Patent application number | Description | Published |
20080272572 | Composite Carbon Fiber Bicycle Crank and Its Method of manufacture - A method of manufacture of forming a composite carbon fiber bicycle crank includes providing a hollow carbon fiber body, with the body including a first opening at one end and the second opening at the other end, mounting a first connecting member and a second connecting member in the first opening and the second opening of the body respectively, wrapping carbon fiber yarn made up of carbon yarn around the assembly of the body and the first and second connecting members, wrapping carbon fiber polymer, and performing hot embossing. | 11-06-2008 |
20090250995 | Composite Carbon Fiber Wheel Rim and Method of Making Thereof - A composite carbon fiber wheel rim of a tubular type comprises a friction-resisting rim body having an inner and outer circumferential periphery, and an inner rim body being disposed along the inner circumferential periphery of the friction-resisting rim body. A method for making such a wheel rim comprises forming a friction-resisting rim body, mounting inner rim body to the friction-resisting rim body, and making the friction-resisting rim body and the inner rim bodies as an integral piece. A composite carbon fiber wheel rim of a clincher type further comprises an outer rim disposed along the outer circumferential periphery. Accordingly, the outer rim is mounted to the friction-resisting rim body while mounting the inner rim. | 10-08-2009 |
20120056468 | Carbon Bodied Bicycle Rim with Ceramic Brake Portion - According to the present invention, a carbon bodied bicycle rim with ceramic brake portion comprises a carbon bodied bicycle rim and a protective film thermal sprayed on the carbon bodied bicycle. The carbon bodied bicycle rim includes two brake portion respectively formed on two sides thereof. Each brake portion has an outer surface. The protective film is thermal sprayed on the outer surface of the brake portion, by which the brake portion has a characteristic of wear-resisting and thermal dissipation. The protective film includes an aluminum layer thermal sprayed on the brake portion and a ceramic layer thermal sprayed on the aluminum layer. | 03-08-2012 |
Patent application number | Description | Published |
20090128046 | Rectifier module for LED lamp strings - A rectifier module is provided for simultaneous use with a plurality of light-emitting diode (LED) lamp strings. The rectifier module includes an extension cable having first and second ends to which first and second connectors are mounted and a casing mounted to the extension cable and including therein an electronic circuit. The electronic circuit includes a rectifier element, which can be a diode based circuit or a bridge rectifier, to which a resistor and a capacitor are electrically connected. The resistor can be a variable resistor to allow for manual adjustment. The casing can be mounted to a middle portion of the extension cable or, if desired, can be integrated with either one of the connectors. | 05-21-2009 |
20090167198 | Light string having shunt circuitry arranged on husk of light bulb assembly - Provided is a light string with a light bulb having additional shunt circuitry. The light string is comprised by a plurality of light bulb units electrically interconnected by conductive wires. Each light bulb unit includes a socket assembly in which a husk along with a light bulb is electrically assembled, each light bulb arranged with switching diode or resistor so as to configure a shunt circuitry. Accordingly, the current flows through the additional shunt circuitry configured by the switching diode or resistor arranged on the husk when the light bulb is fallen, broken or the tungsten filament and shunt circuitry within the light bulb is broken, such that the remaining light bulbs can still functionally work. | 07-02-2009 |
20110116274 | ACCESSORY SERVING AS DECORATION AND DECORATION SUPPORT FOR LIGHT-EMITTING DIODE (LED) BULB STRING - An accessory is provided for a light-emitting diode (LED) bulb string. The accessory has a projection portion having a proximal end mounted to a bottom plate and forming a bore for receiving an LED bulb of the bulb string. The bore has a tapering section for securely engaging and thus holding the bulb. The plate has an end remote from the projection portion and forming an end hook for easily engaging and thus mounting the accessory to a Christmas tree. The projection portion has a distal end forming a multiple-facet refraction/diffraction body. The projection portion may serve as a light guide to guide light from the bulb to the distal end thereof and thus the accessory itself may serve as a decoration. The projection portion may be additionally fit into a bore defined in an external, light-transmitting decorative article to support the decorative article at a desired orientation. | 05-19-2011 |
20130182439 | LED LIGHT STRING - A design of light string comprises a bulb socket, a pair of conductive wires, and LED electrically disposed onto the bulb socket. The LED is incorporated with a pair of legs which are alternatively in contact with the pair of conductive wires, and then are sandwiched between a pair of first and second casings which jointly configures the light bulb. This configuration simplifies the assembling of the conductive wires and LED such that no need of solder or glue or contacts. | 07-18-2013 |
20130183875 | SOCKET HAVING SYMMETRICALLY ARRANGED FIRST AND SECOND CASINGS WITH INTERLOCKING ARRANGEMENTS TO DEFINE A LED SEAT - An socket for light string is provided to include a pair of symmetrically arranged first and second casings mated together. Each of the first and second casings is featured with a side opening, and a first and second end channels, interlocking arrangements provided at internal wall thereof so as to securely interlock the first and second casings to configure the socket with a LED seat formed by the openings to host an LED, and passages for securely receiving conductive wires configured by the first and second channels. A partition is provided under the LED seat so as to insulatively isolated the conductive wires. Inner surfaces of the channels are provided with teeth to firmly hold the conductive wires. The socket is preferable for the use of configuring a light string. | 07-18-2013 |
20140313723 | LED LIGHT STRING - An LED light string includes a socket, electrical wires, and an LED-based luminous element. The LED luminous element has two conductive terminals respectively set in abutting contact with or to pierce through the electrical wires. The socket is composed of two unsymmetrical casing members. The electrical wires and the luminous element are first placed in the first casing member and then, the second casing member is fit to and attached to the first casing member. Ultrasonic wave is then applied to achieve secure coupling of the light string. | 10-23-2014 |
20140315445 | SOCKET FOR LED LIGHT STRING - A socket is provided for an LED light string and is formed by jointing two unsymmetrical casing members through thermal fusion by application of ultrasonic wave to thereby securely combine with electrical wires and a luminous element. The first and second casing members are provided with raised-and-recessed inter-engageable structures including holes and protrusions and multiple tiny bosses that is thermally fusible through application of ultrasonic wave for adhesion purposes. The first casing member includes a receiving channel for receiving electrical wires therein and the second casing member includes hold-down blocks and holding blocks for holding the electrical wires in position. | 10-23-2014 |
20140321104 | STRUCTURE OF TREE-SHAPED LIGHTING DECORATION - A structure of tree-shaped lighting decoration includes an extension cable assembly, which is a modularized assembly adapted to carry a regular voltage supplied from an electric main and has an end forming a cylindrical socket and an opposite end forming a cylindrical plug, a tree-segment tube having an end section forming a retention tubular section that has a reduced portion for positioning and retaining the cylindrical socket, an ancillary component including a conical body that forms therein a stepped bore that has a side opening. The stepped bore of the ancillary component and the cylindrical plug are respectively provided with mated dimple and bump for engaging each other. The ancillary component receiving the cylindrical plug therein is fit into an opposite end of the tree-segment tube to form a tree segment. Alternatively, the extension cable assembly can be used as a stand-alone device. | 10-30-2014 |
Patent application number | Description | Published |
20100095577 | FLIP-UP COVER MECHANISM - A flip-up cover mechanism. An annular body includes two opposite through holes. A displacing member is disposed in the annular body and includes two opposite push portions and a first flange. The push portions respectively protrude from the annular body via the through holes. A cover is rotatably connected to the annular body and includes a second flange detachably engaged with the first flange. A torsion spring is connected between the annular body and the cover. When the second flange is engaged with the first flange, the cover is closed in relation to the annular body and the torsion spring is twisted to provide restoring resilience. When the push portions are respectively pushed through the through holes, the displacing member is elastically deformed to separate the first flange from the second flange and the cover is lifted from the annular body by the restoring resilience provided by the torsion spring. | 04-22-2010 |
20110051258 | OPTICAL SIGHT FOR MAINTAINING DIOPTER ADJUSTMENT - An optical sight includes a main barrel unit, an objective lens unit, an ocular lens unit, and a magnification unit. The main barrel unit extends about an axis. The objective lens unit is mounted to a front end of the main barrel unit. The ocular lens unit is mounted to a rear end of the main barrel unit, and includes an outer barrel securely connected to the main barrel unit, an inner barrel coupled threadedly with the outer barrel, a lens disposed in the inner barrel, an adjusting barrel disposed on the inner barrel and movable in a direction along the axis, and a release device disposed between the inner barrel and the adjusting barrel. The magnification unit is rotatably disposed in the main barrel unit between the objective lens unit and the ocular lens unit. | 03-03-2011 |
20110102785 | REFLEX SIGHT - A reflex sight is provided, including a first lens module, a first light source, and a second light source. The first light source projects a first reticle image to the first lens module, and the first lens module reflects the first reticle image to a viewer. When the first light source is inactive, the second light source projects a second reticle image to the first lens module, and the first lens module reflects the second reticle image to the viewer. | 05-05-2011 |
Patent application number | Description | Published |
20090160964 | IMAGE DATA PROCESSING METHOD - An image data processing method to capture still images while capturing motion images is disclosed. The method includes stopping a motion image capturing according to a first instruction to generate a first motion image data with a first resolution, thereafter, carrying out live view at a predetermined time; outputting the image data in the predetermined time and generating a first temporal motion data with a second resolution; capturing a still image data according to a second instruction after the predetermined time; transforming the first temporal motion data and the still image data and generating a second motion image data by combining the transformed data with the first motion image data. | 06-25-2009 |
20110134309 | Method to Evaluate Contrast Value for an Image and Applications Thereof - An image contrast evaluation method is disclosed. First, focusing is performed based on the contrast value of an image rendered by a lens on optical sensors, wherein the calculation of the contrast value comprises: selecting an area of the image, calculating the absolute value of brightness difference between each neighboring pixel, and selecting a specific value there from as the contrast value of the image based on a distribution of the calculated absolute values of the brightness differences. | 06-09-2011 |
20150116521 | WIRELESS CONTROL SYSTEMS FOR CAMERAS, CAMERAS WHICH ARE WIRELESSLY CONTROLLED BY CONTROL DEVICES, AND OPERATIONAL METHODS THEREOF - Wireless control systems for cameras, and operational methods thereof are provided. The system includes a control device and a camera. The camera wirelessly receives a control signal from the control device. The camera captures a plurality of images via an image capture unit, and temporarily stores the images. A processing unit of the camera locates a specific image among the images according to the signal. In some embodiments, the specific image is located among the images according to the time after the time that the control signal is received and an image transmission delay, or according to identification embedded in the control signal. | 04-30-2015 |
Patent application number | Description | Published |
20080250732 | Shock-absorbing tie brace - A shock-absorbing tie brace has a supporting member and two containment members. The supporting member has at least one central member. Each central member has a resilient body and at least two side members. The resilient body has at least one pair of-opposite nonlinear edges. The side members respectively have a straight edge and a nonlinear edge corresponding to one of the nonlinear edges of the resilient body. The side members are mounted at the nonlinear edges of the resilient body to define a gap between each side member and the corresponding nonlinear edge of the resilient body. The containment members are mounted respectively on the top and bottom of the supporting member and are attached to corresponding side members of the at least one central member. Each containment member has a stuffing material stuffed in the containment member. | 10-16-2008 |
20100018134 | SHOCK-ABSORBING TIE BRACE - A shock-absorbing tie brace has a central member and an outer frame. The central member has two ends and multiple neck portions. Each neck portion has a dimension of cross section smaller than that of the ends to form multiple enlarged portions beside the neck portions on the central member. The outer frame is mounted around and encloses the central member. Accordingly, the shock-absorbing tie brace has an excellent capability for bearing buckling load and is not easily bent or buckled. | 01-28-2010 |
20100319274 | SHOCK-ABSORBING TIE BRACE - A shock-absorbing tie brace has a central member and an outer frame. The central member has two ends and multiple neck portions. The neck portions are formed between the ends to form at least one enlarged portion between the neck portions. Each neck portion has a height (Hn) relative to the central line smaller than a height (He) of each one of the at least one enlarged portion, and a proportion of the height (Hc) of each neck to the height (He) of any one of the at least one enlarged portion is o.1 to 0.99. The outer frame is mounted around and encloses the central member. Accordingly, the shock-absorbing tie brace has an excellent capability for bearing buckling load and is not easily bent or buckled. | 12-23-2010 |
20120096779 | SHOCK SUPPRESSOR - A shock suppressor has a first base, a second base and a connecting device. The second base is parallel to the first base. The connecting device is slidably mounted between the first base and second base to connect the first and second bases and has a universal connector. The first base abuts against the connecting device in a curved contact surface to provide a first sliding mechanism in multiple directions. The second base abuts against the connecting device to provide a second sliding mechanism in a unidirection. | 04-26-2012 |
20120117894 | SHOCK SUPPRESSOR - A shock suppressor has a first base, a second base and a connecting device. The second base is parallel to the first base. The connecting device is slidably mounted between the first base and second base to connect the first and second bases and has a universal connector. The first base abuts against the connecting device in a curved contact surface to provide a first sliding mechanism in multiple directions. The second base abuts against the connecting device to provide a second sliding mechanism in a unidirection. | 05-17-2012 |
20130334749 | ENERGY ABSORBER HAVING A CAPABILITY OF PREVENTING OPERATION TEMPERATURE FROM INCREASING - An energy absorber has at least one hollow core post filled with coolant, two supporting boards, multiple first material layers and second material layers. The supporting boards are mounted respectively on two ends of the at least one hollow core post. The first material layers and second material layers are alternately mounted between the supporting boards. Accordingly, the operation temperature of the energy absorber can be prevented from increasing by the coolant in the core post. | 12-19-2013 |
20130340360 | SELF-CENTERING DAMPER - A self-centering damper has an elongated damping body and at least one returning device. The elongated damping body has at least one elongated-sheet shape first wing plate and a supporting element connected to and extending from the first wing plate. The at least one returning device is connected to the damping body and has two holding ribbed-plates respectively connected to the end segments of the damping body, a supporting ribbed-plate securely connected to the damping body between the holding ribbed-plates and at least one pre-stressed stay wire extending through the supporting ribbed-plate and connected the holding ribbed-plates in a tension condition. | 12-26-2013 |
20150082715 | SELF-CENTERING DAMPER - A self-centering damper has an elongated damping body and at least one returning device. The elongated damping body has at least one elongated-sheet shape first wing plate and a supporting element connected to and extending from the first wing plate. The at least one returning device is connected to the damping body and has two holding ribbed-plates respectively connected to the end segments of the damping body, a supporting ribbed-plate securely connected to the damping body between the holding ribbed-plates and at least one pre-stressed stay wire extending through the supporting ribbed-plate and connected the holding ribbed-plates in a tension condition. | 03-26-2015 |
Patent application number | Description | Published |
20090288866 | ELECTRONIC CARRIER BOARD - An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening. | 11-26-2009 |
20100170709 | ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF - An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence. | 07-08-2010 |
20110070697 | METHOD FOR FABRICATING STACK STRUCTURE OF SEMICONDUCTOR PACKAGES - A stack structure of semiconductor packages and a method for fabricating the stack structure are provided. A plurality of electrical connection pads and dummy pads are formed on a surface of a substrate of an upper semiconductor package and at positions corresponding to those around an encapsulant of a lower semiconductor package. Solder balls are implanted to the electrical connection pads and the dummy pads. The upper semiconductor package is mounted on the lower semiconductor package. The upper semiconductor package is electrically connected to the lower semiconductor package by the solder balls implanted to the electrical connection pads, and the encapsulant of the lower semiconductor package is surrounded and confined by the solder balls implanted to the dummy pads. Thereby, the upper semiconductor package is properly and securely positioned on the lower semiconductor package, without the occurrence of misalignment between the upper and lower semiconductor packages. | 03-24-2011 |
Patent application number | Description | Published |
20080237980 | PUSHER OF A HOCKEY GAME TABLE - A pusher of a hockey game table includes a main body having an internal spherical space and a pushing knob having a spherical rotary member rotatably disposed in the spherical space of the main body. When holding the pushing knob and pushing the pusher, the pushing knob is angularly displaceable relative to the main body in the direction of the pushing force. Therefore, when pushing the pusher to play the hockey game, the player's wrist can be freely twisted to meet human body engineering. | 10-02-2008 |
20090029812 | DISC FOR A HOCKEY GAME TABLE - A disc for a hockey game table, including a main body which is a flat body and an annular outer ring with a certain flexibility. The outer ring is disposed around the main body, whereby an annular space is defined between the main body and the outer ring. In use, the disc is placed on a table face of the hockey game table and pushed with a pusher. When the outer ring of the disc is collided by the pusher, the outer ring of the disc is resiliently deformed and flexed and then restored. Accordingly, the disc can rebound and move faster. In addition, the outer ring is resiliently deformed to muffle the collision sound. Therefore, the noise produced when playing the hockey game can be reduced. | 01-29-2009 |
20090170399 | DOLL OF FOOTBALL GAME TABLE - A doll of football game table for mounting on an operation rod of the football game table. The doll includes a first main body and a second main body which are detachably latched with each other to hold the operation rod. The doll further includes at least one fixing member for engaging at least one of the main bodies with the operation rod, whereby by means of operating the operation rod, the doll can be driven to move or rotate. The doll can be directly mounted on or taken off from the operation rod. In case of damage of the doll, the main bodies of the doll can be unlatched from each other to take off the doll from the operation rod so that the doll can be easily replaced. | 07-02-2009 |
20090170400 | DOLL OF FOOTBALL GAME TABLE - A doll of football game table for mounting on an operation rod of the football game table. The doll includes a first main body and a second main body. First ends of the two main bodies are detachably latched with each other. A connecting member detachably connects second ends of the main bodies. Accordingly, the main bodies are detachably mounted on the operation rod. The doll further includes at least one fixing member for engaging at least one of the main bodies with the operation rod. By means of operating the operation rod, the doll can be driven to move or rotate. The doll can be directly mounted on or taken off from the operation rod. In case of damage of the doll, the main bodies of the doll can be unlatched from each other to take off the doll from the operation rod so that the doll can be easily replaced. | 07-02-2009 |
20100225055 | DOLL OF FOOTBALL GAME TABLE - A doll of football game table for mounting on an operation rod of the football game table is disclosed. The doll includes a first main body and a second main body. Bottom ends of the two main bodies are detachably latched with each other. A connecting member detachably connects top ends of the main bodies. Accordingly, the main bodies are detachably mounted on the operation rod. The doll further includes at least one fixing member for engaging at least one of the main bodies with the operation rod. By means of operating the operation rod, the doll can be driven to move or rotate. The doll can be directly mounted on or taken off from the operation rod. In case of damage of the doll, the main bodies of the doll can be unlatched from each other to take off the doll from the operation rod so that the doll can be easily replaced. | 09-09-2010 |
20110262217 | LATCH MECHANISM APPLIED FOR MULTI-FUNCTION GAME TABLE - A latch mechanism applied for multi-function game table includes a confinement component and a latch component. The game table has a framework and a tablet pivoted to the framework for flip. The confinement component is applied for the tablet of the game table and has a channel formed thereof. The latch component is applied for the framework of the game table to correspond with the confinement component, and the latch component includes a base and a switch. The base has a through passage to correspond with the channel of the confinement component. The switch is arranged in the through passage of the base; and has a manipulation member and a shut member. The manipulation member is pivoted to the base via a connecting end thereof for angular displacement, and the shut member is approximately vertical to the manipulation member so as to move as same as the manipulation member. When the manipulation member angularly moves inside the through passage of the base, the shut member rotates to reach into the channel of the confinement component. The latch component locks the confinement component so that the tablet secure to the framework for staying still. | 10-27-2011 |
20110266751 | STATIC-BALANCE-EFFECT GAME TABLE - A static-balance-effect game table includes a table stand and a tablet. The table stand has two frame racks, a reception space, a base component and two connection components. The two frame racks are arranged in a symmetric manner and each has an inner end opposite to each other. Each frame rack includes two frame members individual and symmetric to each other. Each frame member is L-shaped approximately and disposed at an inclined angle, so that a distance between two inner ends of two respective frame members is shorter than a distance between two outer ends of two respective frame members. The reception space is defined between the two frame racks. The base component is elongated and has two opposite ends; each end of the base component connects to the inner end of each frame members. The two connection components join two frame members of each frame rack respectively. The tablet is arranged in the reception space of the table stand, and has two ends joining two connection components respectively. | 11-03-2011 |
Patent application number | Description | Published |
20090120142 | Door Lock with An Improved Structure - A door lock with an improved structure is disclosed. It has a turning device that includes a positioning base. The positioning base is mounted with a circular spacer with a lock control device therein. A connecting shaft for driving the lock control device is provided with a limiting element that has a protruded stopping part at its end. The lock has a lock core whose one end allows the insertion and turning of a key. Its other end is connected with the connecting shaft and has grooves, so that the stopping part of the limiting element blocks the lock core when the door is locked. | 05-14-2009 |
20100251786 | Door Lock of Key-Driven Transmission Structure - A door lock of key-driven transmission structure which is comprised of a case, a swing arm, a first link bar and a second link bar, whereof the first and second link bars and a lock-bolt structure on the case can be driven by the said swing arm to open or close lock. A first transmission piece is driven when the said lock-bolt structure is actuated, and an actuator is driven by the said first transmission piece to further drive the two top and bottom pull rods which further drive the two top and bottom lock-bolts to extend outward for locking, thereby to reach a combining action between the lock-bolt structure as well as the top and bottom lock-bolts. The said lock-bolt structure is further through linking with a labor saving component installed on the said second link bar to achieve the labor saving and easy operation effects. | 10-07-2010 |
20100257905 | Reversible Rotating Door Lock Handle Structure - A Reversible rotating door lock handle structure is comprised of: A main body and an actuator which is installed in the containing space of the said main body. The said actuator has a longitudinal slot with a rack installed respectively at its two sides and a hook-piece. A shaft pipe is provided with at least one shifter for engaging with either slot side rack of the said actuator. A handle which has a shift-lever for inserting into the slot of the said actuator and connected to the said hook-piece, thereby to push the actuator to move longitudinally and further to drive the said shaft pipe to rotate, whereof the rotating direction of the said shaft pipe can be reversed if the shifter of the said shaft pipe is switched to engage with the rack at the other side of the said actuator. | 10-14-2010 |
20100263416 | Door Lock with Transmission Mechanism - A door lock with transmission mechanism, in which a main lock is installed at the side of the door, and an auxiliary lock is installed at each side of the main lock respectively, whereof the main lock has a main lock-tongue, and each of the two auxiliary lock has an auxiliary lock-tongue, whereby the main lock-tongue drives the auxiliary lock-tongue in each of the two auxiliary locks to move together corresponding to the rotation of door handle. | 10-21-2010 |
Patent application number | Description | Published |
20120299682 | SYMMETRIC DIFFERENTIAL INDUCTOR STRUCTURE - A symmetric differential inductor structure includes first, second, third and fourth spiral conductive wirings disposed in four quadrants of a substrate, respectively. Further, a fifth conductive wiring connects the first and fourth spiral conductive wirings, and a sixth conductive wiring connects the second and third spiral conductive wirings. The first and second spiral conductive wirings are symmetric but not intersected with one another, and the third and fourth spiral conductive wirings are symmetric but not intersected with one another. Therefore, the invention attains full geometric symmetry to avoid using conductive wirings that occupy a large area of the substrate as in the prior art and to thereby increase the product profit and yield. | 11-29-2012 |
20120299683 | ASYMMETRIC DIFFERENTIAL INDUCTOR - An asymmetric differential inductor includes first and second conductive wirings spirally disposed on a substrate having a first input terminal, a second input terminal, a ground terminal, and a central conductive wiring. The central conductive wiring has a central contact connecting the ground terminal and a central end away from the ground terminal. The first conductive wiring extends across the central conductive wiring and has a first contact connecting the first input terminal and a first end connecting the central end. The second conductive wiring extends across the central conductive wiring and interlaces with the first conductive wiring and has a second contact connecting the second input terminal and a second end connecting the central end. Corresponding portions of wiring sections of the first and second conductive wirings at opposite sides of the central conductive wiring are asymmetrical to one another to thereby save substrate space and facilitate circuit layout. | 11-29-2012 |
20130032931 | LAYER STRUCTURE WITH EMI SHIELDING EFFECT - A layer structure with an electromagnetic interference (EMI) shielding effect is applicable for reducing an EMI effect caused by signal transmission between through silicon vias, so as to effectively provide the EMI shielding effect between electrical interconnections of a three-dimensional (3D) integrated circuit. By forming EMI-shielding through silicon vias at predetermined positions between the through silicon vias used for signal transmission, a good EMI shielding effect can be attended, and signal distortion possibly caused by the EMI effect can be reduced between different chips or substrates. | 02-07-2013 |
20130034971 | INTERCONNECTING MECHANISM FOR 3D INTEGRATED CIRCUIT - An interconnecting mechanism is provide, which includes paired first sub-interconnecting mechanisms and paired second sub-interconnecting mechanisms. The first pair of sub-interconnecting mechanisms includes first and second axially symmetrical spiral conductive elements. The second pair of sub-interconnecting mechanisms includes third and fourth axially symmetrical spiral conductive elements. Configuring the pairs of sub-interconnecting mechanisms in a differential transmission structure having a spiral shape is used to avert sounds and noise signals between different chips or substrates caused by a miniaturizing fabrication process or an increased wiring density. | 02-07-2013 |
20140015621 | BALANCED-TO-UNBALANCED CONVERTER - A balanced-to-unbalanced converter (balun) is provided, including: a converting circuit having a first processing circuit including a first inductor and a first capacitor connected in series, a second processing circuit including a second capacitor and a second inductor connected in series, the second capacitor being electrically connected to the first inductor, and two balanced output ends connected to the first processing circuit and the second processing circuit, respectively; and a preprocessing circuit connected to the converting circuit and including an unbalanced input end for converting real impedance at the unbalanced input end into complex impedance at the balanced output ends. Accordingly, the balun satisfies the need of the wireless communication chips by providing differential signals with complex impedance. This is done by employing the preprocessing circuit in conjunction with the converting circuit to convert an unbalanced signal with real impedance into a balanced signal with complex impedance. | 01-16-2014 |
20140184261 | TESTING APPARATUS AND TESTING METHOD - A testing method is provided, including providing a testing apparatus including a carrier member and a testing element, the carrier member comprising a first surface, a second surface opposing the first surface, and an elastic conductive area defined on the first surface; disposing an object-to-be-tested on the elastic conductive area; electrically connecting the testing element to the object-to-be-tested and the carrier member, to form an electric loop among the carrier member, the object-to-be-tested and the testing element. Through the design of the elastic conductive area, the object-to-be-tested can be secured with a small pressure applied thereto, and is prevented from being cracked. | 07-03-2014 |
20150188510 | CIRCUIT STRUCTURE - A circuit structure is provided, which includes: a first circuit portion having at least a capacitor; a first dielectric portion combined with the first circuit portion; a second circuit portion electrically connected to the first circuit portion and having at least an inductor; and a second dielectric portion combined with the second circuit portion, wherein the first dielectric portion has a greater dielectric constant than the second dielectric portion, thereby increasing the capacitance value and density and causing the inductor to have a high enough Q value. | 07-02-2015 |
Patent application number | Description | Published |
20080295242 | Pivotal shower device - A shower device includes a hollow frame having a coupler for engaging with a wall-mounted shower supply pipe and having two tubes attached to two end portions, a housing having a chamber formed by an outer peripheral wall and having two openings for rotatably receiving the tubes, a cover engaged with the housing and having two protrusions engaged with the openings of the housing and for anchoring the cover to the housing, a casing disposed in the housing and having two ports, and two distributors each having a pipe rotatably engaged into the tube and a mouth engaged with the port of the casing for supplying the water from the tubes into the chamber of the casing and then flowing out through the cover. | 12-04-2008 |
20090265848 | Holder device for shower head and nozzle - A holder device may be attached to a water outlet tube which is extended from a wall, without drilling holes in the wall, and includes a housing having an inlet attached to the water outlet tube, and two or more outlet ports for coupling to a shower head and a sprayer nozzle, a base having a spring-biased latch for clamping the pipe to the base, a seat slidably attached onto the pipe for adjustably and removeably supporting the sprayer nozzle. The housing includes a casing having a chamber for receiving a valve stem, and a spring-biased valve member received in the valve stem to control the water to flow out through the outlet ports of the housing, and a knob secured to the valve stem to rotate the valve stem relative to the casing and the housing. | 10-29-2009 |
20090266913 | Holder device for shower head and nozzle - A holder device may be attached to a water outlet tube which is extended from a wall, without drilling holes in the wall, and includes a housing having an inlet attached to the water outlet tube, and two or more outlet ports for coupling to a shower head and a sprayer nozzle. a base having a spring-biased latch for clamping the pipe to the base, a seat slidably attached onto the pipe for adjustably and removeably supporting the sprayer nozzle. The housing includes a casing having a chamber for receiving a valve stem, and a spring-biased valve member received in the valve stem to control the water to flow out through the outlet ports of the housing, and a knob secured to the valve stem to rotate the valve stem relative to the casing and the housing. | 10-29-2009 |
20090323761 | Water temperature indicating device for bath, shower and the like - A water temperature indicating device includes a tube having a port which includes a compartment formed by a bottom wall, a housing attached to the coupler, a circuit board disposed in the housing and has a light element, a processor device is attached to the circuit board for actuating the light element, a sensing device attached to the bottom wall of the coupler for detecting a water temperature and for sending the detected water temperature to the processor device and to operate the light element, and a water operated switching device is used for actuating the processor device to operate the light element with the water flowing through the chamber of the tube. | 12-31-2009 |
20110259454 | Shower nozzle holder device having water temperature monitoring mechanism - A holder device is attached to a water outlet tube without drilling holes in the wall and includes a housing having a casing communicative with an inlet of the housing and having two outlet ports, a valve stem engaged in the casing and having a valve member to control the water to flow out through the outlet ports of the housing, a motor disposed in the inlet of the housing and having a fan blade for being rotated by the water to generate an electricity, a control device coupled to the motor and having a light member for generating an indicating or warning signal when the water is over-heated, and a temperature sensor disposed in the housing for sensing the water temperature and for supplying the detected water temperature to the control device. | 10-27-2011 |
20130269793 | HOLDER DEVICE FOR SHOWER NOZZLE OR THE LIKE - A holder device for attaching to a supporting surface includes two attachment devices each having a housing, two suction members each having an outer peripheral portion engaged with the housing, and a shank attached to the suction member for moving the central portion of the suction member toward and away from a supporting surface, two carriers each has a cam member connected to the shank with a pivot shaft for selectively moving the shank and securing the housing to the supporting surface when the carrier is rotated relative to the housing to a working position where the carrier is in line with the shank, the shank and the suction member are released when the carrier is rotated relative to the housing to a folding position where the carrier is tilted relative to the shank. | 10-17-2013 |
Patent application number | Description | Published |
20120074538 | PACKAGE STRUCTURE WITH ESD AND EMI PREVENTING FUNCTIONS - A package structure with ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a carrier having first and second ground structures electrically insulated from one another; a semiconductor component disposed on one surface of the carrier and electrically connected to the first ground structure; and a lid member disposed to cover the carrier and the semiconductor component and electrically connected to the second ground structure. The semiconductor component and the lid member are electrically connected with the first ground structure and the second ground structure, respectively, such that electrostatic charges and electromagnetic waves can be conducted away individually without damaging the semiconductor component, thereby improving yield and reducing the risk of short circuits. | 03-29-2012 |
20120133032 | PACKAGE HAVING ESD AND EMI PREVENTING FUNCTIONS AND FABRICATION METHOD THEREOF - A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits. | 05-31-2012 |
20120235259 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package and a method of fabricating the same. The semiconductor package includes: a substrate having a plurality of semiconductor components disposed thereon; an encapsulant covering the substrate and the semiconductor components; and a metal layer formed on the exposed surfaces of the encapsulant, wherein the encapsulant is formed with a trench for dividing into a plurality of package units on the substrate to allow each of the package units to have at least one of the semiconductor components, and the metal layer is formed in the trench to encompass the encapsulant on the periphery of the semiconductor components, thereby preventing interference of electromagnetic waves between the semiconductor components. | 09-20-2012 |
20130093629 | PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME - A packaging structure and a method of fabricating the same are provided. The packaging structure includes a substrate, first packaging element disposed on the substrate, a second packaging element disposed on the substrate and spaced apart from the first packaging element, a first antenna disposed on the first packaging element, and a metal layer formed on the second packaging element. The installation of the metal layer and the antenna enhances the electromagnetic shielding effect. | 04-18-2013 |
20140203395 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved. | 07-24-2014 |
20140210672 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement. | 07-31-2014 |
20140210687 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF - An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package. | 07-31-2014 |
20150123251 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed, which includes: a packaging structure having at least a semiconductor element; and at least three shielding layers sequentially stacked on the packaging structure so as to cover the semiconductor element, wherein a middle layer of the shielding layers is lower in electrical conductivity than adjacent shielding layers on both sides of the middle layer, thereby reducing electromagnetic interferences so as to increase the shielding effectiveness. | 05-07-2015 |
20150145747 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF - An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package. | 05-28-2015 |
Patent application number | Description | Published |
20100157292 | SIGHT - A sight. A saddle is connected between an ocular housing and an objective housing. A crosshair is disposed in the ocular housing. A light-emitting element is disposed in the ocular housing, illuminating the crosshair. A focal adjustment member is disposed on the saddle, adjusting an objective focus for the sight. A key-type member is connected to the focal adjustment member and is electrically connected to the light-emitting element, controlling operation of the light-emitting element and adjusting luminous brightness thereof. | 06-24-2010 |
20100320068 | PUSHBUTTON SWITCH ASSEMBLY FOR ENHANCING INPUT SENSITIVITY - A pushbutton switch assembly includes a key unit, a circuit board, and a press unit. The key unit includes a keycap and a press member disposed at a bottom portion of the keycap. The press member has a protruding portion. The circuit board is disposed under the key unit, and includes an electrical contact unit opposing the key unit. The electrical contact unit has a first electrode region and a second electrode region. The press unit includes a positioning film disposed on the circuit board, and a conducting plate positioned between the positioning film and the circuit board. The conducting plate is connected to the first electrode region. The conducting plate is deformed to interconnect the first and second electrode regions when the key unit is pressed and the protruding portion presses down on the positioning film, and restored when the key unit is released. | 12-23-2010 |
20120293865 | Autoluminescence Reticle Embedded Scope - A scope with an autoluminescence reticle is provided, wherein the autoluminescence reticle is formed by coating autoluminescence materials on a glass. The autoluminescence reticle does not need a power supply, but can radiate light at night or under a low light environment. | 11-22-2012 |
20140240841 | Telescopic Sight - A telescopic sight includes a main body, a positioning-adjustable member, and a sunshade hood. The main body includes a lens chamber and an enclosure, and the enclosure covers the lens chamber and includes at least one slot. The positioning-adjustable member is movably disposed in the slot. The sunshade hood includes at least one hole corresponding to the positioning-adjustable member, and the positioning-adjustable member is partially disposed in the hole. | 08-28-2014 |
20140360082 | SIGHT AND DUST CAP THEREOF - A sight includes an objective barrel and a dust cap connected to the objective barrel. The dust cap includes a main body, a cover, a first flexible element, and a second flexible element, The cover is connected to the main body. The first flexible element is connected to the main body and includes an inner surface. The second flexible element is disposed in the first flexible element and includes an outer surface wherein the outer surface of the second flexible element contacts the inner surface of the first flexible element. | 12-11-2014 |
Patent application number | Description | Published |
20110298126 | CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD - A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality. | 12-08-2011 |
20120007234 | SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD THEREOF - A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer. | 01-12-2012 |
20130009311 | SEMICONDUCTOR CARRIER, PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package includes: a first encapsulant having tapered through holes each having a wide top and a narrow bottom; tapered electrical contacts disposed in the tapered through holes; circuits disposed on a top surface of the first encapsulant and each having one end connecting one of the electrical contacts and the other end having a bonding pad disposed thereon such that the bonding pads are circumferentially arranged to define a die attach area on the top surface of the first encapsulant. As such, a semiconductor chip can be disposed on the top surface of the first encapsulant in the die attach area and electrically connected to the bonding pads through conductive elements, and further a second encapsulant encapsulates the semiconductor chip, the conductive elements, the circuits and the first encapsulant so as to prevent falling off of the electrical contacts and reduce the length of the conductive elements. | 01-10-2013 |
20130093086 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased. | 04-18-2013 |
20130344661 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE - This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased. | 12-26-2013 |
20140134805 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE - A method of fabricating a semiconductor package is provided, including: providing a heat dissipating structure having a heat dissipating portion, a deformable supporting portion coupled to the heat dissipating portion, and a coupling portion coupled to the supporting portion; coupling a carrier having a semiconductor element carried thereon to the coupling portion of the heat dissipating structure to form between the carrier and the heat dissipating portion a receiving space for the semiconductor element to be received therein; and forming in the receiving space an encapsulant that encapsulates the semiconductor element. The use of the supporting portion enhances the bonding between the heat dissipating structure and a mold used for packaging, thereby preventing the heat dissipating structure from having an overflow of encapsulant onto an external surface of the heat-dissipating portion. | 05-15-2014 |
20140239475 | PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS THEREOF - A packaging substrate is disclosed, which includes: an encapsulant having opposite first and second surfaces; a plurality of conductive elements embedded in the encapsulant, wherein each of the conductive elements has a first conductive pad exposed from the first surface of the encapsulant and a second conductive pad exposed from the second surface of the encapsulant; and a protection layer formed on the second surface of the encapsulant and the second conductive pads so as to protect the second surface of the encapsulant from being scratched. | 08-28-2014 |
20140315351 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER - A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer. | 10-23-2014 |