Patent application number | Description | Published |
20080206685 | Exposure method, method for manufacturing flat panel display substrate, and exposure apparatus - An exposure method and exposure apparatus optimal for the formation of a fine pattern of an electronic device, such as a flat panel display. The exposure method and apparatus provides a high resolution and is inexpensive. The exposure method exposes a pattern onto a substrate with the use of an optical system that performs interference exposure for exposing a pattern parallel to a predetermined scanning direction with an interference optical system and variable shaping exposure with a variable shaping optical system while performing relative scanning in the scanning direction. | 08-28-2008 |
20080270970 | Method for processing pattern data and method for manufacturing electronic device - A method for processing data for a mask pattern. The method includes analyzing data of the mask pattern and specifying a pattern region having a predetermined shape and a predetermined dimension from the mask pattern. The pattern region functions as an alignment mark. | 10-30-2008 |
20080299492 | Exposure method and electronic device manufacturing method - An exposure method for exposing a bright-dark pattern onto each exposure region of a substrate via a projection optical system includes a position detection process for detecting positions of a plurality of microscopic regions in a unit exposure field of the substrate, a deformation calculation step of calculating a state of deformation in the unit exposure field based on information related to the positions of the plurality of microscopic regions obtained in the position detection step, and a shape modification step of modifying the shape of the bright-dark pattern to be exposed on the substrate based on the deformation state obtained in the deformation calculation step. The microscopic regions detected in the position detection step include a circuit pattern formed in the unit exposure field. | 12-04-2008 |
20080299499 | EXPOSURE METHOD, METHOD OF MANUFACTURING PLATE FOR FLAT PANEL DISPLAY, AND EXPOSURE APPARATUS - An exposure method facilitating the formation of a fine pattern on a plate. The exposure method illuminates a mask with illumination light and exposes a plate using a mask pattern of the mask. The method includes scanning the plate relative to the mask in a scanning direction, which is an in-plane direction of the plate, and exposing the plate while scanning the plate relative to the mask. The exposing of the plate while scanning the plate relative to the mask includes performing fine period exposure with a fine period mask pattern formed in a first region of the mask and middle density exposure with a middle density mask pattern formed in a second region of the mask. The first region and the second region are arranged adjacent to each other in the scanning direction. | 12-04-2008 |
20090042115 | Exposure apparatus, exposure method, and electronic device manufacturing method - An exposure apparatus for exposing a bright-dark pattern on a substrate via a projection optical system includes a position detection system which detects a plurality of predetermined positions in a unit exposure field of the substrate. A plurality of reference detection positions fall within a range substantially equal to the unit exposure field. A deformation calculation unit calculates a state of deformation in the unit exposure field based on the detection result of the position detection system. A shape modification unit modifies a shape of the bright-dark pattern to be exposed on the substrate based on the deformation state calculated by the deformation calculation unit. | 02-12-2009 |
20090042139 | Exposure method and electronic device manufacturing method - An exposure method enabling deformation occurring in a unit exposure field to be measured rapidly and accurately and enabling a plurality of patterns to be superimposed on a substrate with high accuracy. The exposure method of the present embodiment for exposing a bright-dark pattern on the substrate using a projection optical system includes a position detection process for detecting the positions of a plurality of position detection marks, relative to a substrate-in-plane-direction of the substrate, arranged in at least one functional element in a unit exposure field of the substrate, a deformation calculation process for calculating the state of deformation occurring in the unit exposure field based on information related to the positions of the position detection marks obtained in the position detection process, and a shape modification process for modifying the shape of the bright-dark pattern to be exposed on the substrate based on the deformation state obtained in the deformation calculation process. | 02-12-2009 |
20090122292 | Illumination optical apparatus and projection exposure apparatus - An illumination optical apparatus and projection exposure apparatus capable of reducing a light quantity loss when a mask is illuminated with a polarized illumination light. An illumination optical system for illuminating a reticle with an illumination light and a projection optical system for projecting the pattern image of the reticle onto a wafer are provided. An illumination light emitted from an exposure light source in a linearly polarized state in the illumination optical system passes through first and second birefringent members having different fast axis directions and is converted into a polarized state that is substantially linearly polarized in a circumferential direction with the optical axis as the center in an almost specific annular area, and them illuminates the reticle under an annular illuminating condition after passing through a fly-eye lens. | 05-14-2009 |
20090284729 | Illumination optical apparatus and projection exposure apparatus - An illumination optical apparatus and projection exposure apparatus capable of reducing a light quantity loss when a mask is illuminated with a polarized illumination light. An illumination optical system for illuminating a reticle with an illumination light and a projection optical system for projecting the pattern image of the reticle onto a wafer are provided. An illumination light emitted from an exposure light source in a linearly polarized state in the illumination optical system passes through first and second birefringent members having different fast axis directions and is converted into a polarized state that is substantially linearly polarized in a circumferential direction with the optical axis as the center in an almost specific annular area, and them illuminates the reticle under an annular illuminating condition after passing through a fly-eye lens. | 11-19-2009 |
20100302523 | METHOD AND APPARATUS FOR MEASURING WAVEFRONT, AND EXPOSURE METHOD AND APPARATUS - A method for measuring wavefront information of a projection optical system includes arranging a first diffraction grating having a pitch P | 12-02-2010 |
20130242280 | ILLUMINATION OPTICAL APPARATUS AND PROJECTION EXPOSURE APPARATUS - An illumination optical apparatus and projection exposure apparatus capable of reducing a light quantity loss when a mask is illuminated with a polarized illumination light. An illumination optical system for illuminating a reticle with an illumination light and a projection optical system for projecting the pattern image of the reticle onto a wafer are provided. An illumination light emitted from an exposure light source in a linearly polarized state in the illumination optical system passes through first and second birefringent members having different fast axis directions and is converted into a polarized state that is substantially linearly polarized in a circumferential direction with the optical axis as the center in an almost specific annular area, and them illuminates the reticle under an annular illuminating condition after passing through a fly-eye lens. | 09-19-2013 |
20130250268 | ILLUMINATION OPTICAL APPARATUS AND PROJECTION EXPOSURE APPARATUS - An illumination optical apparatus and projection exposure apparatus capable of reducing a light quantity loss when a mask is illuminated with a polarized illumination light. An illumination optical system for illuminating a reticle with an illumination light and a projection optical system for projecting the pattern image of the reticle onto a wafer are provided. An illumination light emitted from an exposure light source in a linearly polarized state in the illumination optical system passes through first and second birefringent members having different fast axis directions and is converted into a polarized state that is substantially linearly polarized in a circumferential direction with the optical axis as the center in an almost specific annular area, and them illuminates the reticle under an annular illuminating condition after passing through a fly-eye lens. | 09-26-2013 |