Patent application number | Description | Published |
20080301526 | Memory Device with Error Correction Capability and Preemptive Partial Word Write Operation - A memory device comprises a memory array and error correction circuitry coupled to the memory array. The memory device is configured to perform a partial word write operation in which an error correction code encode process for the given retrieved word is initiated prior to completion of an error correction code decode process for the given retrieved word based on an assumption that the error correction code decode process will not indicate an error in the given retrieved word. If the error correction code decode process when completed indicates an error in the given retrieved word, the error in the given retrieved word is corrected in the error correction circuitry, and the error correction code encode process is restarted using the corrected word. The error correction code decode process and an associated correct process are thereby removed from a critical timing path of the partial word write operation. | 12-04-2008 |
20090034356 | Dual-Port Memory - A dual-port memory circuit includes a plurality of memory sub-blocks. Each of the memory sub-blocks includes a plurality of single-port memory cells, at least one row line, and at least one local bit line, the row line and the bit line being coupled to the memory cells for selectively accessing the memory cells. The memory circuit further includes at least one global bit line connected to the plurality of memory sub-blocks. The global bit line is time-multiplexed during a given memory cycle such that the global bit line propagates data associated with a first port in the memory circuit during a first portion of the memory cycle, and the global bit line propagates data associated with a second port in the memory circuit during a second portion of the memory cycle. | 02-05-2009 |
20090141575 | Method and Apparatus for Idle Cycle Refresh Request in Dram - Generally, methods and apparatus are provided for idle cycle refresh request in a dynamic random access memory. According to one aspect of the invention, a dynamic random access memory is refreshed by determining if a refresh of the dynamic random access memory is required; and allocating an idle cycle sequence to refresh at least a portion of the dynamic random access memory only if the determining step determines that a refresh of the dynamic random access memory is required. A refresh flag can optionally be set if a refresh is required. The idle cycle sequence comprises one or more idle cycles. The idle cycle sequence can optionally be allocated within a predefined duration of the refresh flag being set. The step of determining step whether a refresh of the dynamic random access memory is required can be based on real-time or expected conditions. | 06-04-2009 |
20090141580 | Reduced Leakage Driver Circuit and Memory Device Employing Same - A row line driver circuit for use in a memory array including multiple memory cells and multiple row lines coupled to the memory cells for selectively accessing the memory cells includes an output stage adapted for connection to a corresponding one of the row lines and a control circuit connected to the output stage. The output stage is operative during an active phase of a given memory cycle to drive the corresponding row line to a potential as a function of at least one address signal received by the driver circuit. The control circuit is operative to generate at least one control signal for disabling the output stage at least during an inactive phase of the memory cycle to thereby substantially eliminate a leakage current path in the driver circuit. | 06-04-2009 |
20090161459 | Dynamic Random Access Memory With Low-Power Refresh - A technique to reduce refresh power in a DRAM is disclosed. In one embodiment, all of the DRAM memory cells are refreshed at a first rate and a subset of the memory cells are refreshed a second rate greater than the first rate. In another embodiment, the DRAM has a refresh controller that generates a refresh address and controls the refresh of the memory cells addressed by the refresh address. A marker memory is used by the refresh controller to determine which of the memory cells requires refreshing at a rate faster than the refresh rate of the remaining memory cells. Also disclosed is a method to determine which of the memory cells are to be refreshed at the faster rate and to store the results in the marker memory. | 06-25-2009 |
20090196098 | Multiple-Level Memory with Analog Read - A memory circuit includes a plurality of memory cells, each of the memory cells being operative to store multiple bits of data therein, and a plurality of column lines and row lines coupled to the memory cells for selectively accessing the memory cells. The circuit further includes multiple sense amplifiers, each of the sense amplifiers being connected to a corresponding one of the column lines and being operative to detect an electric charge stored in a selected one of the memory cells coupled to the corresponding column line and to generate an analog signal indicative of the stored electric charge. An analog multiplexer is connected to the sense amplifiers. The analog multiplexer is operative to receive the respective analog signals from the sense amplifiers and to generate an analog output signal having a magnitude which varies in time as a function of the respective analog signals from the sense amplifiers. | 08-06-2009 |
20100229035 | SYSTEMATIC ERROR CORRECTION FOR MULTI-LEVEL FLASH MEMORY - In accordance with exemplary embodiments, a multi-level flash memory employs error correction of systematic errors when reading multi-level flash memory. Error correction includes i) detection of each systematic error, ii) feedback of the systematic error to circuitry within the memory, and iii) subsequent adjustment within that circuitry to cause a correction of systematic error in the output signal of the multi-level flash memory. | 09-09-2010 |
20100271064 | Integrated Circuit Self-Monitored Burn-In - An IC adapted for self-monitored burn-in includes a first memory and at least one BIST circuit coupled to the memory and operative to test the IC by executing a burn-in test and to generate test results indicative of at least one parameter of the burn-in test. The test results are at least temporarily stored in the first memory as a function of a first control signal. | 10-28-2010 |
20100271891 | Accessing Memory Cells in a Memory Circuit - Techniques for accessing a memory cell in a memory circuit include: receiving a request to access a selected memory cell in the memory circuit; determining whether the selected memory cell corresponds to a normal memory cell or a weak memory cell in the memory circuit; accessing the selected memory cell using a first set of control parameters when the selected memory cell corresponds to a normal memory cell, wherein the selected memory cell provides correct data under prescribed operating specifications when accessed using the first set of control parameters; and accessing the selected memory cell using a second set of control parameters when the selected memory cell corresponds to a weak memory cell, wherein the selected memory cell provides correct data under the prescribed operating specifications when accessed using the second set of control parameters and provides incorrect data under the prescribed operating specifications when accessed using the first set of control parameters. | 10-28-2010 |
20100301926 | Optimization of Circuits Having Repeatable Circuit Instances - Techniques for forming a first electronic circuit including a plurality of instances of a repeatable circuit element include the steps of: obtaining a total number of instances of the repeatable circuit element in a design of an IC including the first electronic circuit and at least a second electronic circuit; and configuring at least one functional parameter of the first electronic circuit as a function of the total number of instances of the repeatable circuit element in the IC to thereby satisfy a prescribed minimum composite manufacturing yield of the IC and/or at least one specification of the IC under prescribed operating conditions. | 12-02-2010 |
20100329054 | Memory Built-In Self-Characterization - A memory circuit includes an operational memory and a monitor circuit comprising a circuit element in the operational memory and/or a circuit element substantially identical to a corresponding circuit element in the operational memory. The monitor circuit is operative to measure at least one functional characteristic of the operational memory. A control circuit coupled to the monitor circuit is operative to generate a control signal which varies as a function of the measured characteristic of the operational memory. The memory circuit further includes a programmable voltage source coupled to the operational memory which is operative to generate at least a voltage and/or a current supplied to at least a portion of the operational memory which varies as a function of the control signal. | 12-30-2010 |
20110022648 | Secure Random Number Generator - A random number generator circuit includes a first memory having multiple storage elements. Each of the storage elements has an initial state corresponding thereto when powered up by a voltage supply source applied to the first memory. The first memory is operative to generate a first signal including multiple bits indicative of the respective initial states of the storage elements. The random number generator circuit further includes an error correction circuit coupled to the first memory. The error correction circuit is operative to receive the first signal and to correct at least one bit in the first signal that is not repeatable upon successive applications of power to the first memory to thereby generate a second signal. The second signal is a random number that is repeatable upon successive applications of power to the first memory. | 01-27-2011 |
20110055660 | High-Reliability Memory - A memory circuit includes a memory including a plurality of primary memory elements, and an error correction circuit coupled to the memory and operative to detect an error in at least one of the primary memory elements and to provide corrected data corresponding to the primary memory element. The memory circuit further includes at least one spare memory element and a control circuit operative to replace at least one of the primary memory elements with the spare memory element as a function of results generated by the error correction circuit. | 03-03-2011 |
20110157964 | Memory Cell Using Leakage Current Storage Mechanism - A memory cell comprises a storage element including a transistor and an inverter. The inverter has an input coupled to a first source/drain of the transistor at a first node and has an output coupled to a gate of the transistor at a second node. The transistor has a second source/drain coupled to a voltage supply of the memory circuit. The memory cell further includes a switching element coupled to the storage element at the first node and being operative to selectively access the storage element as a function of a control signal supplied to a control input of the switching element. The storage element is operative to store at least first and second data states. The first data state is retained in the storage element by maintaining the first node at a first voltage level by leakage current and by maintaining the second node at a second voltage level by active current. The second data state is retained in the storage element by maintaining the first node at the second voltage level and the second node at the first voltage level by respective active currents. | 06-30-2011 |
20120075946 | Memory Device with Phase Distribution Circuit for Controlling Relative Durations of Precharge and Active Phases - A memory device comprises a memory array and a phase distribution circuit coupled to the memory array. In one aspect, the phase distribution circuit is operative to control respective durations of a precharge phase and an active phase of a memory cycle of the memory array based on relative transistor characteristics of a tracked precharge transistor of a first conductivity type and a tracked memory cell transistor of a second conductivity type different than the first conductivity type. For example, the phase distribution circuit may comprise a first tracking transistor of the first conductivity type for tracking the precharge transistor of the first conductivity type and a second tracking transistor of the second conductivity type for tracking the memory cell transistor of the second conductivity type. The relative transistor characteristics may comprise relative strengths of the tracked precharge and memory cell transistors. | 03-29-2012 |