Patent application number | Description | Published |
20080313581 | INDEPENDENT MIGRATION OF HIERARCHICAL DESIGNS WITH METHODS OF FINDING AND FIXING OPENS DURING MIGRATION - Methods of independently migrating a hierarchical design are disclosed. A method for migrating a macro in an integrated circuit comprises: determining an interface strategy between a base cell in the macro and the macro, the base cell including an interface element involved in the interface strategy; migrating the base cell independently with respect to the macro based on the interface strategy; initially scaling the macro; swapping the migrated base cell into the macro; and legalizing content of the initially scaled macro. | 12-18-2008 |
20090031263 | METHOD AND SYSTEM FOR ANALYZING AN INTEGRATED CIRCUIT BASED ON SAMPLE WINDOWS SELECTED USING AN OPEN DETERMINISTIC SEQUENCING TECHNIQUE - Disclosed herein are embodiments of a system and an associated method for analyzing an integrated circuit to determine the value of a particular attribute (i.e., a physical or electrical property) in that integrated circuit. In the embodiments, an open deterministic sequencing technique is used to select a sequence of points representing centers of sample windows in an integrated circuit layout. Then, the value of the particular attribute is determined for each sample window and the results are accumulated in order to infer an overall value for that particular attribute for the entire integrated circuit layout. This sequencing technique has the advantage of allowing additional sample windows to be added and/or the sizes and shapes of the windows to be varied without hindering the quality of the sample. | 01-29-2009 |
20090037850 | POLYGONAL AREA DESIGN RULE CORRECTION METHOD FOR VLSI LAYOUTS - A method of polygonal area design rule correction for use in an electronic design automation tool for governing integrated circuit (IC) design layouts using one-dimensional (1-D) optimization, with steps of analyzing IC design layout data to identify violating polygons, partitioning violating polygons into rectangles in a direction of optimization, formulating an area constraint for each violating polygon to formulate a global linear programming (LP) problem that includes each constraint for each violating polygon and solving the global LP problem to obtain a real-valued solution. A next LP problem is created for each area constraint, and solved. The creating a next and solving the next LP problem and solving are repeated until the last “next LP problem” is solved using constraints and objectives representing sums or differences of no more than two optimization variables. | 02-05-2009 |
20090037851 | CONTEXT AWARE SUB-CIRCUIT LAYOUT MODIFICATION - A method, system and program product for context aware sub-circuit layout modification are disclosed. The method may include defining at least one context for the sub-circuit for each circuit that uses the sub-circuit; in the case that a plurality of contexts are defined, minimizing a number of contexts for the sub-circuit by combining contexts into at least one stage; placing each stage into a staged layout; and modifying the sub-circuit by modifying the staged layout. | 02-05-2009 |
20090064061 | Layout Optimization Using Parameterized Cells - A method of layout optimization containing parameterized cells includes reading a physical design containing parameterized cells, creating a new version for each of usage of a given parameterized cell. The method optimizes physical design shapes of each new version of the parameterized cell by assigning variables to parameters of the parameterized cell according to a desired objective. Then, the method updates the parameters of each new version of the parameterized cell and replaces each new version of the parameterized cell with an instance of the parameterized cell having updated parameters. The method can optionally adjust physical design shapes based on constraints related to the parameters. | 03-05-2009 |
20090113360 | METHOD FOR COMPUTING THE SENSISTIVITY OF A VLSI DESIGN TO BOTH RANDOM AND SYSTEMATIC DEFECTS USING A CRITICAL AREA ANALYSIS TOOL - A method of estimating integrated circuit yield comprises providing an integrated circuit layout and a set of systematic defects based on a manufacturing process. Next, the method represents a systematic defect by modifying structures in the integrated circuit layout to create modified structures. More specifically, for short-circuit-causing defects, the method pre-expands the structures when the structures comprise a higher systematic defect sensitivity level, and pre-shrinks the structures when the structures comprise a lower systematic defect sensitivity level. Following this, a critical area analysis is performed on the integrated circuit layout using the modified structures, wherein dot-throwing, geometric expansion, or Voronoi diagrams are used. The method then computes a fault density value, random defects and systematic defects are computed. The fault density value is subsequently compared to a predetermined value, wherein the predetermined value is determined using test structures and/or yield data from a target manufacturing process. | 04-30-2009 |
20090113364 | APPARATUS AND COMPUTER PROGRAM PRODUCT FOR SEMICONDUCTOR YIELD ESTIMATION - A method, apparatus, system, and computer program product that performs yield estimates using critical area analysis on integrated circuits having redundant and non-redundant elements. The non-redundant elements are ignored or removed from the critical area analysis performed for undesired opens. | 04-30-2009 |
20090158231 | Design Structure for a Redundant Micro-Loop Structure for use in an Integrated Circuit Physical Design Process and Method of Forming the Same - A design structure for an integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is substantially axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is substantially axially aligned with the third via. The second, third, and fourth vias, and the third and fourth wires form a path between the first and second wires redundant to the first via. | 06-18-2009 |
20100023913 | METHOD FOR IC WIRING YIELD OPTIMIZATION, INCLUDING WIRE WIDENING DURING AND AFTER ROUTING - Disclosed are embodiments of a method, service, and computer program product for performing yield-aware IC routing for a design. The method performs an initial global routing which satisfies wiring congestion constraints. Next, the method performs wire spreading and wire widening on the global route, layer by layer, based on, for example, a quadratic congestion optimization. Following this, timing closure is performed on the global route using results of the wire spreading and wire widening. Post-routing wiring width and wire spreading adjustments are made using the critical area yield model. In addition, the method allows for the optimization of already-routed data. | 01-28-2010 |
20100185997 | TECHNOLOGY MIGRATION FOR INTEGRATED CIRCUITS WITH RADICAL DESIGN RESTRICTIONS - A method, system and program product for migrating an integrated circuit (IC) design from a source technology without radical design restrictions (RDR) to a target technology with RDR, are disclosed. The invention implements a minimum layout perturbation approach that addresses the RDR requirements. The invention also solves the problem of inserting dummy shapes where required, and extending the lengths of the critical shapes and/or the dummy shapes to meet ‘edge coverage’ requirements. | 07-22-2010 |
20100211923 | Design Structure for a Redundant Micro-Loop Structure for use in an Integrated Circuit Physical Design Process and Method of Forming the Same - A design structure for an integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is substantially axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is substantially axially aligned with the third via. The second, third, and fourth vias, and the third and fourth wires form a path between the first and second wires redundant to the first via. | 08-19-2010 |
20110088008 | METHOD FOR CONVERSION OF COMMERCIAL MICROPROCESSOR TO RADIATION-HARDENED PROCESSOR AND RESULTING PROCESSOR - A method is provided to convert commercial microprocessors to radiation-hardened processors and, more particularly, a method is provided to modify a commercial microprocessor for radiation hardened applications with minimal changes to the technology, design, device, and process base so as to facilitate a rapid transition for such radiation hardened applications. The method is implemented in a computing infrastructure and includes evaluating a probability that one or more components of an existing commercial design will be affected by a single event upset (SEU). The method further includes replacing the one or more components with a component immune to the SEU to create a final device. | 04-14-2011 |
20120137262 | METHOD FOR COMPUTING THE SENSITIVITY OF A VLSI DESIGN TO BOTH RANDOM AND SYSTEMATIC DEFECTS USING A CRITICAL AREA ANALYSIS TOOL - A method of estimating integrated circuit yield comprises providing an integrated circuit layout and a set of systematic defects based on a manufacturing process. Next, the method represents a systematic defect by modifying structures in the integrated circuit layout to create modified structures. More specifically, for short-circuit-causing defects, the method pre-expands the structures when the structures comprise a higher systematic defect sensitivity level, and pre-shrinks the structures when the structures comprise a lower systematic defect sensitivity level. Following this, a critical area analysis is performed on the integrated circuit layout using the modified structures, wherein dot-throwing, geometric expansion, or Voronoi diagrams are used. The method then computes a fault density value, random defects and systematic defects are computed. The fault density value is subsequently compared to a predetermined value, wherein the predetermined value is determined using test structures and/or yield data from a target manufacturing process. | 05-31-2012 |
20140167832 | CHANGING RESONANT CLOCK MODES - Described is an integrated circuit having a clock distribution network capable of transitioning from a non-resonant clock mode to a first resonant clock mode Transitions between clock modes or between various resonant clock frequencies are done gradually over a series of clock cycles. In example, when transitioning from a non-resonant clock mode to a first resonant clock mode, a strength of a clock sector driver is reduced over a series of clock cycles, and individual ones of a plurality of resonant switches associated with resonant circuits are modified in coordination with reducing the strength of the clock sector driver. | 06-19-2014 |
20140218087 | Wide Bandwidth Resonant Global Clock Distribution - A wide bandwidth resonant clock distribution comprises a clock grid configured to distribute a clock signal to a plurality of components of an integrated circuit, a tunable sector buffer configured to receive the clock signal and provide an output to the clock grid, at least one inductor, at least one tunable resistance switch, and a capacitor network. The tunable sector buffer is programmable to set latency and slew rate of the clock signal. The inductor, tunable resistance switch, and capacitor network are connected between the clock grid and a reference voltage. The at least one tunable resistance switch is programmable to dynamically switch the at least one inductor in or out of the clock distribution to effect at least one resonant mode of operation or a non-resonant mode of operation based on a frequency of the clock signal. | 08-07-2014 |
20140223210 | Tunable Sector Buffer for Wide Bandwidth Resonant Global Clock Distribution - A wide bandwidth resonant clock distribution comprises a clock grid configured to distribute a clock signal to a plurality of components of an integrated circuit and a tunable sector buffer configured to receive the clock signal and provide an output to the clock grid. The tunable sector buffer is configured to set latency and slew rate of the clock signal based on an identified resonant or non-resonant mode. | 08-07-2014 |
20140240021 | SETTING SWITCH SIZE AND TRANSITION PATTERN IN A RESONANT CLOCK DISTRIBUTION SYSTEM - Recycling energy in a clock distribution network is provided. A method includes creating a resonant clocking circuit including a clock grid. The method further includes providing resonant structures distributed in the clock grid. The method further includes providing switches that control the resonant structures to switch between a non-resonant mode and a resonant mode. The method further includes determining a switch size that minimizes power consumption of the resonant clocking circuit by iteratively increasing sizes of the switches and, for each iterative increase in size, determining power consumed by the resonant clocking circuit. | 08-28-2014 |
20140245244 | SETTING SWITCH SIZE AND TRANSITION PATTERN IN A RESONANT CLOCK DISTRIBUTION SYSTEM - Recycling energy in a clock distribution network is provided. A method includes creating a resonant clocking circuit including a clock grid. The method further includes providing resonant structures distributed in the clock grid. The method further includes providing switches that control the resonant structures to switch between a non-resonant mode and a resonant mode. The method further includes determining a switch size that minimizes power consumption of the resonant clocking circuit by iteratively increasing sizes of the switches and, for each iterative increase in size, determining power consumed by the resonant clocking circuit. | 08-28-2014 |
20140245250 | SETTING SWITCH SIZE AND TRANSITION PATTERN IN A RESONANT CLOCK DISTRIBUTION SYSTEM - Recycling energy in a clock distribution network is provided. A method includes creating a resonant clocking circuit including a clock grid. The method further includes providing resonant structures distributed in the clock grid. The method further includes providing switches that control the resonant structures to switch between a non-resonant mode and a resonant mode. The method further includes determining a switch size that minimizes power consumption of the resonant clocking circuit by iteratively increasing sizes of the switches and, for each iterative increase in size, determining power consumed by the resonant clocking circuit. | 08-28-2014 |
20140258958 | METHOD FOR CONVERSION OF COMMERCIAL MICROPROCESSOR TO RADIATION-HARDENED PROCESSOR AND RESULTING PROCESSOR - A method is provided to convert commercial microprocessors to radiation-hardened processors and, more particularly, a method is provided to modify a commercial microprocessor for radiation hardened applications with minimal changes to the technology, design, device, and process base so as to facilitate a rapid transition for such radiation hardened applications. The method is implemented in a computing infrastructure and includes evaluating a probability that one or more components of an existing commercial design will be affected by a single event upset (SEU). The method further includes replacing the one or more components with a component immune to the SEU to create a final device. | 09-11-2014 |