Patent application number | Description | Published |
20080305587 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument - A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the surface on which the passivation film is formed; an external electrodes formed on the conductive foil; intermediate layer formed between the passivation film and the conductive foil to support the conductive foil; and wires electrically connecting the electrodes to the conductive foil; wherein a depression tapered in a direction from the conductive foil to the passivation film if formed under a part of the conductive foil that includes the connection with the external electrodes. | 12-11-2008 |
20090026631 | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board - An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device ( | 01-29-2009 |
20090111260 | ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, METHODS OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT - The present invention is a method of manufacturing a semiconductor device, by forming a wiring on or above a wafer so that the wiring is electrically connected to a first electrode disposed on a first surface of the wafer, forming a first resin layer on or above the wafer such that the wiring is disposed between the wafer and the first resin layer, forming an opening in the first resin layer such that the opening overlaps the wiring, forming a conductive member in the opening such that the conductive member being electrically connected to the wiring, forming a second electrode on the conductive member such that the second electrode is electrically connected to the wiring via the conductive member, and separating the wafer into individual elements after the forming of the first resin layer. | 04-30-2009 |
20090117687 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument - A method of manufacturing a semiconductor device forms a penetrating hole in a substrate so that the penetrating hole extends from a first surface of the substrate to a second surface of the substrate being opposite to the first surface. An internal wall surface of the penetrating hole has a protrusion formed of a material constituting the substrate, the first surface of the substrate being closer to the protrusion than the second surface. A conductive member is formed on the first surface so that the conductive member covers the penetrating hole. A semiconductor chip is mounted on the first surface so that an electrode of the semiconductor chip is electrically connected to the conductive member. An external electrode is provided through the penetrating hole so that the external electrode is electrically connected to the conductive member and the external electrode projects from the second surface of the substrate. | 05-07-2009 |
20090174068 | Semiconductor device, circuit board, and electronic instrument - A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device ( | 07-09-2009 |
20090181521 | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument - A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes ( | 07-16-2009 |
20090302467 | ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE, METHOD OF FABRICATING THE SAME, CIRCUIT BOARD MOUNTED WITH THE SAME, AND ELECTRONIC APPLIANCE COMPRISING THE CIRCUIT BOARD - An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor chip with electrodes, a stress-relieving layer prepared on the semiconductor chip, a wire formed across the electrodes and the stress-relieving layer, and solder balls formed on the wire over the stress-relieving layer; and a bare chip as a second semiconductor device to be electrically connected to the first semiconductor device. | 12-10-2009 |
20100240176 | ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, METHODS OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT - The present invention is a method of manufacturing a semiconductor device, by forming a wiring on or above a wafer so that the wiring is electrically connected to a first electrode disposed on a first surface of the wafer, forming a first resin layer on or above the wafer such that the wiring is disposed between the wafer and the first resin layer, forming an opening in the first resin layer such that the opening overlaps the wiring, forming a conductive member in the opening such that the conductive member being electrically connected to the wiring, forming a second electrode on the conductive member such that the second electrode is electrically connected to the wiring via the conductive member, and separating the wafer into individual elements after the forming of the first resin layer. | 09-23-2010 |
20100273311 | ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE, METHOD OF MAKING THE SAME AND METHOD OF MOUNTING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT - A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes ( | 10-28-2010 |
20110079898 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT - A substrate includes an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film. A wiring pattern is adhered to the first surface of the insulating film by an adhesive material. A first portion of the wiring pattern is formed over the penetrating hole, and a part of the adhesive material is formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole. An external electrode contacts the first portion of the wiring pattern and projects through the penetrating hole and extends beyond the second surface of the insulating film. | 04-07-2011 |
20110095422 | ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, METHODS OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT - An electronic component including an electronic element, an electrode that is formed on a first surface of the electronic element, a first resin layer that is formed over the first surface of the electronic element, a wiring that is electrically connected to the electrode, a first portion of the wiring extending over the first resin layer, a second resin layer that is formed over the first resin layer and the wiring, the second resin layer having an opening, the opening overlapping the first portion of the wiring, an external terminal that is provided above the second resin layer, the external terminal being connected to the first portion of the wiring via the opening, and a third resin layer that is formed over the second resin layer, the third resin layer being provided around the external terminal. | 04-28-2011 |
20110095432 | ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE, METHOD OF MAKING THE SAME AND METHOD OF MOUNTING THE SAME, CIRCUIT BOARD AND ELECTRONIC INSTRUMENT - A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a wafer; a step of providing a resin later as a stress relieving layer on the wafer, avoiding the electrodes; a step of forming a chromium layer as wiring from electrodes over the resin layer; and step of forming solder balls as external electrodes on the chromium layer over the resin layer; and a step of cutting the wafer into individual semiconductor chips; in the steps of forming the chromium layer and solder balls, metal thin film fabrication technology is used during the wafer process. | 04-28-2011 |
20110136337 | Method for Manufacturing Semiconductor Device - A method for manufacturing a semiconductor device. The method includes forming an energy cured resin layer on a semiconductor substrate having an electrode pad and a passivation film; fusing the resin layer so that fusion of a surface section is progressed more than of a central section by a first energy supply processing; forming a resin boss by curing and shrinking the resin layer by a second energy supply processing; and forming an electrical conducting layer which is electrically connected to the electrode pad and passes over the resin boss. | 06-09-2011 |
20110180927 | ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE, METHOD OF FABRICATING THE SAME, CIRCUIT BOARD MOUNTED WITH THE SAME, AND ELECTRONIC APPLIANCE COMPRISING THE CIRCUIT BOARD - An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device having a semiconductor chip with electrodes, a stress-relieving layer prepared on the semiconductor chip, a wire formed across the electrodes and the stress-relieving layer, and solder balls formed on the wire over the stress-relieving layer; and a bare chip as a second semiconductor device to be electrically connected to the first semiconductor device. | 07-28-2011 |