Sarraf
David Sarraf, Elizabethtown, PA US
Patent application number | Description | Published |
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20110176276 | CTE-MATCHED HEAT PIPE - Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices. | 07-21-2011 |
20130074328 | METHODS AND SYSTEMS FOR FORMING ELECTRONIC MODULES - A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate. | 03-28-2013 |
David Bruce Sarraf, Berwyn, PA US
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20160062065 | Connector For Receiving Plug and Connector Assembly - A connector is provided and includes a cage, a plurality of partition devices, and a heat dissipation device. The cage includes a plurality of plug receiving units that are arranged in at least a two columns by two rows arrangement. The plurality of partition devices include an upper partition plate and a lower partition plate and is positioned between two adjacent plug receiving units of the plurality of plug receiving units. The heat dissipation device includes a heat conduction block positioned between the upper partition plate and the lower partition plate, and a heat conduction pipe that contacts the heat conduction block and extends beyond a rear wall of the cage. | 03-03-2016 |
David Bruce Sarraf, Elizabethtown, PA US
Patent application number | Description | Published |
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20130161083 | PRINTED CIRCUIT BOARDS AND METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS - A printed circuit board includes a substrate having a first surface, a first conductive circuit deposited on the first surface and a dielectric cover deposited on the first surface and covering at least a portion of the first conductive circuit. The dielectric cover has an edge and the first surface is exposed beyond the edge. A second conductive circuit is deposited on the dielectric cover and the substrate. The second conductive circuit spans the edge such that at least part of the second conductive circuit is deposited on the dielectric cover and at least part of the second conductive circuit is deposited on the first surface. | 06-27-2013 |
20130163483 | CONTACTLESS CONNECTOR - A contactless connector includes a transmitter having a first transmit integrated circuit generating a first signal and a second transmit integrated circuit generating a second signal. A first pick-up antenna is adjacent the first transmit integrated circuit and conveys the first signal along a first transmission line to a first propagation antenna. A second pick-up antenna is adjacent the second transmit integrated circuit and conveys the second signal along a second transmission line to a second propagation antenna. The first and second propagation antennas transmit the first and second signals to a propagation path at different and separable polarizations to allow duplex communication with the propagation path. | 06-27-2013 |
20140097691 | INTELLIGENT POWER SENSING DEVICE - The power sensing device includes a power input interface in electrical communication with a current sensing circuit and a voltage sensing circuit. The current sensing circuit is connected to a load. The voltage sensing circuit is connected in parallel with the load. A metering integrated circuit and a micro-controller unit (MCU) are included. The metering integrated circuit receives a first analog signal indicating a load current value from the current sensing circuit, and a second analog signal indicating a load voltage value from the voltage sensing circuit. The metering integrated circuit converts first and second analog input signals to first and second digital signals, respectively, and generates the first and second digital signals as digital communication pulses to the MCU. A decoder circuit includes a communications port to send and receive data associated with a sensed current parameter and a sensed voltage parameter. | 04-10-2014 |
20140144674 | ELECTRICAL COMPONENTS AND METHODS OF MANUFACTURING ELECTRICAL COMPONENTS - An electrical component includes a substrate having a circuit area and a sacrificial area. A lift-off layer is deposited on the substrate in the sacrificial area. A seed layer is deposited on the substrate in the circuit area and on the lift-off layer in the sacrificial area. A plating layer is electrodeposited on the seed layer. The plating layer forms a circuit in the circuit area. The plating layer forms plating electrodes in the sacrificial area. The lift-off layer is removable from the substrate. The seed layer and the plating layer on the lift-off layer are removed with the lift-off layer when the lift-off layer is removed from the substrate, leaving the circuit on the substrate. The lift-off layer may be dissolved after the plating layer is formed, where the plating layer deposited on the lift-off layer is removed as the lift-off layer is dissolved. | 05-29-2014 |
20140328036 | ELECTRONIC DEVICE - An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body. | 11-06-2014 |
20150043115 | SOLID STATE RELAY PROTECTIVE DEVICE - An electrical circuit for protection of a solid-state relay includes a switch element connected between an input signal source and an input terminal of the solid-state relay. The solid-state relay includes an output terminal for connection to a load. A sensing element is associated with the solid-state relay to sense an operating parameter associated with the solid-state relay. A feedback element controls the switch element to switch an operating state in response to the operating parameter exceeding a reference parameter. The solid-state relay changes state in response to the switch element to control an output current of the solid-state relay between an energized or de-energized state. | 02-12-2015 |
20160086000 | CONNECTOR MODULE - A connector module includes a housing and a conductive lead frame. The housing includes a cover and a base that define a cavity therebetween. The cavity receives a circuit card therein. The base has a top side and a bottom side. The top side faces the cover and defines part of the cavity. Multiple windows extend through the base between the top and bottom sides. The base includes a conductive layer at least partially covered by a non-conductive layer. The conductive lead frame is coupled to the bottom side of the base. The lead frame includes multiple contact beams that extend into the cavity through the windows of the base. The lead frame is electrically isolated from the conductive layer of the base by the non-conductive layer of the base. The lead frame further includes mounting contacts configured to be mounted to conductive components of a circuit board. | 03-24-2016 |
John Todd Sarraf, Kennett Square, PA US
Majid Sarraf, Aliso Viejo, CA US
Patent application number | Description | Published |
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20100319271 | Ductile Seismic Shear Key - A ductile seismic shear key construction including a concrete support, a concrete shear key supported on the concrete support, a generally vertical reinforcement bar in and extending between the concrete support and the concrete shear key and anchored in the concrete support, and an isolation key. The isolation key is in and at the base of the concrete support and adjacent the reinforcement bar. The bar can be one of the two legs of a downwardly-disposed U-shaped bar. The other leg, if present, is also in and extends between the concrete support and the shear key and is anchored in the concrete support; and a second isolation key is in the concrete support at the base thereof and adjacent the second leg. The bars can pass through through-holes in the isolation keys, particularly for an interior shear key construction. For an exterior shear key construction the bars can be disposed in notches of the isolation key. Horizontal reinforcement bars can be placed perpendicular to the vertical bars (legs) and directly above the isolation key(s) and secured to the vertical bars. | 12-23-2010 |
Mohammad Sarraf, Trabuco Canyon, CA US
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20140362516 | COMPONENT PLACEMENT WITHIN A SOLID STATE DRIVE - A component mount for a data storage device (DSD). The component mount includes a flexible member or printed circuit board assembly (PCBA) including a pad for electrically connecting to a printed circuit board (PCB) of the DSD. At least one capacitor is mounted on the flexible member or PCBA, and is electrically connected with the pad. | 12-11-2014 |
Mohsen Sarraf, Rumson, NJ US
Patent application number | Description | Published |
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20080304677 | SYSTEM AND METHOD FOR NOISE CANCELLATION WITH MOTION TRACKING CAPABILITY - A system and method for noise cancellation is disclosed herein generally having at least one microphone, a processor, and a speaker array. The processor may contain an adaptive filtering feature, to separate desirable sound from undesirable sound. The undesirable sound may be suppressed by the processor by creating a canceling waveform and transmitting the canceling waveform to the user's head via a speaker array. The desirable sound may be enhanced by increasing the amplitude of the waveform and transmitting the amplified waveform to the user's head via a speaker array. The sound transmitted to the user's head by the system may be localized using an image tracking subsystem and speaker array. The image tracking system may track the actual visible image or alternatively a heat (e.g. infrared) image of the user's head. | 12-11-2008 |
20090086761 | DYNAMICALLY AND ON-DEMAND SELECTED ANCILLARY DATA OVER COMPRESSED MULTIMEDIA PACKETS WITHOUT BANDWIDTH EXPANSION - A system and method for providing ancillary data over compressed multimedia packets. Ancillary data may be added to encoded or compressed packets without increasing the bandwidth required to transmit the packets over a transmission medium. After transmission, the ancillary data can be recovered and the packets restored to their original form without any loss of data or damage to original content. The ancillary data can be presented to a user on-demand, or in response to an event. The content of the ancillary data can also be correlated to the type of event that initiated the delivery or to the content of the encoded or compressed packets. | 04-02-2009 |
Natalie Levy Sarraf, Santa Monica, CA US
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20090254030 | Oral Medication Bottle with Detachable Oral Syringe - A bottle for dispensing oral medication has a concavity in its side wall for partially receiving the cylindrical cross section of an oral medication syringe, and also has a syringe holder integrally formed with the bottle for retaining the syringe in the concavity, thereby to keep the syringe assembled to the bottle and readily available for dispensing the medication in the bottle. The concavity and the syringe holder may take different forms, including clip arms and holder sleeves integral with the bottle. The bottle and syringe make a compact assembly for convenient packaging, storage and handling. | 10-08-2009 |
Riad Sarraf, Querqueville FR
Patent application number | Description | Published |
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20150284298 | Process for the manufacture of a grout for concrete - The present invention relates to a process for the manufacture of a grout for concrete comprising a stage of mixing a hydraulic binder and water, characterized in that the process comprises a stage of deep freezing the water in the solid form. | 10-08-2015 |