Patent application number | Description | Published |
20080206682 | Fabrication method of micro-lens and fabrication method of master for micro-lens - A method of fabricating a micro lens, the method including: forming a photo-sensitive film on a substrate; placing a photo mask at a predetermined distance from a top of the photo-sensitive film; exposing the photo-sensitive film by varying an area of exposure of the photo-sensitive film so as to selectively expose three-dimensional structures of the photo-sensitive film corresponding to desired micro lenses; and developing the photo-sensitive film such that the exposed three-dimensional structures remain. Also, there is provided a method of fabricating a master for a micro lens, in which a master material is applied on the photo-sensitive film with the three-dimensional structures to form a master having the three-dimensional structures transferred thereonto. | 08-28-2008 |
20080224160 | High-power light emitting diode and method of manufacturing the same - Provided is a method of manufacturing a high-power LED package, the method including the steps of: preparing a mold having an irregularity pattern; providing a transparent resin solid having an irregularity pattern provided on the surface thereof by using the mold; preparing an irregularity film with the irregularity pattern by cutting a portion of the transparent resin solid; preparing an LED package structure having a cavity in which an LED chip is mounted; filling transparent liquid resin into the cavity having the LED chip mounted therein; mounting the irregularity film on the transparent liquid resin such that the irregularity film projects from the cavity at a predetermined height; and curing the transparent liquid resin having the irregularity film mounted thereon. The irregularity pattern of the irregularity film projects from the cavity at a predetermined height. | 09-18-2008 |
20090107616 | MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE - Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved. | 04-30-2009 |
20090114434 | METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME - There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least one constraining ceramic sheet on each of the upper and lower surfaces of the ceramic laminate to form constraining layers; performing a primary firing process on the ceramic laminate having the constraining layers thereon; polishing the surface of the ceramic laminate from which the constraining layers are removed; forming ceramic paste on the polished surface of the ceramic laminate while exposing connection terminals of the internal electrode circuit pattern to the outside environment through openings in the ceramic paste; forming a surface electrode on the surface of the ceramic paste by patterning so that the surface electrode is electrically connected to the connection terminals; and performing a secondary firing process so that the surface electrode adheres to the ceramic paste. | 05-07-2009 |
20090117290 | METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE - In a method of manufacturing a non-shrinkage ceramic substrate, a ceramic laminated structure, which is formed of a plurality of laminated green sheets each having an interconnecting pattern and has an external electrode formed on at least one of a top and bottom thereof, is prepared. A metal layer is formed to cover at least a portion of the external electrode. A constraining green sheet is disposed on at least one of the top and bottom of the ceramic laminated structure to suppress a planar shrinkage of the green sheets. The ceramic laminated structure is fired at the firing temperature of the green sheets to oxidize the metal layer. The constraining green sheet and a metal oxide layer, which is formed by oxidizing the metal layer, are removed. Accordingly, an electrode post-firing process can be omitted and the adhering strength between the electrode and the ceramic laminated structure can be increased. | 05-07-2009 |
20090117357 | CONSTRAINING GREEN SHEET AND MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE - There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic binder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than a powder packing density of the first constraining layer. | 05-07-2009 |
20090130473 | CARRIER FILM FOR FORMING CERAMIC GREEN SHEET AND METHOD OF FABRICATING CERAMIC GREEN SHEET - Provided is a carrier film for forming a ceramic green sheet. The carrier film includes a film-type base material for fabricating the ceramic green sheet, a binder layer disposed on the film-type base material, the binder layer being formed of a binder resin, and a delamination layer disposed on a bottom surface of the carrier film, the delamination layer being formed of a resin having a releasing property. Also, provided is a method for fabricating a ceramic green sheet. The method includes preparing a carrier film for forming the ceramic green sheet including a binder layer, coating a ceramic slurry onto the carrier film, and drying the coated ceramic slurry to form the ceramic green sheet. | 05-21-2009 |
20090135542 | GLASS COMPOSITION, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE USING THE SAME - Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi | 05-28-2009 |
20090142582 | CONSTRAINING GREEN SHEET AND MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE USING THE SAME - There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics. | 06-04-2009 |
20090148667 | Method of manufacturing ceramic laminated substrate and ceramic laminated substrate manufactured using the same - There are provided a method of manufacturing a ceramic laminated substrate in which the ceramic laminated substrate, with a cavity formed therein, can be manufactured by constrained sintering without undergoing deformation of the cavity, and a ceramic laminated substrate manufactured using the same. | 06-11-2009 |
20090214881 | LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE HAVING DIFFUSION BARRIER LAYER AND METHOD OF MANUFACTURING THE SAME - There is provided a low temperature co-fired ceramic substrate having a diffusion barrier layer to prevent diffusion occurring in a heterojunction during firing and a method of manufacturing the same. A low temperature co-fired ceramic substrate according to an aspect of the invention may include: a first ceramic layer formed of a material having a first dielectric constant; a second ceramic layer formed of a material having a second dielectric constant lower than the first dielectric constant; and a diffusion barrier layer interposed between the first ceramic layer and the second ceramic layer and formed of the first ceramic layer material, the second ceramic layer material, and a barium (Ba) compound, wherein inter-diffusion between the first ceramic layer material and the second ceramic layer material is prevented by using the diffusion barrier layer. | 08-27-2009 |
20100059165 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE HAVING CAVITY - A method of manufacturing a multilayer ceramic substrate having a cavity includes preparing a first ceramic laminate having an opening for forming a cavity, and a second ceramic laminate which is to be provided on a bottom surface of the first ceramic laminate, forming a polymer layer in a region corresponding at least to the opening, on a top surface of the second ceramic laminate, forming a desired multilayer ceramic laminate by laminating the first and second ceramic laminates such that the polymer layer of the second ceramic laminate is placed under the opening, laminating first and second constraining layers on a top surface and a bottom surface of the multilayer ceramic laminate, respectively, and sintering the multilayer ceramic laminate including the laminated first and second constraining layers. Accordingly, the strength of a low temperature co-fired ceramic (LTCC) substrate having a cavity is enhanced, and an effective area for mounting built-in devices can be increased. | 03-11-2010 |
20110043100 | METHOD OF FORMING PHOSPHOR FILM AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE INCORPORATING THE SAME - The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film. | 02-24-2011 |
20110063174 | PATCH ANTENNA AND WIRELESS COMMUNICATIONS MODULE - There is provided a patch antenna. The patch antenna includes a high dielectric constant substrate having a cavity, a radiator disposed on a portion of one surface of the high dielectric constant substrate corresponding to the cavity, a feeder line disposed on the high dielectric constant substrate and supplying a signal to the radiator, and a ground part disposed on the high dielectric constant substrate. | 03-17-2011 |
20120028018 | LTCC COMPOSITION, LTCC SUBSTRATE COMPRISING THE SAME AND METHOD OF MANUFACTURING THE SAME - There is provided a Low Temperature Co-fired Ceramic (LTCC) composition, an LTCC substrate comprising the same, and a method of manufacturing the same. The LTCC composition includes 20 to 70 parts by weight of ceramic powder; and 30 to 80 parts by weight of glass component for low-temperature sintering, wherein the ceramic powder has plate-shaped ceramic powder particles and globular ceramic powder particles, and the ceramic powder has a content ratio of the globular ceramic powder particles with respect to the plate-shaped ceramic powder particles in a range of 0 to 1. | 02-02-2012 |