Patent application number | Description | Published |
20080205829 | Ultra-high density connector - Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector. | 08-28-2008 |
20080281231 | Method for manufacturing a complex structure - A method for manufacturing a complex structure from a two-dimensional layout, the method comprising: (a) obtaining a support plate having a pre-determined, patterned recess formed in a surface thereof; (b) depositing a first series of individual flexible interconnects into the recess, the flexible interconnects being aligned parallel to one another in a common plane and supported by the support plate; (c) adhering, with adhering means, at least one rigid member to each of the flexible interconnects of the first series; (d) adhering, with adhering means, a second series of individual flexible interconnects to the rigid members to form a plurality of stations, wherein each of the second series of flexible interconnects is adhered to two rigid members of adjacent flexible interconnects of the first series, the flexible interconnects of the second series being formed perpendicular to the flexible interconnects of the first series; (e) curing the adhering means to form an assembled, layered structure; (f) removing the layered structure from the support plate; and (g) folding, systematically, the layered structure on itself and causing at least some of the stations to be supported about a central spine in a segmented manner. | 11-13-2008 |
20090204195 | Multi-Element Probe Array - A multi-element probe array suitable for sensing or stimulating is disclosed. In one embodiment, the multi-element probe array includes a plurality of microfibers extending longitudinally and oriented substantially parallel to form a bundle. Probe elements are defined by a first subset of the microfibers displaced in a forward direction along the longitudinal axis relative to spacer elements defined by a second subset of the microfibers. Interface elements and communication elements are disposed on the probe elements. | 08-13-2009 |
20090326321 | Miniaturized Imaging Device Including Multiple GRIN Lenses Optically Coupled to Multiple SSIDs - A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include at least one solid state imaging device (SSID) including multiple imaging arrays respectively, and multiple graduated refractive index (GRIN) lenses optically coupled to the multiple imaging arrays. | 12-31-2009 |
20100112865 | Ultra-High Density Connector - Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector. | 05-06-2010 |
20100116869 | Electrical Microfilament to Circuit Interface - Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments. | 05-13-2010 |
20100171821 | Method And Device For Wavelength Shifted Imaging - A micro-camera catheter device is disclosed comprising at least one light source disposed on a distal end of a catheter. The light source is capable of propagating a predetermined wavelength of light with a wavelength between approximately 1000 nanometers and approximately 2000 nanometers onto a target. The device further comprises a lens system disposed on the distal end of the catheter, said lens system configured to receive light reflected from the target. The device further comprises a non-linear optical media disposed behind the lens system configured to modify the light reflected from the target. The device also comprises a silicon-based solid state imaging device disposed behind the non-linear optical media configured to receive light from the non-linear optical media. | 07-08-2010 |
20100188492 | Method And Device For Incremental Wavelength Variation To Analyze Tissue - A method of imaging a target using a miniaturized imaging device is disclosed comprising providing a miniaturized imaging device having a stationary lens system and an imaging array, wherein the distance from a distal end of the stationary lens system to the imaging array is fixed. The miniaturized imaging device is advanced near the desired target and a distance from a distal end of the stationary lens system to the desired target is determined. A desired wavelength of light is calculated based on the determined distance from the distal end of the stationary lens system to the desired target and the desired wavelength of light is propagated onto the target. | 07-29-2010 |
20110242302 | Light Diffusion Apparatus - A light diffusing composition that optimizes image clarity from a SSID comprising a translucent matrix further comprising a plurality of hollow micro-particles. The plurality of hollow micro-particles are dispersed throughout the translucent matrix and a fluid is disposed within the hollow micro-particle. A refractive index of the fluid within the hollow micro-particle is different than a refractive index of the translucent matrix. | 10-06-2011 |
20110251456 | Method and Apparatus For Viewing A Body Cavity - A method and apparatus to generate a planar representation of a longitudinally extending 360 degree continuous view within a body cavity of a patient is disclosed comprising advancing a portion of an imaging device into the body cavity of the patient, the imaging device having an image capture mechanism disposed on a distal end thereof configured to capture at least a 360 degree view of the inside of the body cavity. Further comprising withdrawing the imaging device at a controlled rate from the patient while simultaneously coordinating and generating 360 degree view image data from the imaging device and transmitting the image data from the imaging device to an image processor. The method further comprising processing the image data to produce a planar longitudinally continuous 360 degree view of the body cavity. | 10-13-2011 |
20110268914 | Two-Dimensional Layout For Use In A Complex Structure - A method for manufacturing a complex structure from a two-dimensional layout, the method comprising: (a) obtaining a support plate having a pre-determined, patterned recess formed in a surface thereof; (b) depositing a first series of individual flexible interconnects into the recess, the flexible interconnects being aligned parallel to one another in a common plane and supported by the support plate; (c) adhering, with adhering means, at least one rigid member to each of the flexible interconnects of the first series; (d) adhering, with adhering means, a second series of individual flexible interconnects to the rigid members to form a plurality of stations, wherein each of the second series of flexible interconnects is adhered to two rigid members of adjacent flexible interconnects of the first series, the flexible interconnects of the second series being formed perpendicular to the flexible interconnects of the first series; (e) curing the adhering means to form an assembled, layered structure; (f) removing the layered structure from the support plate; and (g) folding, systematically, the layered structure on itself and causing at least some of the stations to be supported about a central spine in a segmented manner. | 11-03-2011 |
20110310577 | ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE - Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments. | 12-22-2011 |