Patent application number | Description | Published |
20140013529 | DUAL ACTION BOTTLE BRUSH - A brush assembly for use in cleaning baby bottles and component parts associated therewith including a handle and top brush portion, the top brush portion having a plurality of cleaning elements and a recessed cavity, the handle being releasably attachable to the top brush portion and including a nipple brush, the nipple brush being receivable within the recessed cavity when the top brush portion is releasably attached to the handle. The handle further includes an ergonomic outer grip surface allowing for secure, comfortable gripping when the brush assembly is in use. When the top brush portion is removed from the handle, the nipple brush is exposed and available for use. The cleaning elements may include at least one scrubbing element. | 01-16-2014 |
20140013609 | BOTTLE DRYING RACK - A drying rack assembly for drying and storing baby bottles and other component parts of baby bottles thereon including a base housing having an air duct inlet and a fan associated therewith, and at least one trunk module having at least one branch associated therewith, each trunk module having a passageway extending therethrough in communication with the air duct inlet and each branch having a passageway extending therethrough in communication with a trunk passageway. The fan is positioned in the vicinity of the air duct inlet for directing the flow of air through said at least one trunk module and through said at least one branch to assist in drying an item positioned on said branch. A plurality of trunk modules can be assembled in a modular configuration to increase the storage capacity of the overall assembly. | 01-16-2014 |
20140013610 | DRYING WAND - A drying wand for drying baby bottles and their component parts including a handle and top portion, the top portion having a plurality of petal shaped elements attached thereto in a radial configuration, the petal shaped elements being preferably formed from a microfiber material for more efficiently drying baby bottles and parts thereof. The handle further includes an ergonomic outer grip surface allowing for secure, comfortable gripping when the drying wand is in use. | 01-16-2014 |
20140014605 | DISHWASHER BASKET - A dishwasher basket for use within an existing dishwasher for holding baby items including a main basket, at least one side basket housed within the main basket and being selectively extendable from a position within the main basket to a second position extending at least partially outside of the main basket, a lid member hingedly secured to the main basket, and a midplate member removably positionable within the main basket and located between the at least one side basket and the lid member. Each side basket includes a plurality of straw openings associated with a cover member and a plurality of cone shaped members associated with the side basket for holding a straw in an upright position within the side basket. | 01-16-2014 |
Patent application number | Description | Published |
20080237591 | Vertical system integration - The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs. | 10-02-2008 |
20080251941 | Vertical system integration - The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs. | 10-16-2008 |
20080254572 | Vertical system integration - The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs. | 10-16-2008 |
20080284611 | Vertical system integration - The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs. | 11-20-2008 |
Patent application number | Description | Published |
20130187290 | Three dimensional structure memory - A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques. | 07-25-2013 |
20130265067 | Three dimensional memory structure - The Configurable Vertical Integration [CVI] invention pertains to methods and apparatus for the enhancement of yields of 3D or stacked integrated circuits and herein referred to as a CVI Integrated Circuit [CVI IC]. The CVI methods require no testing of circuit layer components prior to their fabrication as part of a 3D integrated circuit. The CVI invention uses active circuitry to configure the CVI IC as a means to isolate or prevent the use of defective circuitry. CVI circuit configuration method can be predominately described as a large grain method. | 10-10-2013 |
20130320341 | Three dimensional memory structure - A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques. | 12-05-2013 |
20130320563 | Three dimensional memory structure - A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques. | 12-05-2013 |
20140021639 | Vertical System Integration - The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs. | 01-23-2014 |
20140043883 | Three dimensional structure memory - A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques. | 02-13-2014 |
20140134950 | Vertical System Integration - The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs. | 05-15-2014 |
20140346649 | Three dimension structure memory - A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques. | 11-27-2014 |
20140361806 | Configurable Vertical Integration - The Configurable Vertical Integration [CVI] invention pertains to methods and apparatus for the enhancement of yields of 3D or stacked integrated circuits and herein referred to as a CVI Integrated Circuit [CVI IC]. The CVI methods require no testing of circuit layer components prior to their fabrication as part of a 3D integrated circuit. The CVI invention uses active circuitry to configure the CVI IC as a means to isolate or prevent the use of defective circuitry. CVI circuit configuration method can be predominately described as a large grain method. | 12-11-2014 |
Patent application number | Description | Published |
20120175813 | Shoe Customization System Having Interchangeable Platens - Heat press platens for a shoe customization/decoration system and a method of using the same are disclosed. The platens may be quickly interchanged to allow the same equipment to be used to dye shoes of different sizes. The platens individually accommodate a pair of assembled shoes and are shaped to: reduce print sizes, maintain symmetry and flatness of the shoe, and accommodate a range of shoe sizes. The size and shape of the platens enable one shoe to be fitted on one side of a platen and another shoe to be fitted on the opposite side. The platens position the shoes so that they are mirror images of each other. This positioning allows a single print, including mirror images of the same design, to be applied to two shoes at the same time. | 07-12-2012 |
20130258085 | Foot Imaging and Measurement Apparatus - An apparatus for obtaining an image and measurements of a foot is disclosed. The apparatus includes a housing holding a plate with a top surface to allow a user to stand on the apparatus. Within the interior of the housing is a compact mirror assembly arrangement that includes a plurality of mirrors to reflect the image of the foot from the top surface of the plate to at least one camera within the interior of the housing. The compact mirror assembly includes a top-facing mirror running along the longitudinal direction of the housing at an angle to the bottom surface. The top-facing mirror reflects the image of the foot from the top surface towards an angled mirror. The angled mirror is perpendicular to the bottom surface and is angled facing the top-facing mirror. The angled mirror reflects the image of the foot reflected from the top-facing mirror towards the camera. | 10-03-2013 |
20140232040 | Shoe Customization System Having Interchangeable Platens - Heat press platens for a shoe customization/decoration system and a method of using the same are disclosed. The platens may be quickly interchanged to allow the same equipment to be used to dye shoes of different sizes. The platens individually accommodate a pair of assembled shoes and are shaped to: reduce print sizes, maintain symmetry and flatness of the shoe, and accommodate a range of shoe sizes. The size and shape of the platens enable one shoe to be fitted on one side of a platen and another shoe to be fitted on the opposite side. The platens position the shoes so that they are mirror images of each other. This positioning allows a single print, including mirror images of the same design, to be applied to two shoes at the same time. | 08-21-2014 |
20150075036 | Ventilation System For An Article Of Footwear - A ventilation system for an article of footwear is disclosed. The ventilation system may be configured to direct air from outside the article of footwear to the inside of the article of footwear. The ventilation system may include a sole layer and a sockliner configured to lie on top of the sole layer. One or more paths may be formed within the sole layer to provide a pumping mechanism during the normal course of providing cushioning for the user. The paths may be activated by forefoot or heel based pressure to force air from the exterior of the article of footwear to a sockliner directly above the sole layer. An air inlet extending through a sidewall of the sole layer may allow air to enter the path from outside the article of footwear. An opening in the sockliner may allow air inside the path to enter inside the article of footwear. | 03-19-2015 |