Patent application number | Description | Published |
20080314159 | Shear Test Device - Shear test apparatus for gold and solder balls of a semi-conductor substrate comprises a support element ( | 12-25-2008 |
20090019941 | PULL TEST CALIBRATION DEVICE AND METHOD - A device and method permits absolute and relative calibration of a pull-test device for testing the mechanical strength of electrical bond deposits. The invention provides repeatable breaking of a test specimen such as a wire ( | 01-22-2009 |
20090056469 | APPARATUS AND METHOD FOR DETERMINING FAILURE MODE IN A SHEAR OR PULL TEST DEVICE - A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, hi the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode. | 03-05-2009 |
20090301216 | TENSILE TEST DEVICE AND METHOD FOR TESTING DEPOSITS ON ELECTRONIC SUBSTRATES - A tensile testing machine has a jaw which comprises a unitary ‘H’ section member having a cross piece ( | 12-10-2009 |
20100116063 | SHEAR TEST APPARATUS AND METHOD - A test apparatus for applying shear loads to a deposit on a substrate comprises a cantilevered shear tool ( | 05-13-2010 |
20100218615 | APPARATUS AND METHOD FOR DETERMINING FAILURE MODE IN A SHEAR OR PULL TEST DEVICE - A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, in the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode. | 09-02-2010 |
20100218616 | SHEAR TEST DEVICE - Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element ( | 09-02-2010 |
20110079088 | HIGH SPEED PULL TEST DEVICE AND METHOD - A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces | 04-07-2011 |
20110214507 | BOND STRENGTH TESTER WITH SWITCHABLE BACKLASH CONTROL - A bond strength testing apparatus comprising a main body, a test tool mount for holding a test tool, and an axial drive mechanism including a screw and nut assembly. The drive mechanism couples the test tool mount to the main body and allows for relative movement between the test tool mount and the main body in an axial direction. A backlash control element is coupled to the main body and the test tool mount, and, in operation, biases the test tool mount relative to the main body in an axial direction. The backlash control element is switchable between a first state in which the test tool mount is biased in a first axial direction by the backlash control element, and a second state in which either the test tool mount is biased in a second axial direction by backlash control element, or the backlash control element applies no biasing force to test tool mount. The apparatus can be automated to apply the appropriate backlash control for a particular, selected test type. | 09-08-2011 |
20110214510 | CLAMPING MECHANISM FOR SHEAR TESTING APPARATUS - A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate. Strain gauges associated with the shear test tool provide signals to an electric circuit indicating the strength of attachment between the bond and the substrate. | 09-08-2011 |
20110271767 | TEST DEVICE - Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element ( | 11-10-2011 |
20120204654 | TENSILE TEST DEVICE AND METHOD FOR TESTING DEPOSITS ON ELECTRONIC SUBSTRATES - A tensile testing machine has a jaw which includes a unitary ‘H’ section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on the test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the uprights via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam. | 08-16-2012 |