Patent application number | Description | Published |
20090168088 | Active electronic media device packaging - Active packaging for supplying power, data, or both power and data to an electronic media device while the device is housed within the active packaging is provided. The active packaging may include one or more electrical traces in-molded or printed onto the packaging that couple to a suitable connector on the device. Power may also be provided via one or more wireless power techniques. Multiple active packages may be conductively stacked to transmit power, data, or both power and data to a row or stack or devices. POM sensors integrated with or attached to the device (or the active packaging itself) may detect various movement events. Coordinated and synchronized display effects may be presented while the devices are housed within the active packaging. | 07-02-2009 |
20120081213 | ACTIVE ELECTRONIC MEDIA DEVICE PACKAGING - Active packaging for supplying power, data, or both power and data to an electronic media device while the device is housed within the active packaging is provided. The active packaging may include one or more electrical traces in-molded or printed onto the packaging that couple to a suitable connector on the device. Power may also be provided via one or more wireless power techniques. Multiple active packages may be conductively stacked to transmit power, data, or both power and data to a row or stack or devices. POM sensors integrated with or attached to the device (or the active packaging itself) may detect various movement events. Coordinated and synchronized display effects may be presented while the devices are housed within the active packaging. | 04-05-2012 |
20130127488 | CONFIGURABLE TESTING PLATFORMS FOR CIRCUIT BOARDS WITH REMOVABLE TEST POINT PORTION - Circuit boards are provided that include a functional portion and at least one removable test point portion. The removable test point portion may include test points which are accessed to verify whether the functional portion is operating properly or whether installed electronic components are electrically coupled to the board. If multiple boards are manufactured together on a single panel (in which the individual boards are broken off), the test points can be placed on bridges (e.g., removable portions) that connect the individual boards together during manufacturing and testing. Configurable test boards are also provided that can be adjusted to accommodate circuit boards of different size and electrical testing requirements. Methods and systems for testing these circuit boards are also provided. | 05-23-2013 |
20130194062 | Active Electronic Media Device Packaging - Active packaging for supplying power, data, or both power and data to an electronic media device while the device is housed within the active packaging is provided. The active packaging may include one or more electrical traces in-molded or printed onto the packaging that couple to a suitable connector on the device. Power may also be provided via one or more wireless power techniques. Multiple active packages may be conductively stacked to transmit power, data, or both power and data to a row or stack or devices. POM sensors integrated with or attached to the device (or the active packaging itself) may detect various movement events. Coordinated and synchronized display effects may be presented while the devices are housed within the active packaging. | 08-01-2013 |
20140274175 | Active Electronic Media Device Packaging - Active packaging for supplying power, data, or both power and data to an electronic media device while the device is housed within the active packaging is provided. The active packaging may include one or more electrical traces in-molded or printed onto the packaging that couple to a suitable connector on the device. Power may also be provided via one or more wireless power techniques. Multiple active packages may be conductively stacked to transmit power, data, or both power and data to a row or stack or devices. POM sensors integrated with or attached to the device (or the active packaging itself) may detect various movement events. Coordinated and synchronized display effects may be presented while the devices are housed within the active packaging. | 09-18-2014 |
Patent application number | Description | Published |
20090096683 | Handheld electronic devices with antenna power monitoring - Handheld electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include an antenna. A radio-frequency coupler may be coupled to the antenna. Transceiver circuitry may be used to transmit and receive radio-frequency signals through the coupler and the antenna. A reflected power detection circuit may be connected to the coupler. When the transceiver circuitry transmits radio-frequency signals, some of the signals are reflected back from the antenna into the coupler. The coupler directs the reflected antenna signals into the reflected power detection circuit. Processing circuitry may analyze a reflected power signal from the reflected power detection circuit to determine whether operation of the antenna is being disrupted by the placement of a user's hand over the antenna or other proximity effects. If antenna operation is being disrupted, the user may be alerted or other suitable actions may be taken. | 04-16-2009 |
20090182913 | Data store and enhanced features for headset of portable media device - A media headset for exchanging data with a media device includes at least one audio speaker that provides an audio output, a data store that stores media device data, a communications interface for exchanging the media device data with the media device, and a connector for detachably connecting the communications interface to the media device. | 07-16-2009 |
20090185045 | DUAL-PURPOSE HARDWARE APERTURE - Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture. | 07-23-2009 |
20090205200 | TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL - A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together. | 08-20-2009 |
20100139085 | TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL - A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together. | 06-10-2010 |
20120002097 | DUAL-PURPOSE HARDWARE APERTURE - Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture. | 01-05-2012 |
20140055660 | DUAL-PURPOSE HARDWARE APERTURE - Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture. | 02-27-2014 |
Patent application number | Description | Published |
20090167699 | TOUCH SCREEN RFID TAG READER - The efficient incorporation of RFID circuitry within touch sensor panel circuitry is disclosed. The RFID antenna can be placed in the touch sensor panel, such that the touch sensor panel can now additionally function as an RFID transponder. No separate space-consuming RFID antenna is necessary. Loops (single or multiple) forming the loop antenna of the RFID circuit (for either reader or tag applications) can be formed from metal on the same layer as metal traces formed in the borders of a substrate. Forming loops from metal on the same layer as the metal traces are advantageous in that the loops can be formed during the same processing step as the metal traces, without requiring a separate metal layer. | 07-02-2009 |
20100078230 | INTEGRATED TOUCH SENSOR AND SOLAR ASSEMBLY - Integrated touch sensor and solar panel configurations that may be used on portable devices, particularly handheld portable devices such as a media player or phone are disclosed. The integrated touch sensor array and solar cell stack-ups may include electrodes that are used both for collecting solar energy and for sensing on a touch sensor array. By integrating both the touch sensors and the solar cell layers into the same stack-up, surface area on the portable device may be conserved. In addition to being used for capacitive sensing, the integrated touch sensor and solar panel configurations may also be used for optical sensing. | 04-01-2010 |
20100079387 | INTEGRATED TOUCH SENSOR AND SOLAR ASSEMBLY - Integrated touch sensor and solar panel stack-up configurations that may be used on portable devices, particularly handheld portable devices such as a media player or phone are disclosed. The solar cell stack-up configurations may include one or more touch sensor layers and one or more solar cell layers. By integrating both the touch sensors and the solar cell layers into the same stack-up, surface area on the portable device may be conserved. The solar panel may be mounted face down or otherwise obstructed by a touch sensor or other component. In this configuration, the device may include light channels that allow light into the device and direct the light around the component and to the solar panel. A parabolic reflector may be used to direct the light. | 04-01-2010 |
20140325370 | SYSTEMS AND METHODS FOR IDENTIFYING OBJECTS AND PROVIDING INFORMATION RELATED TO IDENTIFIED OBJECTS - Systems and methods for identifying an object and presenting additional information about the identified object are provided. The techniques of the present invention can allow the user to specify modes to help with identifying objects. Furthermore, the additional information can be provided with different levels of detail depending on user selection. Apparatus for presenting a user with a log of the identified objects is also provided. The user can customize the log by, for example, creating a multi-media album. | 10-30-2014 |