Patent application number | Description | Published |
20110083891 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a flexible film; an insulation layer formed on one side of the flexible film; an electronic component mounted on the one side of the flexible film in a face-down manner such that the electronic component is buried in the insulation layer; and a circuit layer including a connecting pattern which is formed on the one side of the flexible film and is connected with a connecting terminal of the electronic component by a connecting member. The electronic component-embedded printed circuit board is advantageous in that the position alignment between the connecting patterns and the connecting terminals is easy and the connection reliability therebetween is high because the connecting patterns formed on a flexible film are directly connected to the connecting terminals of an electronic component using connecting members, and in that the production cost thereof can be reduced because additional rewiring is not required. | 04-14-2011 |
20110083892 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an electronic component-embedded printed circuit board, which includes an insulating base, an insulating layer formed on one surface of the insulating base, an electronic component embedded in the insulating layer so that an active surface of the electronic component having a connection terminal faces the insulating base, a trench formed in the insulating base to expose the connection terminal, and a connection pattern formed and embedded in the trench, and in which the embedded connection pattern is finely formed by an imprinting process and is connected to the connection terminal of the electronic to component, thus obviating a need for an additional redistribution layer and reducing the manufacturing cost. A method of manufacturing such a printed circuit board is also provided. | 04-14-2011 |
20120019455 | TOUCH SCREEN PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a touch screen panel. The touch screen panel includes a substrate, a plurality of first detection patterns, a plurality of second detection patterns, and a plurality of connection prevention layers. Each of the first detection patterns includes a plurality of first detection cells arranged in a single column and a plurality of first connection lines configured to connect first detection cells which are adjacent to each other. Each of the second detection patterns includes a plurality of second detection cells arranged in a single row and a plurality of second connection lines configured to connect second detection cells which are adjacent to each other. Each of the connection prevention layers is located between each of the first connection lines and each of the second connections line at the intersection thereof, and is made of an electrical insulation material. | 01-26-2012 |
Patent application number | Description | Published |
20080252196 | Active-Matrix Field Emission Display - Provided is a field emission display (FED) in which field emission devices are applied to a flat panel display. The FED includes: a cathode plate including a substrate, first and second thin film transistors (TFTs) that are serially connected on the substrate, a field emitter disposed on a drain electrode of the second TFT, a gate insulating layer having a gate hole surrounding the field emitter, and field emission gate electrodes disposed on the gate insulating layer; and an anode plate including a substrate, and red, green, and blue phosphors disposed on the substrate, wherein the cathode plate and the anode plate are vacuum-packaged parallel and opposite to each other. According to the present invention, uniformity of the FED panel can be significantly improved, and an inherent source-drain leakage current of the TFT can be significantly reduced, so that a contrast ratio of the FED can be significantly enhanced. | 10-16-2008 |
20080284314 | Active-Matrix Field Emission Pixel and Active-Matrix Field Emission Display - Provided is a field emission display (FED) capable of driving on the basis of current and preventing leakage current caused by thin film transistors (TFTs). The FED includes: a plurality of unit pixels including an emission element in which cathode luminescence of a phosphor occurs and a TFT for driving the emission element; a current source for applying a scan signal to each unit pixel; and a voltage source for applying a data signal to each unit pixel. Here, the on-current of the current source is high enough to take care of the load resistance and capacitance of a scan row within a given writing time, and the off-current of the current source is so low that the electron emission of each pixel can be ignored. In addition, the pulse amplitude or pulse width of the data signal applied from the voltage source is changed, and thereby the gray scale of the display is represented. | 11-20-2008 |
20080299298 | Methods of Manufacturing Carbon Nanotube (Cnt) Paste and Emitter with High Reliability - Provided are methods of manufacturing carbon nanotube (CNT) paste, to which a nano-sized particle is added, and a CNT emitter with high reliability for a field emission display (FED). The method includes the steps of: (i) dispersing CNT powder in a solvent; (ii) adding an organic binder to the solution in which the CNT powder is dispersed; and (iii) performing a milling process to adjust viscosity of the dispersion solution to which the organic binder is added, wherein a nano-sized metal particle is added in step (i) or (iii). Accordingly, the nano-sized metal particle is added as a metal filler of the CNT paste, and thus a metal may be melted at a low temperature at which CNTs do not deteriorate. Thus, adhesion between the CNT paste and a cathode may be improved, and resistance between the cathode and the CNT or between CNTs may be reduced. Further, the CNT paste manufactured by the above method is employed in manufacturing the CNT emitter to thereby obtain uniform emission of electrons from the CNT emitter and increase electron emission sites, and thus the reliability of the CNT emitter may be further improved. | 12-04-2008 |
20100225225 | FIELD EMISSION BACK LIGHT UNIT, CATHODE STRUCTURE THEREOF AND METHOD FOR FABRICATING THE SAME - Provided is a field emission device, and more particularly, a field emission back light unit which makes an interconnection connected with an external electrode simple and capable of local dimming. To this end, a cathode structure for the field emission back light unit includes a plurality of data electrodes formed on a cathode substrate and spaced apart from one another, an insulating layer formed on the data electrodes, and having exposure regions exposing the predetermined data electrodes, cathode electrodes formed on the insulating layer and electrically connected with the data electrodes through the exposure regions, and at least one field emitter formed on the cathode electrodes, wherein a cathode block is defined based on the cathode electrodes electrically isolated from one another, and brightness of each cathode block can be controlled according to current supplied through the data electrode. | 09-09-2010 |
20100231119 | THE FIELD EMISSION DEVICE WITH FINE LOCAL DIMMING - Provided is a field emission device (FED) capable of fine local dimming. In the FED, a cathode substrate is comprised of a plurality of cathode layers, and a plurality of interconnections are disposed on each of the cathode layers, so that fine local dimming is enabled using a plurality of cathode blocks without limiting the number of the cathode blocks. Also, since RC delays of the respective cathode blocks can be synchronized according to the design of the interconnections, current control signals can be simultaneously transmitted to the respective cathode blocks, thereby improving the characteristics of the FED. | 09-16-2010 |
20100260321 | DISCRETELY ADDRESSABLE LARGE-AREA X-RAY SYSTEM - A discretely addressable large-area X-ray system is provided. The large-area X-ray system can output a uniform flux of X-rays over a large area using discrete addressing operation of transistors connected to cathodes of electron emitters. Thus, when applied to a medical device, the system can minimize damage inflicted upon the human body because it enables effective imaging of only a desired specific portion of the body. Furthermore, the large-area X-ray system can be simply implemented by current switching using transistors. Thus, the system can be very easily applied to other applications. | 10-14-2010 |
20110116603 | MICROMINIATURE X-RAY TUBE WITH TRIODE STRUCTURE USING A NANO EMITTER - A microminiature X-ray tube with a triode structure using a nano emitter is provided, which can increase a field emission region as much as possible by means of nano emitters fine-patterned in a cathode to not only increase an emission current per unit area as much as possible but secure high electrical characteristics, reliability, and structural stability by means of a cover and a bonding material. In addition, gate holes having a macro structure can be formed in the gate to promote electron beam focusing by means of the gate without using a separate focusing electrode and to prevent a leakage current from occurring on the gate. Further, an auxiliary electrode can be formed on a top or an inner surface of a cover applied for structural stability to further promote the electron beam focusing and to control the output amounts per individual X-ray tubes output according to current switching to be equal to each other. | 05-19-2011 |
20120097958 | ACTIVE-MATRIX FIELD EMISSION PIXEL - A field emission pixel includes a cathode on which a field emitter emitting electrons is formed, an anode on which a phosphor absorbing electrons from the field emitter is formed, and a thin film transistor (TFT) having a source connected to a current source in response to a scan signal, a gate receiving a data signal, and a drain connected to the field emitter. The field emitter is made of carbon material such as diamond, diamond like carbon, carbon nanotube or carbon nanofiber. The cathode may include multiple field emitters, and the TFT may include multiple transistors having gates to which the same signal is applied, sources to which the same signal is applied, and drains respectively connected to the field emitters. An active layer of the TFT is made of a semiconductor film such as amorphous silicon, micro-crystalline silicon, polycrystalline silicon, wide-band gap material like ZnO, or an organic semiconductor. | 04-26-2012 |
20140029728 | High-Efficiency Flat Type Photo Bar Using Field Emitter and Manufacturing Method Thereof - A high-efficiency flat type photo bar using a field emitter and a manufacturing method thereof, including: a substrate; a cathode part which is formed as an electrode on an upper portion of the substrate; a nano-field emitter which is patterned at a constant interval on the cathode part; a gate part which is formed horizontally to the cathode part so as to induce the emission of electrons from the field emitter; and an anode part which is insulated and separated from an upper portion of the gate part so as to be formed horizontally to the upper portion of the gate part and comprises a target material. | 01-30-2014 |
Patent application number | Description | Published |
20080296577 | Camera module package - There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability. | 12-04-2008 |
20080296714 | Wafer level package of image sensor and method for manufacturing the same - Provided is a wafer level package of an image sensor capable of simply and easily packaging an image sensor in a packaging process, and a method for manufacturing the same. The wafer level package of an image sensor includes a lower substrate including an image sensor, a conductive pattern coupled to the image sensor, and a plurality of vias coupled to the conductive pattern; a micro lens array film having a plurality of micro lenses corresponding to the image sensor, the micro lenses being formed on the lower substrate; and a sealing line surrounding the image sensor while being spaced apart from the image sensor and being in contact with an upper substrate. The wafer level package may be useful to have an electrical connection structure using vias without any need to a bonding wire, an electrode pad and an electrode lead in the conventional wafer level package since a packaging process is carried out by bonding a wafer for an upper substrate with a plurality of the vias being provided in a wafer for a lower substrate | 12-04-2008 |
20140048199 | ADHESIVE TAPE AND METHOD FOR PRODUCING SUBSTRATE USING THE SAME - There are provided an adhesive tape and a method for producing a substrate using the same. The adhesive tape including: a reinforcement layer supporting the adhesive tape; a buffer layer formed on one surface of the reinforcement layer and performing a buffering operation; and an adhesive layer formed on one surface of the buffer layer. | 02-20-2014 |
20140120291 | LAMINATED BASE MATERIAL, SUBSTRATE USING LAMINATED BASE MATERIAL, AND METHOD OF MANUFACTURING SUBSTRATE - There are provided a laminated base material, a substrate using the laminated base material, and a method of manufacturing the substrate. The laminated base material includes: an insulating base; an adhesive layer formed on an upper surface of the insulating base and having adhesive properties at room temperature; and a release film formed on an upper surface of the adhesive layer. | 05-01-2014 |
20140352883 | ADHESIVE COMPOSITION FOR OPTICAL DEVICE AND ADHERING METHOD USING THE SAME - This invention relates to an adhesive composition for an optical device, including pigment balls having a core-shell structure, a thermocurable monomer or oligomer, a photocurable monomer or oligomer, a photoinitiator and a thermal initiator, and to a method of adhering an optical device using the adhesive composition. The adhesive for an optical device according to this invention can improve light shielding and photocuring properties. | 12-04-2014 |