Patent application number | Description | Published |
20080315406 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE - An integrated circuit package system includes a base substrate having a base substrate cavity, attaching a junction integrated circuit package over the base substrate with a portion of the junction integrated circuit package in the base substrate cavity, and attaching a base integrated circuit over the junction integrated circuit package and the base substrate. | 12-25-2008 |
20090127715 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSION - A mountable integrated circuit package system includes: mounting a first integrated circuit device over a carrier; mounting a second integrated circuit device over the first integrated circuit device includes: attaching the second integrated circuit device to a first substrate side of a substrate, and connecting a first electrical interconnect between the second integrated circuit device and a second substrate side of the substrate through an opening in the substrate. The mountable integrated circuit package system further including: forming a package encapsulation over the first integrated circuit device and the carrier with the substrate partially exposed. | 05-21-2009 |
20090236720 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STEP MOLD RECESS - An integrated circuit package system includes: providing a stackable integrated circuit package system having a base encapsulation and a recess therein; stacking a top integrated circuit package system, having a top encapsulation with a protruding portion, with the stackable integrated circuit package system with the protruding portion aligned and matched within the recess; and connecting the top integrated circuit package system and the stackable integrated circuit package system. | 09-24-2009 |
20090256267 | INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH CENTRAL BOND WIRES - An integrated circuit package-on-package system includes: providing a base substrate having a central opening; attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate; attaching a top die above the base substrate partially covering the central opening; attaching external conductive interconnections to a base bottom surface of the base substrate; and molding an encapsulant leaving the external conductive interconnections partially exposed. | 10-15-2009 |
20100148354 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH DIRECT INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation. | 06-17-2010 |
20100244222 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an internal-interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate with the integral-interposer-structure connected to the internal-interconnect; mounting an integrated circuit to the substrate and under the integral-interposer-structure; and encapsulating the internal-interconnect and the integrated circuit with an encapsulation. | 09-30-2010 |
20110062591 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH DIRECT INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation. | 03-17-2011 |
20120223435 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a base package having a base integrated circuit over a base substrate; stacking a mountable device over the base package with a flow channel between the mountable device and the base package; and forming an external lead having a lead platform and a lead leg, the lead platform extending from the mountable device and the lead leg parallel to the base package. | 09-06-2012 |
20130322023 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate. | 12-05-2013 |