open only during a portion of the defrost cycle. | 01-30-2014 |
20140196484 | Defrosting A Heat Exchanger In A Heat Pump By Diverting Warm Refrigerant To An Exhaust Header - Heat pumps with improved defrost cycles and methods of defrosting heat exchangers, for example, having microchannel outdoor heat exchangers. A heat exchanger has three types of connection points that are used during a defrost cycle. Two connection points are used to deliver hot refrigerant gas to the heat exchanger and one connection point is where refrigerant exits the heat exchanger. Two of the connection points are at the same header and during at least part of the defrost cycle, at least part of the hot refrigerant gas is passed through that header without passing through any cross tubes of the heat exchanger. A defrost valve in a refrigerant conduit opens during the defrost cycle to deliver hot refrigerant gas to the connection point on the header. In a number of embodiments, the defrost valve is open only during a portion of the defrost cycle. | 07-17-2014 |
20140245770 | REFRIGERANT CHARGE MANAGEMENT IN A HEAT PUMP WATER HEATER - Heat pumps that heat or cool a space and that also heat water, refrigerant management systems for such heat pumps, and methods of managing refrigerant charge. Various embodiments remove idle refrigerant from a heat exchanger that is not needed for transferring heat by opening a refrigerant recovery valve and delivering the idle refrigerant from the heat exchanger to an inlet port on the compressor. The heat exchanger can be isolated by closing an electronic expansion valve, actuating a refrigerant management valve, or both. Refrigerant charge can be controlled by controlling how much refrigerant is drawn from the heat exchanger, by letting some refrigerant back into the heat exchanger, or both. Heat pumps can be operated in different modes of operation, and various components can be interconnected with refrigerant conduit. Some embodiments deliver refrigerant gas to the heat exchanger and drive liquid refrigerant out prior to isolating the heat exchanger. | 09-04-2014 |
20150276104 | TUBING JOINT - A method of joining two tubular sections including applying adhesive to a male end of a first tubular section and fitting the male end to a female end of a second tubular section. A clamp is positioned over the female end of the second tubular section and tightened to apply a circumferential inward force to the female end to reinforce the adhesive in securing the first tubular section to the second tubular section. | 10-01-2015 |
Patent application number | Description | Published |
20110109416 | INDUCTOR OF CIRCUIT BOARD - An exemplary inductor of a circuit board includes a base portion of the circuit board, a plurality of through holes defined in two opposite sides of the base portion and a conductive wiring passing through the through holes and wrapping the base portion. The inductor arranged in the circuit board allows height of the printed circuit board to be minimized. | 05-12-2011 |
20140295739 | METHOD FOR POLISHING EDGE OF GLASS SUBSTRATE OF DISPLAY PANEL - The present invention provides a method for polishing edge of glass substrate of display panel, which includes (1) conveying a glass substrate of a display panel to be polished to a polishing device and positioning the glass substrate for being subsequently polished by a grindstone of the polishing device; (2) providing first and second stop boards; (3) moving the first stop board to contact an upper surface of the glass substrate and moving the second stop board to contact a lower surface of the glass substrate; and (4) carrying out an edge polishing operation. By arranging the stop boards between the polished area and the non-polished area of the glass substrate, the glass chips generated during the polishing operation are prevented from flying and attaching to the surfaces of the non-polished area of the glass substrate during the polishing operation. | 10-02-2014 |
20140315598 | ELECTRONIC DEVICE - Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same. | 10-23-2014 |
20140317071 | METHOD AND DEVICE FOR TRANSFERRING FILE - The disclosed invention relates generally to a method and device for transferring a file. In accordance with one embodiment, the method may include, receiving a file transfer request including information of a file and the file receiver; separating the file into multiple file segments; pushing the multiple file segments to the file receiver; if receiving a retransfer request sent by the file receiver, pushing the file segment assigned by the retransfer request to the file receiver; if receiving an acknowledgement sent by the file receiver, ending the file transferring, the acknowledgement indicating all of the multiple file segments being received by the file receiver. The method and device provided in the disclosed embodiments can transfer file more reliable. | 10-23-2014 |
20140351376 | CONTENT DISTRIBUTION METHOD, SYSTEM AND SERVER - The present invention discloses a content distribution method, system and a server. In one embodiment, the method includes: receiving a content distribution request form a client; obtaining all receiving ends designated by the content distribution request, and marking at least a portion of the receiving ends with a first status code; judging whether all the at least a portion of the receiving ends complete the distribution task, if not, controlling an internal distribution process until all the at least a portion of the receiving ends complete the distribution task. | 11-27-2014 |
20140365824 | METHOD FOR RECOVERING HARD DISK DATA, SERVER AND DISTRIBUTED STORAGE SYSTEM - A method for recovering hard disk data, a server and a distributed storage system relate to a computer technology. In the method, a data recovery request is received. The request includes at least one ID of sectors whose data is to be recovered. Based on the at least one ID of the sectors whose data is to be recovered, at least one sector whose data is to be recovered is located. Obtain at least one standby sector ID and a file backup corresponding to the at least one ID of the sectors whose data is to be recovered, and locate at least one standby sector based on the at least one standby sector ID. Write, into the at least one standby sector, data that is in the file backup and the same as the data stored in the at least one sector whose data is to be recovered. | 12-11-2014 |
Patent application number | Description | Published |
20110222528 | METHODS, SYSTEMS, AND APPARATUS TO SYNCHRONIZE ACTIONS OF AUDIO SOURCE MONITORS - Systems, methods, articles of manufacture and apparatus are disclosed to align actions of audio source monitors. An example method disclosed herein includes invoking an audience monitor to transmit a radio frequency (RF) initialization packet to a base unit, receiving an indication that the base unit has received the RF initialization packet at a first time, and invoking the base unit to transmit an RF acknowledgement packet to the audience monitor. The example method also includes receiving an indication that the RF acknowledgement packet is received by the audience monitor and waiting for an end to a delay period having a first value, identifying whether the audience monitor has finished processing the RF acknowledgement packet when the delay period ends at a second time, and incrementing the delay period to a second value when the audience monitor is still processing the RF acknowledgement packet and the delay period has ended. | 09-15-2011 |
20120148058 | METHODS AND APPARATUS TO DETERMINE LOCATIONS OF AUDIENCE MEMBERS - A disclosed example method to determine a location of an audience member involves generating a correlation analysis result based on correlating first audio samples from a stationary audio detector with second audio samples from a portable audio detector carried by the audience member and determining via a neural network the location of the audience member based on the correlation analysis result. | 06-14-2012 |
20140109122 | METHODS, SYSTEMS, AND APPARATUS TO SYNCHRONIZE ACTIONS OF AUDIO SOURCE MONITORS - Systems, methods, articles of manufacture and apparatus are disclosed to align actions of audio source monitors. An example method disclosed herein includes invoking an audience monitor to transmit a radio frequency (RF) initialization packet to a base unit, receiving an indication that the base unit has received the RF initialization packet at a first time, and invoking the base unit to transmit an RF acknowledgement packet to the audience monitor. The example method also includes receiving an indication that the RF acknowledgement packet is received by the audience monitor and waiting for an end to a delay period having a first value, identifying whether the audience monitor has finished processing the RF acknowledgement packet when the delay period ends at a second time, and incrementing the delay period to a second value when the audience monitor is still processing the RF acknowledgement packet and the delay period has ended. | 04-17-2014 |
20150052541 | METHODS AND APPARATUS TO DETERMINE LOCATIONS OF AUDIENCE MEMBERS - A disclosed example method involves determining, using a neural network at a stationary unit, a first distance of a first portable audio detector from the stationary unit, the first portable audio detector associated with a first panelist, the stationary unit located in proximity to the media presentation device. The example method also involves determining, using the neural network, a second distance of a second portable audio detector from the stationary unit, the second portable audio detector associated with a second panelist. In response to the first distance being less than a threshold distance, the media is credited as exposed to the first panelist. In response to the second distance being more than the threshold distance, the media is not credited as exposed to the second panelist. | 02-19-2015 |
20150199737 | Method for Selling Electronic Books - A method of selling a plurality of books through a website is executed through a plurality of free chapters and a plurality of buyable chapter of each of the books, where the user account can select a specific book from the books. While the free chapters are displayed to the user account without any payment, the user accounts have to pay a variable fee for each of the buyable chapters, where the variable fee is calculated with a word count and a predetermined price. A price index of the specific book is calculated in order to compute a final price for the specific book along with the variable fees for each of the buyable chapters. The final price credits a refund to the user account of the specific book, if the total variable fee for each of the payable chapters is higher than the final price. | 07-16-2015 |
Patent application number | Description | Published |
20120008331 | Light Fixtures Comprising an Enclosure and a Heat Sink - Light fixtures including at least an enclosure, a heat sink, and a light-emitting diode. In one embodiment the heat sink has a first portion having fins (that protrudes outside of the enclosure) and a second portion to house and mount the LEDs (that is positioned within the enclosure). Certain embodiments also provide for gaskets and other structure to prevent leakage between the heat sink and the enclosure, such that the light fixture is water-resistant. Thus, embodiments of the light fixture may house LEDs and related electric components inside a water-resistant enclosure and cool those components by transferring thermal energy to the surrounding air. | 01-12-2012 |
20120206912 | Luminaires and Light Engines for Same - Light engines for inclusion in luminaires. Some embodiments of the light engine include a heat sink, a reflector, and light emitting diodes. Some embodiments of the heat sink include perforations. The reflector includes a reflective surface that extends around at least a portion of the light emitting diodes. In some embodiments, a portion of the reflector is sandwiched between the light emitting diodes and the heat sink. In some embodiments, an end of the reflector terminates above the light emitting diodes to reduce the concentration of light directly above the light emitting diodes but rather distribute the light outwardly from the luminaire. | 08-16-2012 |
20140265873 | Veiling Zone Control - Embodiments of the invention include a luminaire that includes a plurality of different light engines. Light engines having different light distributions can be included in a single luminaire and a subset of the light engines selectively driven to dynamically change the light distribution of the luminaire. In this way, a single luminaire is capable of illuminating an area with a variety of different light distributions. | 09-18-2014 |
20140265874 | Adaptive Optical Distribution System - Embodiments of the invention include a luminaire that includes a plurality of different light engines. Light engines having different light distributions can be included in a single luminaire and a subset of the light engines selectively driven to dynamically change the light distribution of the luminaire. In this way, a single luminaire is capable of illuminating an area with a variety of different light distributions. | 09-18-2014 |
20140268810 | Optic for a Light Source - Certain embodiments of the present invention provide an optic over a light source, such as, but not limited to, an LED, whereby the optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. | 09-18-2014 |
20140268811 | Led Assembly Having A Refractor That Provides Improved Light Control - An LED assembly that includes optics and optical arrangements for light emitting diodes (LEDs). In some embodiments, a reflector is provided within a void between the lens and the LED. This reflector can reflect light emitted by the LED in a non-preferred direction back toward the preferred direction. In other embodiments, an optical element is formed or otherwise provided in the lens cavity and shaped so that, when the lens is positioned above the LED, the refractor bends the emitted light in a preferred direction. In some embodiments, both a reflector and optical element are provided in the LED assembly to control the directionality of the emitted light. Such embodiments of the invention can be used to increase the efficiency of an LED by ensuring that generated light is being directed to the target area of choice. | 09-18-2014 |
20140268812 | Led Assembly Having a Reflector That Provides Improved Light Control - An LED assembly that includes optics and optical arrangements for light emitting diodes (LEDs). In some embodiments, a reflector is provided within a void between the lens and the LED. This reflector can reflect light emitted by the LED in a non-preferred direction back toward the preferred direction. In other embodiments, an optical element is formed or otherwise provided in the lens cavity and shaped so that, when the lens is positioned above the LED, the refractor bends the emitted light in a preferred direction. In some embodiments, both a reflector and optical element are provided in the LED assembly to control the directionality of the emitted light. Such embodiments of the invention can be used to increase the efficiency of an LED by ensuring that generated light is being directed to the target area of choice. | 09-18-2014 |
20140313718 | EXTERNALLY MOUNTED SHIELD FOR LED LUMINAIRE - A shield for a light emitting diode (LED) luminaire includes a frame mountable to the LED luminaire such that the shield is removable therefrom. A plurality of rows of shield surfaces contact the frame and have a first side that faces a row of LEDs located on the LED luminaire and an opposite second side. The first side has a fully or partially reflective surface. The plurality of rows of shield surfaces prevent light from the LEDs from reflecting toward the back of the LED luminaire. The shield may include notches for allowing removal of one or more of the plurality of rows of shield surfaces or a portion thereof from the frame and for customization of light distribution from the LED luminaire. The shield may also be cut lengthwise such that each of the plurality of rows of shield surfaces includes a partial shield surface and shields only a portion of a row of LEDs located on the LED luminaire. | 10-23-2014 |
20150226404 | LED ASSEMBLY HAVING A REFRACTOR THAT PROVIDES IMPROVED LIGHT CONTROL - An LED assembly that includes optics and optical arrangements for light emitting diodes (LEDs). In some embodiments, a reflector is provided within a void between the lens and the LED. This reflector can reflect light emitted by the LED in a non-preferred direction back toward the preferred direction. In other embodiments, an optical element is formed or otherwise provided in the lens cavity and shaped so that, when the lens is positioned above the LED, the refractor bends the emitted light in a preferred direction. In some embodiments, both a reflector and optical element are provided in the LED assembly to control the directionality of the emitted light. Such embodiments of the invention can be used to increase the efficiency of an LED by ensuring that generated light is being directed to the target area of choice. | 08-13-2015 |
20150283768 | SILICONE OPTICS - Silicone-containing light fixture optics. A method for manufacturing an optical component may include mixing two precursors of silicone, opening a first gate of an optic forming device, moving the silicone mixture from the extrusion machine into the optic forming device, cooling the silicone mixture as it enters the optic forming device, filling a mold within the optic forming device with the silicone mixture, closing the first gate, and heating the silicone mixture in the mold to at least partially cure the silicone. Alternatively, a method for manufacturing an optical component may include depositing a layer of heat cured silicone optical material to an optical structure, arranging one or more at least partially cured silicone optics on the layer of heat cured silicone optical material, and heating the heat cured silicone optical material to permanently adhere the one or more at least partially cured silicone optics to the optical structure. | 10-08-2015 |
20160037612 | ADAPTIVE OPTICAL DISTRIBUTION SYSTEM - Embodiments of the invention include a luminaire that includes a plurality of different light engines. Light engines having different light distributions can be included in a single luminaire and a subset of the light engines selectively driven to dynamically change the light distribution of the luminaire. In this way, a single luminaire is capable of illuminating an area with a variety of different light distributions. | 02-04-2016 |
Patent application number | Description | Published |
20120070029 | USING CAMERA SIGNATURES FROM UPLOADED IMAGES TO AUTHENTICATE USERS OF AN ONLINE SYSTEM - Users of an online system are authenticated based on signatures of cameras that were used to capture images uploaded to the online system. Users of an online system upload photos taken from their cameras. The online system extracts characteristic information about the camera that captured the photos. This information includes a mapping of faulty pixels, metadata included with the photos, a naming convention, and the like. The online system stores an association between the user and the camera. This association is used for authentication of the user. For authentication, the user is asked to upload new photos taken from the camera that the user used previously. The information extracted from the newly uploaded photos is matched against stored information of cameras used previously by the user. The user is successfully authenticated if the camera used for the newly uploaded photos matches a previously stored camera. | 03-22-2012 |
20120072493 | ASSOCIATING CAMERAS WITH USERS OF A SOCIAL NETWORKING SYSTEM - Images uploaded by users of a social networking system are analyzed to determine signatures of cameras used to capture the images. A camera signature comprises features extracted from images that characterize the camera used for capturing the image, for example, faulty pixel positions in the camera and metadata available in files storing the images. Associations between users and cameras are inferred based on actions relating users with the cameras, for example, users uploading images, users being tagged in images captured with a camera, and the like. Associations between users of the social networking system related via cameras are inferred. These associations are used beneficially for the social networking system, for example, for recommending potential connections to a user, recommending events and groups to users, identifying multiple user accounts created by the same user, detecting fraudulent accounts, and determining affinity between users. | 03-22-2012 |
20130011007 | USING CAMERA SIGNATURES FROM UPLOADED IMAGES TO AUTHENTICATE USERS OF AN ONLINE SYSTEM - Users of an online system are authenticated based on signatures of cameras that were used to capture images uploaded to the online system. Users of an online system upload photos taken from their cameras. The online system extracts characteristic information about the camera that captured the photos. This information includes a mapping of faulty pixels, metadata included with the photos, a naming convention, and the like. The online system stores an association between the user and the camera. This association is used for authentication of the user. For authentication, the user is asked to upload new photos taken from the camera that the user used previously. The information extracted from the newly uploaded photos is matched against stored information of cameras used previously by the user. The user is successfully authenticated if the camera used for the newly uploaded photos matches a previously stored camera. | 01-10-2013 |
20130282821 | ASSOCIATING CAMERAS WITH USERS AND OBJECTS IN A SOCIAL NETWORKING SYSTEM - Images uploaded by users of a social networking system are analyzed to determine signatures of cameras used to capture the images. A camera signature comprises features extracted from images that characterize the camera used for capturing the image, for example, faulty pixel positions in the camera and metadata available in files storing the images. Associations between users and cameras are inferred based on actions relating users with the cameras, for example, users uploading images, users being tagged in images captured with a camera, and the like. Associations between users of the social networking system related via cameras are inferred. These associations are used beneficially for the social networking system, for example, for recommending potential connections to a user, recommending events and groups to users, identifying multiple user accounts created by the same user, detecting fraudulent accounts, and determining affinity between users. | 10-24-2013 |
20140328542 | ASSOCIATING CAMERAS WITH USERS AND OBJECTS IN A SOCIAL NETWORKING SYSTEM - Images uploaded by users of a social networking system are analyzed to determine signatures of cameras used to capture the images. A camera signature comprises features extracted from images that characterize the camera used for capturing the image, for example, faulty pixel positions in the camera and metadata available in files storing the images. Associations between users and cameras are inferred based on actions relating users with the cameras, for example, users uploading images, users being tagged in images captured with a camera, and the like. Associations between users of the social networking system related via cameras are inferred. These associations are used beneficially for the social networking system, for example, for recommending potential connections to a user, recommending events and groups to users, identifying multiple user accounts created by the same user, detecting fraudulent accounts, and determining affinity between users. | 11-06-2014 |
20150124107 | ASSOCIATING CAMERAS WITH USERS AND OBJECTS IN A SOCIAL NETWORKING SYSTEM - Images uploaded by users of a social networking system are analyzed to determine signatures of cameras used to capture the images. A camera signature comprises features extracted from images that characterize the camera used for capturing the image, for example, faulty pixel positions in the camera and metadata available in files storing the images. Associations between users and cameras are inferred based on actions relating users with the cameras, for example, users uploading images, users being tagged in images captured with a camera, and the like. Associations between users of the social networking system related via cameras are inferred. These associations are used beneficially for the social networking system, for example, for recommending potential connections to a user, recommending events and groups to users, identifying multiple user accounts created by the same user, detecting fraudulent accounts, and determining affinity between users. | 05-07-2015 |
Patent application number | Description | Published |
20120142653 | C-28 AMIDES OF MODIFIED C-3 BETULINIC ACID DERIVATIVES AS HIV MATURATION INHIBITORS - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, modified C-3 and C-28 betulinic acid derivatives that possess unique antiviral activity are provided as HIV maturation inhibitors. These compounds are useful for the treatment of HIV and AIDS. | 06-07-2012 |
20120142707 | MODIFIED C-3 BETULINIC ACID DERIVATIVES AS HIV MATURATION INHIBITORS - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, modified C-3 betulinic acid and other structurally related natural products derivatives that possess unique antiviral activity are provided as HIV maturation inhibitors. These compounds are useful for the treatment of HIV and AIDS. | 06-07-2012 |
20130029954 | C-28 AMINES OF C-3 MODIFIED BETULINIC ACID DERIVATIVES AS HIV MATURATION INHIBITORS - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-28 amines of C-3 modified betulinic acid derivatives that possess unique antiviral activity are provided as HIV maturation inhibitors. These compounds are useful for the treatment of HIV and AIDS. In particular, the following compounds are provided herein, including pharmaceutically acceptable salts thereof: | 01-31-2013 |
20130035318 | C-17 AND C-3 MODIFIED TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-17 and C-3 modified triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II and III: | 02-07-2013 |
20130210787 | C-3 CYCLOALKENYL TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-3 cycloalkenyl triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II, III and IV: | 08-15-2013 |
20130296554 | C-17 BICYCLIC AMINES OF TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-17 bicyclic amines of triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II and III: | 11-07-2013 |
20130337829 | GEOGRAPHIC REDUNDANCY DETERMINATION FOR TIME BASED LOCATION INFORMATION IN A WIRELESS RADIO NETWORK - Determining levels of geographic redundancy among radios of a wireless radio network is described. The level of geographic redundancy for a radio can affect the determination of location information for a user equipment (UE) on the wireless radio network. The disclosed subject matter can be employed in conjunction with timed fingerprint location (TFL) technologies to facilitate selection of radios employed in determining time values for TFL location determination. Levels of geographic redundancy can be employed to rank or order radios of a wireless radio network so as to reduce the likelihood of using geographically redundant radios in location determination. Further, rules can be selected to adjust threshold values and equations employed in determining the levels of geographic redundancy. Moreover, rules can be selected to apply boundary conditions to reduce the number of determinations formed for a set of radios of the wireless radio network. | 12-19-2013 |
20140243298 | C-3 ALKYL AND ALKENYL MODIFIED BETULINIC ACID DERIVATIVES - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, alkyl and alkenyl C-3 modified betulinic acid derivatives that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II, III and IV: | 08-28-2014 |
20140343000 | COMPOSITIONS HAVING C-17 AND C-3 MODIFIED TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-17 and C-3 modified triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II and III: | 11-20-2014 |
20150291655 | TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formula I: | 10-15-2015 |
Patent application number | Description | Published |
20120238316 | MOBILE PHONE AND COMMUNICATION SYSTEM SWITCHING METHOD - A mobile phone includes two different communication systems and a current table storing relationship between signal transmission power and current in relation to the two different communication systems. The mobile phone obtains two received signal strength indications (RSSI) in relation to the two different communication systems if the mobile phone requires the voice call service, and then calculates two signal transmission power in relation to the two communication system according to the two RSSI. The mobile phone searches a current table to obtain two current according to the two signal transmission power. The mobile phone compares the two current to select one of the two communication systems which needs a smaller one of the two current to provide the voice call service. | 09-20-2012 |
20140291764 | ESD PROTECTION STRUCTURE AND ESD PROTECTION CIRCUIT - An electrostatic discharge (ESD) protection structure and an ESD protection circuit are provided. A PMOS transistor is located in a first region of a first N-type well region of a semiconductor substrate. A first doped base region located in a second region of a first N-type well region is N-type doped and connected to an external trigger-voltage adjustment circuit. An NMOS transistor is located in a third region of a first P-type well region. Second doped base regions discretely located in a fourth region of a first P-type well region are P-type doped and connected to the external trigger-voltage adjustment circuit. A first N-region is located in the fourth region, surrounding the second doped base regions, and connected to the I/O interface terminal. A second N-region is located in the fourth region, surrounding the first N-region and the second doped base regions, and connected to the ground terminal. | 10-02-2014 |
20140291765 | ESD PROTECTION STRUCTURE AND ESD PROTECTION CIRCUIT - An electrostatic discharge (ESD) protection structure and an ESD protection circuit are provided. A PMOS transistor is located in a first region of a first N-type well region of a semiconductor substrate. A first doped base region located in a second region of a first N-type well region is N-type doped and connected to an external trigger-voltage adjustment circuit. An NMOS transistor is located in a third region of a first P-type well region. A second doped base region located in the fourth region of the first P-type well region is P-type doped and connected to the external trigger-voltage adjustment circuit. The external trigger-voltage adjustment circuit can be configured to pull up an electric potential of the second doped base region when the power supply terminal generates an instantaneous electric potential difference. | 10-02-2014 |
20140339614 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME - The present invention provides an image sensor and a method of fabricating the same. The image sensor comprises a semiconductor substrate, a photosensitive component, and a pixel-readout circuit, characterized in that, the semiconductor substrate comprises a supporting substrate, a first insulating buried layer, a first semiconductor layer, a second insulating buried layer, and a second semiconductor layer covered on the semiconductor substrate in sequence; the first semiconductor layer and the second semiconductor layer have different thicknesses, such that the photosensitive component is in the thicker semiconductor layer, and the pixel-readout circuit is in the thinner semiconductor layer. To realize the image sensor mentioned above, two different methods are provided. Ion implantation and bonding method are used respectively to provide the first and second insulating buried layers, and the first and second semiconductor layer substrates, and then the image sensor is fabricated. The image sensor in the present invention has a well anti-radiation character and a well semiconductor character, and a photosensitive zone that has higher light absorption rate. | 11-20-2014 |
20150015731 | APPARATUS AND METHOD TO REDUCE PTZ LATENCY - An apparatus, system, and method to reduce PTZ latency are provided. The system can include an input port and a motor driver unit, and the input port can receive a PTZ request. The input port can transmit the PTZ request to the motor driver unit, and the motor driver unit can extract a PTZ command from the PTZ request. In some embodiments, the PTZ request can obviate transmission through a parser and a processor. | 01-15-2015 |
20150137881 | High-Voltage-Tolerant Pull-Up Resistor Circuit - A pull-up resistor circuit is provided for an IC, including a voltage source, a voltage output for providing a first voltage to supply power for providing a second voltage for an input/output (I/O) port of the IC, a first PMOS transistor, a second PMOS transistor and a control signal generator. The first PMOS transistor and the second PMOS transistor are connected in series to provide pull-up resistance, where the first PMOS transistor is coupled to a first control signal to control a pull-up function of the pull-up resistor circuit in a normal mode. Further, the control signal generator is for generating a second control signal coupled to the second PMOS transistor to control a bias voltage of the pull-up resistor circuit to prevent a reverse current from the voltage output to the voltage source under a high-voltage-tolerant mode when the second voltage is higher than the first voltage. | 05-21-2015 |
20150252391 | METHOD USING MICROALGAE FOR HIGH-EFFICIENCY PRODUCTION OF ASTAXANTHIN - The present invention relates to a novel method for producing astaxanthin by using microalgae. The method comprises: heterotrophic cultivation of microalgae, dilution, photo-induction, collection of microalgal cells, and extraction of astaxanthin. The method according to the present invention takes full advantages of rapid growth rate in the heterotrophic stage and fast accumulation of astaxanthin in the photo-induction stage by using a large amount of microalgal cells obtained in the heterotrophic cultivation stage, so as to greatly improve the astaxanthin production rate and thereby achieve low cost, high efficiency, large scale production of astaxanthin by using microalgae. The method not only provides an important technical means to address the large scale industrial production of astaxanthin through microalgae but also ensures an ample source of raw material for the widespread utilization of astaxanthin. | 09-10-2015 |
20150270234 | PAD STRUCTURE FOR SEMICONDUCTOR DEVICE CONNECTION - A pad structure may include a conductive pad that includes an exposed portion. The pad structure may further include a first conductive set that includes a first conductive part and a second conductive part. The first conductive part may overlap the exposed portion in a direction perpendicular to the conductive pad. The first conductive part may be spaced from the second conductive part in a direction parallel to the conductive pad and may overlap the second conductive part in the direction parallel to the conductive pad. The pad structure may further include a conductive layer that contacts the conductive pad and is positioned between the conductive pad and the first conductive set in the direction perpendicular to the conductive pad. The pad structure may further include a first via member, which may electrically connect the first conductive part to the conductive layer. | 09-24-2015 |
20150288173 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT AND CONFIGURATION METHOD - The present disclosure provides an electrostatic discharge (ESD) protection circuit and configuration method thereof. The ESD protection circuit includes first and second power supply terminals, first and second detection units, a control unit, a clamping unit, and a voltage-dividing output node defined between the first and second power supply terminals. The first detection unit detects an electrostatic signal, based on a signal between the first power supply terminal and the voltage-dividing output node, and outputs a first signal. Likewise, the second detection unit outputs a second signal. The control unit is configured to be driven by the first signal to convert into a first discharge control signal and by the second signal to convert into a second discharge control signal. The clamping unit is configured to receive the first and second discharge control signals to discharge an electrostatic current between the first and the second power supply terminals. | 10-08-2015 |
20160093718 | SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD THEREOF - A method is provided for fabricating transistors. The method includes providing a semiconductor substrate. The substrate has a gate film and a mask film formed on a top surface. The mask film contains implanted carbon ions. The method further includes forming a mask layer by etching the mask film and then forming a gate layer by etching through the gate film using the mask layer as a mask until the substrate is exposed. The method also includes forming a first sidewall containing implanted carbon ions on the side surface of the gate layer and the mask layer; forming a stress layer in the substrate on both sides of the gate layer and the first side-wall; and forming a source region on one side of the gate layer and the first sidewall and a drain region on the other side of the gate layer and the first side wall. | 03-31-2016 |
20160105163 | LOW-VOLTAGE TO HIGH-VOLTAGE LEVEL SHIFTER CIRCUIT - A low-voltage to high-voltage level shifter circuit includes an input circuit, a voltage shifting circuit, and an output circuit. The input circuit is configured to receive an input signal having a voltage range between a first voltage and a ground voltage, and to provide an inverted input signal and a delayed version of the inverted input signal. The voltage shifting circuit is coupled to the input circuit and is configured to receive the input signal, the inverted input signal, and the delayed version of the inverted input signal. The voltage shifting circuit is configured to provide an internal signal having a voltage range between a second voltage and the ground voltage, the second voltage being higher than the first voltage. The output circuit provides an output voltage in the high-voltage range for the corresponding input voltage in the low-voltage range. | 04-14-2016 |
Patent application number | Description | Published |
20130240883 | Contact Test Structure and Method - A system and method for testing electrical connections is provided. In an embodiment one or more floating pads may be manufactured in electrical connection with an underbump metallization structure. A test may then be performed to measure the electrical characteristics of the underbump metallization structure through the floating pad in order to test for defects. Alternatively, a conductive connection may be formed on the underbump metallization and the test may be performed on the conductive connection and the underbump metallization together. | 09-19-2013 |
20130241683 | Inductor for Post Passivation Interconnect - An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member. | 09-19-2013 |
20130332092 | Calibration Kits for RF Passive Devices - A method includes measuring a first calibration kit in a wafer to obtain a first performance data. The wafer includes a substrate, and a plurality of dielectric layers over the substrate. The first calibration kit includes a first passive device over the plurality of dielectric layers, wherein substantially no metal feature is disposed in the plurality of dielectric layers and overlapped by the first passive device. The method further includes measuring a second calibration kit in the wafer to obtain a second performance data. The second calibration kit includes a second passive device identical to the first device and over the plurality of dielectric layers, and dummy patterns in the plurality of dielectric layers and overlapped by the second passive device. The first performance data and the second performance data are de-embedded to determine an effect of metal patterns in the plurality of dielectric layers to overlying passive devices. | 12-12-2013 |
20140145346 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes forming a first functional region of an integrated circuit over a workpiece, and forming a second functional region of the integrated circuit over the workpiece. The method includes forming a guard ring around the first functional region of the integrated circuit. The guard ring is formed in a material layer disposed over the first functional region and the second functional region. | 05-29-2014 |
20140151698 | Test Structures for Post-Passivation Interconnect - An integrated circuit structure includes a passivation layer, a polymer layer over the passivation layer, and a PPI monitor structure. The PPI monitor structure includes a portion overlying a portion of the polymer layer. The PPI monitor structure is electrically floating. | 06-05-2014 |
20140183693 | Capacitor in Post-Passivation Structures and Methods of Forming the Same - A device includes a metal pad and a passivation layer having a portion overlapping the metal pad. A capacitor includes a bottom capacitor electrode underlying the passivation layer, wherein the bottom capacitor includes the metal pad. The capacitor further includes a top capacitor electrode over the portion of the passivation layer; and a capacitor insulator including the portion of the passivation layer. | 07-03-2014 |
20140203438 | Methods and Apparatus of Packaging of Semiconductor Devices - Methods and apparatuses for forming an under-bump metallization (UBM) pad above a dielectric layer are disclosed. The dielectric layer may be above a metal layer and comprises a first opening and a second opening surrounding the first opening, which divide the dielectric layer into a first area and a second area. An UBM pad extends into and fills the first opening of the dielectric layer, above the first area between the first opening and the second opening, and may further extends down at least partly into the second opening covering a part or the whole of the second opening of the dielectric layer. The UBM pad may further extend over a part of the second area of the dielectric layer if the UBM pad fills the whole of the second opening of the dielectric layer. A solder ball may be mounted on the UBM pad. | 07-24-2014 |
20140264884 | WLCSP Interconnect Apparatus and Method - Disclosed herein is an interconnect apparatus comprising a substrate having a land disposed thereon and a passivation layer disposed over the substrate and over a portion of the land. An insulation layer is disposed over the substrate and has an opening disposed over at least a portion of the land. A conductive layer is disposed over a portion of the passivation layer and in electrical contact with the land. The conductive layer has a portion extending over at least a portion of the insulation layer. The conductive layer comprises a contact portion disposed over at least a portion of the land. The insulation layer avoids extending between the land and the contact portion. A protective layer may be disposed over at least a portion of the conductive layer and may optionally have a thickness of at least 7 μm. | 09-18-2014 |
20140367160 | ELECTRIC MAGNETIC SHIELDING STRUCTURE IN PACKAGES - A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line. | 12-18-2014 |
20140374921 | Ball Height Control in Bonding Process - A package includes a first package component, a second package component over the first package component, and a solder region bonding the first package component to the second package component. At least one ball-height control stud separates the first package component and the second package component from each other, and defines a standoff distance between the first package component and the second package component. | 12-25-2014 |
20150017778 | Capacitor in Post-Passivation Structures and Methods of Forming the Same - A device includes a metal pad and a passivation layer having a portion overlapping the metal pad. A capacitor includes a bottom capacitor electrode underlying the passivation layer, wherein the bottom capacitor includes the metal pad. The capacitor further includes a top capacitor electrode over the portion of the passivation layer; and a capacitor insulator including the portion of the passivation layer. | 01-15-2015 |
20150091191 | Contact Pad for Semiconductor Devices - Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer and/or polymer layer disposed over the substrate and a portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to an exposed portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes a stepped region. | 04-02-2015 |
20150123269 | Packaging Devices and Methods of Manufacture Thereof - Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad, a second portion of the contact pad being exposed. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to the second portion of the contact pad. A PPI pad is disposed over the passivation layer and is coupled to the PPI line. An insulating material is disposed over the PPI line, the PPI pad being exposed. The insulating material is spaced apart from an edge portion of the PPI pad by a predetermined distance. | 05-07-2015 |
20150137349 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a substrate including a surface, a plurality of pads disposing on the surface of the substrate, the plurality of pads includes a non-solder mask defined (NSMD) pad and a solder mask defined (SMD) pad, and the NSMD pad is arranged at a predetermined location. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing a plurality of pads on a surface of the substrate, disposing a solder mask over the surface of the substrate and the plurality of pads, forming a first recess in the solder mask to surround one of the plurality of pads, and forming a second recess in the solder mask and above one of the plurality of pads. | 05-21-2015 |
20150214148 | Inductor for Post Passivation Interconnect and A Method of Forming - An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member. | 07-30-2015 |
20150214170 | SEMICONDUCTOR DEVICE WITH BUMP STOP STRUCTURE - A method for manufacturing semiconductor devices is provided. In the method, a conductive pad and a metal protrusion pattern are formed in a metallization layer. A passivation layer is conformally deposited over the metallization, and a protection layer is conformally deposited over the passivation layer. Further, a post-passivation interconnect structure (PPI) is conformally formed on the protection layer, and the PPI structure includes a landing pad region, a protrusion pattern over at least a portion of the landing pad region and a connection line electrically connected to the conductive pad. A solder bump is then placed on the landing pad region in contact with the protrusion pattern of PPI structure. A to semiconductor device with bum stop structure is also provided. | 07-30-2015 |
20150243613 | Packaging Devices and Methods of Manufacture Thereof - Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to a second portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element comprises a first side and a second side coupled to the first side. The first side and the second side of the transition element are non-tangential to the PPI pad. | 08-27-2015 |
20150270232 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME - Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a redistribution layer coupled to the one or more dies at a first side of the first package with a first set of bonding joints. The redistribution layer including more than one metal layer disposed in more than one passivation layer, the first set of bonding joints being directly coupled to at least one of the one or more metal layers, and a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite the first side. | 09-24-2015 |
20150270247 | Semiconductor Packages and Methods of Forming the Same - Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a redistribution layer coupled to the one or more dies at a first side of the first package with a first set of bonding joints. The redistribution layer including more than one metal layer disposed in more than one passivation layer, the first set of bonding joints being directly coupled to at least one of the one or more metal layers, and a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite the first side. | 09-24-2015 |
20150287700 | PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN - A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package. | 10-08-2015 |
20150348916 | RING STRUCTURES IN DEVICE DIE - A die includes a metal pad, a passivation layer over the metal pad, and a polymer layer over the passivation layer. A metal pillar is over and electrically coupled to the metal pad. A metal ring is coplanar with the metal pillar. The polymer layer includes a portion coplanar with the metal pillar and the metal ring. | 12-03-2015 |
20150357317 | Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices - Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes providing a semiconductor device comprising an integrated circuit die, connectors disposed over the integrated circuit die, and an insulating material disposed over the connectors and the integrated circuit die. The insulating material is removed from over corner regions of the integrated circuit die, and a molding material is disposed over the insulating material and the integrated circuit die. A top portion of the molding material and the insulating material is removed to expose the connectors. | 12-10-2015 |
20150364404 | PAD DESIGN FOR RELIABILITY ENHANCEMENT IN PACKAGES - A package includes a corner, a device die having a front side and a backside, and a molding material molding the device die therein. A plurality of redistribution lines is on the backside of the device die. The plurality of redistribution lines includes a plurality of metal pads. A polymer layer contacts the plurality of metal pads. A plurality of openings is formed in the polymer layer, with the plurality of metal pads aligned to and exposed to the plurality of openings. The plurality of openings includes a corner opening that is elongated and an additional opening farther away from the corner than the corner opening. The additional opening is non-elongated. | 12-17-2015 |
20150371936 | Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices - Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes through-vias, an integrated circuit die mounting region, and a material disposed around and between the through-vias and the integrated circuit die mounting region. An interconnect structure is disposed over the material, the through-vias, and the integrated circuit die mounting region. The interconnect structure includes a dummy feature disposed proximate one of the through-vias. | 12-24-2015 |
20150380329 | Contact Test Structure and Method - A system and method for testing electrical connections is provided. In an embodiment one or more floating pads may be manufactured in electrical connection with an underbump metallization structure. A test may then be performed to measure the electrical characteristics of the underbump metallization structure through the floating pad in order to test for defects. Alternatively, a conductive connection may be formed on the underbump metallization and the test may be performed on the conductive connection and the underbump metallization together. | 12-31-2015 |
20150380351 | Capacitor in Post-Passivation Structures and Methods of Forming the Same - A device includes a metal pad and a passivation layer having a portion overlapping the metal pad. A capacitor includes a bottom capacitor electrode underlying the passivation layer, wherein the bottom capacitor includes the metal pad. The capacitor further includes a top capacitor electrode over the portion of the passivation layer; and a capacitor insulator including the portion of the passivation layer. | 12-31-2015 |
20160035670 | Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices - Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a back side interconnect structure, and a winding of an inductor disposed in a material layer of the back side interconnect structure. A molding material is coupled to the back side interconnect structure. The package includes an integrated circuit die mounting region disposed within the molding material. | 02-04-2016 |
20160079158 | Contact Pad for Semiconductor Devices - Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer and/or polymer layer disposed over the substrate and a portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to an exposed portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes line having a width greater than the PPI line. | 03-17-2016 |