Patent application number | Description | Published |
20080311511 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND METHOD FOR PATTERN FORMING - A photosensitive resin composition, a photosensitive resin laminate, and a method for forming a pattern capable of realizing high hardness while using an epoxy group-containing acrylic resin are provided. In a photosensitive resin composition including (A) an epoxy group-containing acrylic resin, (B) a photopolymerization initiator, and (C) a sensitizer, an onium salt having a specific structure is used as the component (B), and at least one kind selected from 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and 2,6-dihydroxynaphthalene is used as the component (C). | 12-18-2008 |
20090068341 | POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL - This positive photoresist composition is a positive photoresist composition for exposing to light having one or more wavelengths selected from g-rays, h-rays and i-rays, comprising: (A) a compound which generates an acid under irradiation with active rays or radiation, and (B) a resin whose solubility in an alkali is enhanced by an action of an acid, wherein the component (A) contains an onium salt (A1) having a naphthalene ring in the cation moiety. | 03-12-2009 |
20090068342 | POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL - The present invention provides a positive photoresist composition used to form a thick film resist pattern on a support which includes (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) includes a resin (B1) which has a structural unit (b1) derived from an acrylate ester, in which a hydrogen atom of a carboxyl group has been substituted with an acid dissociable, dissolution inhibiting group represented by represented by a general formula (I) shown below: | 03-12-2009 |
20090130581 | DEVELOPER COMPOSITION AND METHOD FOR PREPARING THE SAME, AND METHOD FOR FORMING RESIST PATTERN - There is provided a developer composition which can from a good thick-film resist pattern and is less likely to cause frothing. This composition is a developer composition used to form a thick-film resist pattern on a substrate, and contains an organic quaternary ammonium base as a main component, an anionic surfactant represented by the following general formula (I), and a defoaming agent selected from the group consisting of a silicone-based defoaming agent, an alcohol-based defoaming agent and a nonionic surfactant-based defoaming agent: | 05-21-2009 |
20090291393 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN USING THE SAME - A positive photoresist composition capable of forming a film thickness of 5 μm or greater, preventing cracking due to thermal shock even if exposed to a low temperature atmosphere, having high sensitivity, and easily releasable with general solvents; and a method of forming a photoresist pattern using the positive photoresist composition. The positive photoresist composition contains (A) an alkali soluble novolak resin, (B) at least one plasticizer selected from an alkali soluble acrylic resin and an alkali soluble vinyl resin, and (C) a quinonediazide group-containing compound. The method of forming a photoresist pattern uses the positive photoresist composition. | 11-26-2009 |
20090311526 | Adhesive composition, film adhesive, and heat treatment method - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 12-17-2009 |
20100010182 | Adhesive composition, film adhesive, and method for producing the adhesive composition - An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance. | 01-14-2010 |
20100047715 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, CHEMICALLY AMPLIFIED DRY FILM FOR THICK FILM, AND METHOD FOR PRODUCTION OF THICK FILM RESIST PATTERN - Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure. | 02-25-2010 |
20100068453 | METHOD FOR PRODUCING PROCESSED GLASS SUBSTRATE - A processed substrate of the present invention includes a translucent substrate having a plurality of through-holes, in each of which there is a gap from 0 to 5 μm between (a) a straight line which passes through a central point of an opening plane of the each of the plurality of through-holes and which is perpendicular to the opening plane and (b) a straight line which passes through a central point of the other opening plane of the each of the plurality of through-holes and which is perpendicular to the other opening plane, thereby making it possible to provide (i) a processed substrate having through-holes in each of which central axes are aligned, which can be easily produced with high productivity, and (ii) a production method thereof. Further, a production method of the present invention of a processed glass substrate includes: (a) forming photosensitive resin layers on surfaces of a glass substrate; (b) forming a through-hole in the glass substrate; and (c) immersing the glass substrate in acid, with the photosensitive resin layers remaining on the both surfaces. Accordingly, it is unnecessary to perform smoothing the surfaces of the glass substrate after the step (c), thereby successfully producing a processed glass substrate having a through-hole with high productivity. | 03-18-2010 |
20100086799 | Removal method, adhesive agent for substrate, and laminate including substrate - The removal method of the present invention includes: providing a support plate and a substrate being combined to each other via a first adhesive layer and a second adhesive layer, the second adhesive layer being an adhesive layer which is dissolvable in a solvent quicker than the first adhesive layer or an adhesive layer which is dissolvable in a solvent different from a solvent to which the first adhesive layer is dissolvable, and the second adhesive layer being between the support plate and the first adhesive layer; and removing the support plate from the substrate by dissolving the second adhesive layer. Further, the removal method of the present invention includes, after the step of removing, dissolving the first adhesive layer. This removes the support plate from the wafer in a quick and easy way. | 04-08-2010 |
20100159191 | PROCESSED SUBSTRATE AND METHOD FOR MANUFACTURING SAME - The present invention provides (i) a processed substrate having a through-hole whose openings on respective surfaces of the processed substrate are matched to each other in size, and (ii) a method for easily manufacturing the processed substrate with high efficiency. A processed substrate | 06-24-2010 |
20100178498 | Adhesive composition and film adhesive - An adhesive composition of the present invention is an adhesive composition including a polymer obtained by polymerizing a monomer composition containing a (meth)acrylic acid ester having a structure represented by General Formula (1): | 07-15-2010 |
20100178499 | ADHESIVE COMPOSITION AND FILM ADHESIVE - An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): | 07-15-2010 |
20100186895 | Adhesive composition, film adhesive, and heat treatment method - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 07-29-2010 |
20110059245 | COATING APPARATUS AND COATING METHOD - A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate, a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the substrate is transported, and a removal unit which removes the liquid material from the inside of the chamber when at least one of oxygen concentration and humidity inside the chamber exceeds a threshold value. | 03-10-2011 |
20110059246 | COATING APPARATUS AND COATING METHOD - A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the liquid material is transported; and an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber. | 03-10-2011 |
20110059248 | COATING METHOD AND COATING APPARATUS - A coating method including coating a liquid material including an oxidizable metal on a substrate, and heating the substrate having the liquid material coated thereon in the presence of an inert gas. | 03-10-2011 |
20110059250 | COATING METHOD AND COATING APPARATUS - A coating method including coating a liquid material including an oxidizable metal on a substrate a plurality of times to laminate a plurality of liquid material layers on the substrate; and adjusting at least one of oxygen concentration and humidity inside a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the liquid material is transported. | 03-10-2011 |
20110059574 | COATING APPARATUS AND COATING METHOD - A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate; a chamber having a coating section in which the coating part applies the liquid material on the substrate and a transport section into which the liquid material is transported; an adjusting part which adjusts at least one of oxygen concentration and humidity inside the chamber; and a control part which stops an operation of the coating part in response to the entrance of foreign object into the chamber. | 03-10-2011 |
20110061800 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 03-17-2011 |
20110065858 | Adhesive composition and adhesive film - An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.). | 03-17-2011 |
20110081544 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 04-07-2011 |
20110123928 | Photosensitive Resin Composition and Pattern Forming Method Using the Same - Problem: Providing a photosensitive resin composition that has high sensitivity, sustains a slight shrinkage in volume when cured under heating and can form resist patterns having high-aspect profiles, and a pattern forming method using such a composition. | 05-26-2011 |
20110256484 | METHOD FOR PRODUCING COMB-SHAPED ELECTRODE - To provide a method for producing a comb-shaped electrode capable of precisely carrying a large amount of active materials on a surface of current collectors with a fine shape. The method for producing comb-shaped electrodes | 10-20-2011 |
20130280844 | COATING APPARATUS AND COATING METHOD - A coating apparatus including a coating part which has a nozzle which ejects a liquid material including an oxidizable metal from a tip portion, and a relative driving unit which moves a substrate and the nozzle in relation to each other so that the tip portion passes through the substrate, such that at least the tip portion of the nozzle provides an affinity control part which is formed so that affinity between the affinity control part and the liquid material is less than that between the liquid materials. | 10-24-2013 |
20140038111 | PROCESSED SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A processed substrate having a through-hole whose openings in respective surfaces of the processed substrate are matched to each other in size, and a method for easily manufacturing the processed substrate with high efficiency. The processed substrate ( | 02-06-2014 |