Si-Hoon
Si-Hoon Lee, Yongin-Si KR
Patent application number | Description | Published |
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20080315437 | Tape wiring substrate and chip-on-film package using the same - A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having upper and lower surfaces. Vias may penetrate the film. An upper metal layer may be provided on the upper surface of the film and include input terminal patterns and/or output terminal patterns. The input terminal patterns may include ground terminal patterns and/or power terminal patterns. A lower metal layer may be provided on the lower surface of the film and include a ground layer and/or a power layer. The ground layer and the power layer may cover at least a chip mounting area. | 12-25-2008 |
20100149775 | Tape circuit substrate with reduced size of base film - A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate. | 06-17-2010 |
Si-Hoon Lee, Suwon-Si KR
Patent application number | Description | Published |
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20090273076 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same - Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component. | 11-05-2009 |
20110143625 | TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATING MEMBER, AND ELECTRONIC APPARATUS INCLUDING THE SAME - Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component. | 06-16-2011 |
Si-Hoon Lee, Gyeonggi-Do KR
Patent application number | Description | Published |
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20080303148 | PAD ARRANGEMENT OF DRIVER IC CHIP FOR LCD AND RELATED CIRCUIT PATTERN STRUCTURE OF TAB PACKAGE - Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size. | 12-11-2008 |
Si-Hoon Lee, Gyeyang-Gu KR
Patent application number | Description | Published |
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20110134151 | METHOD FOR DIVIDING DISPLAY AREA FOR LOCAL DIMMING, LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME, AND METHOD FOR DRIVING THE LIQUID CRYSTAL DISPLAY DEVICE - A method for dividing a display area for local dimming of LCD is disclosed. The method includes determining an initial number of pixels per data analysis area and a total number of residual pixels, calculating a first residual pixel sum of a current data analysis area using the total number of residual pixels and a second residual pixel sum of a previous data analysis area, determining whether to assign a residual pixel to the current data analysis area using the first residual pixel sum and the total number of data analysis areas, calculating a second residual sum of the current data analysis area whether to assign a residual pixel, and repeating the calculation above until the data analysis area index is a last data analysis area index. | 06-09-2011 |