Patent application number | Description | Published |
20150033493 | ADAPTER FOR WIPER AND WIPER SYSTEM THEREOF - A wiper adapter detachably coupled between a wiper arm and a wiper having a pivot shaft, the adapter comprises a first coupling element and a second coupling element. The first coupling element has a shaft cavity provided with a notch that is in communication with the shaft cavity; the pivot shaft can be assembled into the shaft cavity radially through the notch and can pivotably fit in the shaft cavity. The second coupling element can snap to the pivot shaft so as to prevent the pivot shaft from leaving the shaft cavity through the notch. | 02-05-2015 |
20150135464 | WIPER CONNECTOR AND WIPER ASSEMBLY THEREOF - A wiper connector and a wiper assembly thereof The connector is detachably coupled between a wiper arm and a wiper, wherein the connector comprises a connector body and a stopper. The connector body has a longitudinal groove. One end of a stopper is detachably and rotatably disposed at one end of the longitudinal groove, and the other end of the stopper is detachably retained to the longitudinal groove so that the stopper movably shields a part of an opening of the longitudinal groove. | 05-21-2015 |
20150175132 | WIPER FLOW GUIDER AND WIPER ASSEMBLY - A flow guider and a wiper assembly for wiper, wherein a spring rail is detachably received in the flow guider which is provided with a longitudinal slot providing along the extension direction of the flow guider for accommodating the spring rail, and a receiving portion being able to receive the edges of the spring rail is provided on the side portions of the flow guider forming the longitudinal slot, for restricting the breakaway of the spring rail from the flow guider, wherein at least one stopper is provided on the longitudinal side walls of the longitudinal slot of the flow guider, a stop portion is provided on the spring rail for cooperating with the stopper, and the mutual cooperation of the stopper and the stop portion can stop the breakaway of the spring rail from the flow guider in the extension direction of the flow guider. | 06-25-2015 |
Patent application number | Description | Published |
20120175652 | METHOD AND APPARATUS FOR IMPROVED SINGULATION OF LIGHT EMITTING DEVICES - The present invention is a system and method for laser-assisted singulation of light emitting electronic devices manufactured on a substrate, having a processing surface and a depth extending from the processing surface. It includes providing a laser processing system having a picosecond laser having controllable parameters; controlling the laser parameters to form light pulses from the picosecond laser, to form a modified region having a depth which spans about 50% of the depth and substantially including the processing surface of the substrate and having a width less than about 5% of the region depth; and, singulating the substrate by applying mechanical stress to the substrate thereby cleaving the substrate into said light emitting electronic devices having sidewalls formed at least partially in cooperation with the linear modified regions. | 07-12-2012 |
20120211477 | METHOD AND APPARATUS FOR IMPROVED LASER SCRIBING OF OPTO-ELECTRIC DEVICES - Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer. | 08-23-2012 |
20130234149 | SIDEWALL TEXTURING OF LIGHT EMITTING DIODE STRUCTURES - A light emitting diode is made using a laser to texture the sidewalls of the bottom contact layer, without damaging a mesa. To do so, the substrate is mounted on a laser machining platform, and trenches are cut along lines through the semiconductor layer on the substrate using a first sequence of laser pulses having short pulse lengths that result in formation of textured sidewalls in the trenches, without causing recasting of the material. Then the substrate can be scribed along the lines of the trenches using a second sequence of laser pulses for singulation of die. | 09-12-2013 |
Patent application number | Description | Published |
20080296054 | HIGH PERFORMANCE CHIP CARRIER SUBSTRATE - A multilayer chip carrier with increased space for power distribution PTHs and reduced power-related noise. In a multilayer chip carrier with two signal redistribution fanout layers, in addition to signal escape from near-edge signal pads at the first fanout layer, remaining signal pads are moved closer to the edge of the chip footprint. At the voltage layer below the first fanout layer, the remaining signal pads are moved again, closer to the edge of the chip footprint. In the second fanout layer, below the voltage layer, the remaining signal pads escape. The region where signal pads are moved provides increased space for power PTHs. | 12-04-2008 |
20080308923 | HIGH PERFORMANCE CHIP CARRIER SUBSTRATE - A multilayer chip carrier with increased space for power distribution PTHs and reduced power-related noise. In a multilayer chip carrier with two signal redistribution fanout layers, in addition to signal escape from near-edge signal pads at the first fanout layer, remaining signal pads are moved closer to the edge of the chip footprint. At the voltage layer below the first fanout layer, the remaining signal pads are moved again, closer to the edge of the chip footprint. In the second fanout layer, below the voltage layer, the remaining signal pads escape. The region where signal pads are moved provides increased space for power PTHs. | 12-18-2008 |
20100060381 | Mulit-layer embedded capacitance and resistance substrate core - A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser. | 03-11-2010 |
20100167210 | MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE - A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser. | 07-01-2010 |
Patent application number | Description | Published |
20100269143 | System and Method for Satellite Enhanced Command, Control, and Surveillance Services Between Network Management Centers and Unmanned Land and Aerial Devices - A novel system and method for electronic delivery of command, control information to many land and aerial devices, simultaneously or individually, and transmission of video, audio, location, and other information from devices to user defined entities such as network management centers, and devices over defined geographic areas utilizing inter-connected communications satellites. Satellites receive data packets which may include command, control, monitoring, video, audio, sensor, graphics, response, and other data, redistributes them to multiple destination addresses within other systems and subsystems and radiates source power to devices. Display centers receive video, audio, and sensor data, stores the data files for playback on command, and creates maps utilizing geographic information software and other displays suitable for electronic displays. Operators are able to view and hear video camera output in real-time, or delayed, and issue commands, in any geographic area where devices are present. | 10-21-2010 |
Patent application number | Description | Published |
20110247296 | COLD FORMED JOIST - The present invention provides a cold formed joist that can be used in a variety of construction applications. The present cold formed joist consists of three elements, each formed from sheet metal: an upper chord, an intermediate web, and a lower web. These three elements can be produced in different dimensions. The upper chord further consists of a downwardly facing receiving channel adapted to receive the upper edge of the intermediate web, and two upwardly facing channels. The lower chord consists of an upwardly facing receiving channel that is adapted to receive the lower edge of the intermediate web. | 10-13-2011 |
20110247298 | Cold Formed Joist - The present invention provides a cold formed joist that can be used in a variety of construction applications. The present cold formed joist consists of three elements, each formed from sheet metal: an upper chord, an intermediate web, and a lower web. These three elements can be produced in different dimensions. The upper chord further consists of a downwardly facing receiving channel adapted to receive the upper edge of the intermediate web, and two upwardly facing channels. The lower chord consists of an upwardly facing receiving channel that is adapted to receive the lower edge of the intermediate web. | 10-13-2011 |
20130187308 | Cold Formed Stud - A cold formed metal stud is provided for commercial and residential construction applications. The metal stud of the present invention is suitable for use in both composite and non-composite applications. The metal stud of the present invention includes an intermediate web, a first flange and a second flange. Each of the intermediate web, first flange and second flange can include a number of different features that can enhance the structural and heat transfer characteristics of the metal stud. | 07-25-2013 |
20130232911 | Cold Formed Joist - The present invention provides a cold formed joist that can be used in a variety of construction applications. The present cold formed joist contains three elements, each formed from sheet metal: an upper chord, an intermediate web, and a lower chord. The upper chord further contains a downwardly facing receiving channel adapted to receive the upper edge of the intermediate web, and two upwardly facing channels. | 09-12-2013 |
Patent application number | Description | Published |
20080207607 | Heterotricyclic metalloprotease inhibitors - The present invention relates generally to azatriocyclic containing pharmaceutical agents, and in particular, to azatricyclic metalloprotease inhibiting compounds. More particularly, the present invention provides a new class of azatricyclic MMP-3, MMP-8 and/or MMP-13 inhibiting compounds, that exhibit an increased potency and selectivity in relation to currently known MMP-13, MMP-8 and MMP-3 inhibitors. | 08-28-2008 |
20080261968 | Heterobicyclic metalloprotease inhibitors - The present invention relates generally to azabicyclic containing pharmaceutical agents, and in particular, to azabicyclic metalloprotease inhibiting compounds. More particularly, the present invention provides a new class of azabicyclic MMP-3, MMP-8 and/or MMP-13 inhibiting compounds, which exhibit an increased potency and selectivity in relation to currently known MMP-13, MMP-8 and MMP-3 inhibitors. | 10-23-2008 |
20090312312 | Heterobicyclic Metalloprotease Inhibitors - The present invention relates generally to amide group containing pharmaceutical agents, and in particular, to amide containing heterobicyclic metalloprotease inhibitor compounds. More particularly, the present invention provides a new class of heterobicyclic MMP-13 inhibiting and MMP-3 inhibiting compounds, that exhibit an increased potency in relation to currently known MMP-13 and MMP-3 inhibitors. | 12-17-2009 |
20100087420 | Heterotricyclic Metalloprotease Inhibitors - The present invention relates generally to azatriocyclic containing pharmaceutical agents, and in particular, to azatricyclic metalloprotease inhibiting compounds. More particularly, the present invention provides a new class of azatricyclic MMP-3, MMP-8 and/or MMP-13 inhibiting compounds, that exhibit an increased potency and selectivity in relation to currently known MMP-13, MMP-8 and MMP-3 inhibitors. | 04-08-2010 |
20100249102 | Heterotricyclic Metalloprotease Inhibitors - The present invention relates generally to azatriocyclic containing pharmaceutical agents, and in particular, to azatricyclic metalloprotease inhibiting compounds. More particularly, the present invention provides a new class of azatricyclic MMP-3, MMP-8 and/or MMP-13 inhibiting compounds, that exhibit an increased potency and selectivity in relation to currently known MMP-13, MMP-8 and MMP-3 inhibitors. | 09-30-2010 |
20110230452 | Compounds and methods for the treatment of pain and other diseases - The present invention relates generally to pharmaceutical agents, and in particular, to metalloprotease inhibitor compounds. More particularly, the present invention provides a new class of dual acting MMP-2 and MMP-9 inhibiting compounds that exhibit increased potency, metabolic stability and/or reduced toxicity in relation to currently known MMP-2 and MMP-9 inhibitors for the treatment of pain and other diseases. Additionally, the present invention relates to methods for treating pain, addiction and/or withdrawal symptoms in a patient comprising administering to the patient a pain-reducing effective amount of a present compound. | 09-22-2011 |
20110257222 | COMPOUNDS AND METHODS FOR THE TREATMENT OF PAIN AND OTHER DISEASES - The present invention relates generally to alkyne containing pharmaceutical agents, and in particular, to phenylethynyl-thiophene based metalloprotease inhibitor compounds. More particularly, the present invention provides a new class of MMP inhibiting compounds that exhibit increased potency, metabolic stability and/or reduced toxicity in relation to currently known MMP inhibitors for the treatment of pain and other diseases such as cancer. Additionally, the present invention relates to methods for treating pain in a patient comprising administering to the patient a pain-reducing effective amount of a present compound. | 10-20-2011 |
20120015920 | HETEROBICYCLIC METALLOPROTEASE INHIBITORS - The present invention relates generally to amide group containing pharmaceutical agents, and in particular, to amide containing heterobicyclic metalloprotease inhibitor compounds. More particularly, the present invention provides a new class of heterobicyclic MMP-13 inhibiting and MMP-3 inhibiting compounds, that exhibit an increased potency in relation to currently known MMP-13 and MMP-3 inhibitors. | 01-19-2012 |
20130338116 | COMPOUNDS AND METHODS FOR THE TREATMENT OF PAIN AND OTHER DISEASES - The present invention relates generally to pharmaceutical agents, and in particular, to metalloprotease inhibitor compounds. More particularly, the present invention provides a new class of dual acting MMP-2 and MMP-9 inhibiting compounds that exhibit increased potency, metabolic stability and/or reduced toxicity in relation to currently known MMP-2 and MMP-9 inhibitors for the treatment of pain and other diseases. Additionally, the present invention relates to methods for treating pain, addiction and/or withdrawal symptoms in a patient comprising administering to the patient a pain-reducing effective amount of a present compound. | 12-19-2013 |
20150274702 | MATRIX METALLOPROTEINASE INHIBITORS AND METHODS FOR THE TREATMENT OF PAIN AND OTHER DISEASES - The present invention relates generally to bis-amide containing MMP inhibiting compounds, and more particularly to selectively deuterated bis-amide MMP-13 inhibiting compounds that exhibit increased stability or potency in relation to currently known MMP-13 inhibitors. Additionally, the present invention relates to methods for treating pain and inflammation in a patient comprising administering to the patient a pain-reducing effective amount of a present compound. | 10-01-2015 |