Patent application number | Description | Published |
20080197173 | Method for Forming Solder Bump and Method for Mounting Semiconductor Device - [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device. | 08-21-2008 |
20080251894 | Mounted Body and Method for Manufacturing the Same - A mounted body ( | 10-16-2008 |
20080284046 | Flip chip mounting method and bump forming method - A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin | 11-20-2008 |
20090008776 | Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method - In an electronic component mounted body, an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a solder connecter, and the solder connecter contains solder and insulation filler. Alternatively, a solder bump is formed on the electrode of the electronic component, and the solder bump includes the insulation filler. | 01-08-2009 |
20090008800 | FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS - The flip chip mounted body of the present invention includes: a circuit board ( | 01-08-2009 |
20090023245 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - The invention involves mounting a solder resin composition ( | 01-22-2009 |
20090078746 | BUMP FORMING METHOD AND BUMP FORMING APPARATUS - A method for forming bumps | 03-26-2009 |
20090085227 | FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD - A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body. | 04-02-2009 |
20090102064 | CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME - A connection structure (package | 04-23-2009 |
20090117688 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin | 05-07-2009 |
20090126876 | Flip chip mounting method and method for connecting substrates - A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board | 05-21-2009 |
20090133901 | METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD | 05-28-2009 |
20090200522 | CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME - The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided. | 08-13-2009 |
20090203170 | FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CHIP MOUNTING BODY - A flip chip mounting method includes holding a circuit board ( | 08-13-2009 |
20090230546 | MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME - A mounted body of the present invention includes: a multilayer semiconductor chip | 09-17-2009 |
20100001411 | METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY, AND MUTUAL CONNECTION STRUCTURE BETWEEN SUBSTRATES - A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent. | 01-07-2010 |
20100007033 | METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCTURE, AND CONNECTION STRUCTURE BETWEEN SUBSTRATES - A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates. | 01-14-2010 |
20100011572 | ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP AND PROCESS FOR PRODUCING THE SAME - A process for producing an electronic component assembly, comprising the steps of: (1) preparing a first electronic component whose surface (A) is provided with a plurality of electrodes (a) and a second electronic component whose surface (B) is provided with a plurality of electrodes (b) wherein at least one concave portion is formed in the surface (A) (except for a surface region on which the electrodes (a) are provided) and/or the surface (B) (except for a surface region on which the electrodes (b) are provided); (2) supplying a resin that comprises a solder powder onto the surface (A) of the first electronic component; (3) bringing the second electronic component into contact with a surface of the resin such that the plurality of electrodes (a) of the first electronic component are opposed to the plurality of electrodes (b) of the second electronic component; and (4) heating the first electronic component and/or the second electronic component, and thereby forming solder connections from the solder powder, the solder connections serving to electrically interconnect the electrodes (a) and (b), wherein, upon the heating step (4), gas bubbles are generated within the resin such that the bubble generation originates at least from the concave portion, and the generated bubbles cause the solder powder to move and congregate onto the electrodes (a) and (b). | 01-21-2010 |
20100012936 | MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE - A layered film of a three-layer clad foil formed with a first metal layer | 01-21-2010 |
20100044091 | ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP - An electrode structure | 02-25-2010 |
20100133664 | MODULE AND MOUNTED STRUCTURE USING THE SAME - A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module ( | 06-03-2010 |
20100148376 | FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY - A flip chip mounting process includes the steps of supplying a resin ( | 06-17-2010 |
20100164061 | SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICATION DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIP - A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor. | 07-01-2010 |
20100181558 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND IMAGE DISPLAY DEVICE - A semiconductor device having semiconductor elements disposed with higher density and a method for manufacturing the same are provided. | 07-22-2010 |
20100182144 | RFID MAGNETIC SHEET, NONCONTACT IC CARD AND PORTABLE MOBILE COMMUNICATION APPARATUS - Provided is a RFID magnetic sheet to be attached to an IC tag. The RFID magnetic sheet is provided with a plurality of stripe arranged layers ( | 07-22-2010 |
20100203675 | FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS - The flip chip mounted body of the present invention includes: a circuit board ( | 08-12-2010 |
20100224986 | MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME - A mounted body ( | 09-09-2010 |
20100261321 | METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE - There is provided a method for manufacturing a flexible semiconductor device. The manufacturing method is characterized by comprising (i) a step of forming an insulating film on the upper surface of a resin film, (ii) a step of forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) a step of forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one forming step among the above (i) to (iv) is carried out by a printing method. In the manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like. | 10-14-2010 |
20100276691 | METHOD FOR FABRICATING FLEXIBLE SEMICONDUCTOR DEVICE AND LAYERED FILM USED THEREFORE - A method for fabricating a flexible semiconductor device includes: preparing a layered film | 11-04-2010 |
20100283054 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - There is provided a method for manufacturing a flexible semiconductor device characterized by comprising (i) a step of forming an insulating film on the upper surface of metal foil, (ii) a step of forming an extraction electrode pattern on the upper surface of the metal foil, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, (iv) a step of forming a sealing resin layer on the upper surface of the metal foil in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) a step of forming electrodes by etching the metal foil, wherein the metal foil is used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). A TFT element can be fabricated by a simple process because the metal foil serving as the support need not be finally stripped off. Further, a high-temperature process can be introduced to the fabrication of the insulating film and the semiconductor layer because the metal foil is used as the support, whereby the TFT characteristic is improved. | 11-11-2010 |
20110042677 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprises a metal layer comprising a gate electrode, a source electrode and a drain electrode; a metal oxide film made from a metal which constitutes the metal layer and formed over a surface region of the metal layer; and a semiconductor layer formed above the gate electrode via the metal oxide film. In the flexible semiconductor device, uncovered portions, each of which is not covered with the metal oxide film, are locally formed in the surface region of the metal layer; and also electrical connections are formed between the source electrode and the semiconductor layer and between the drain electrode and the semiconductor layer via the uncovered portions. | 02-24-2011 |
20110049218 | METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUMP AND CONDUCTIVE CONNECTION FILM AND FABRICATION APPARATUS FOR ELECTRONIC COMPONENT MOUNTED BODY, BUMP AND CONDUCTIVE CONNECTION FILM - A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin. | 03-03-2011 |
20110049598 | MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE - A layered film of a three-layer clad foil formed with a first metal layer | 03-03-2011 |
20110121298 | MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE - A method includes the steps of preparing a multilayer film | 05-26-2011 |
20110162578 | FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD - [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. | 07-07-2011 |
20110180900 | SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICATION DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIP - A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor. | 07-28-2011 |
20110201195 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - The invention involves mounting a solder resin composition ( | 08-18-2011 |
20110204366 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY - A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided. | 08-25-2011 |
20110204367 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY - A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided. | 08-25-2011 |
20110293874 | HYBRID SUBSTRATE AND METHOD FOR PRODUCING THE SAME - The hybrid substrate of the present invention comprises a ceramic substrate assembly composed of a plurality of ceramic substrates, insulating resin layers disposed respectively on both surfaces of the ceramic substrate assembly such that they are opposed to each other, each of the insulating resin layers being made at least of a reinforcing material and a resin, and a metal layer disposed on each of the insulating resin layers. In particular, the hybrid substrate of the present invention comprises the plurality of ceramic substrates which are in the form of a tile arrangement along the same plane positioned between the opposed insulating resin layers. | 12-01-2011 |
20120001173 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film. | 01-05-2012 |
20120113500 | ELECTRONIC PAPER AND METHOD FOR PRODUCING SAME - Provided is an electronic paper that permits a high-quality, large area to be easily created. Also provided is a method for producing the electronic paper. The electronic paper comprises: a first substrate upon which first electrodes are formed and a second substrate upon which second electrodes are formed, said first substrate and second substrate disposed so as to face each other; and a plurality of cell spaces constituting pixels between said first substrate and second substrate. The first substrate comprises a plurality of first sheet members, each having a first electrode formed thereon. By disposing a cover substrate on said first sheet members, each with a partition wall therebetween, a plurality of subsheet formations comprising the plurality of cell spaces partitioned by the partition walls are formed, and the first electrodes are connected in between adjacent subsheet formations. | 05-10-2012 |
20120181543 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - Disclosed are a flexible semiconductor device and manufacturing method therefor whereby the capacitances of capacitor parts of semiconductor elements and the like can be increased while decreasing parasitic capacitances that arise between multilevel interconnections. The disclosed flexible semiconductor device is provided with an insulating film on which a semiconductor element is formed. The top and bottom surfaces of the insulating film have a top wiring pattern layer and a bottom wiring pattern layer, respectively. The semiconductor element comprises: a semiconductor layer formed on the top surface of the insulating film; a source electrode and a drain electrode formed on the top surface of the insulating film so as to contact the semiconductor layer; and a gate electrode formed on the bottom surface of the insulating film so as to be opposite the semiconductor layer. A first thickness, which is the thickness of the insulting film facing the source electrode, the drain electrode, the top wiring pattern layer, and the bottom wiring pattern layer, is greater than a second thickness, which is the thickness of the insulating film between the gate electrode and the semiconductor layer. | 07-19-2012 |
20120286264 | FLEXIBLE SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY DEVICE - There is provided a method for manufacturing a flexible semiconductor device. The method of the present invention comprises the steps of: (a) preparing a metal foil having a concave portion; (b) forming a gate insulating film on a bottom face of the concave portion of the metal foil; (c) forming a semiconductor layer above the bottom face of the concave portion via the gate insulating film while making use of the concave portion as a bank member; and (d) forming a source electrode and a drain electrode such that they make contact with the semiconductor layer. | 11-15-2012 |
20120319159 | SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE SAME AND LIGHT-EMITTING DEVICE - There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer. | 12-20-2012 |
20130168677 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used. | 07-04-2013 |
20130200516 | HYBRID SUBSTRATE, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE - A hybrid substrate according to the present invention comprises a core layer composed of a glass woven cloth as a reinforcing material, and a glass-ceramic sintered body which at least comprises a glass component and a metal oxide component. The glass woven cloth and the glass-ceramic sintered body formed by an impregnation with respect to the glass woven cloth are in a form of sintering integration with each other. | 08-08-2013 |
20140038366 | METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE HAVING GATE ELECTRODE DISPOSED WITHIN AN OPENING OF A RESIN FILM - There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film. | 02-06-2014 |
20140124777 | BUILT-UP SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE - A method for manufacturing a build-up substrate, the build-up substrate comprising an insulating layer and a wiring pattern layer stacked over a circuit substrate, said method comprising the steps of: (i) applying a photoactive metal oxide precursor material to one or both sides of the circuit substrate with a wiring pattern, and drying the applied photoactive metal oxide precursor material to form an insulating film; (ii) forming an opening for a via hole in the insulating film by exposure and development of the insulating film; (iii) applying a heat treatment to the insulating film to convert the insulating film into a metal oxide film, thereby forming a build-up insulating layer of the metal oxide film; and (iv) plating the build-up insulating layer to form via holes in the openings, forming a metal layer on the build-up insulating layer, and etching the metal layer to form a build-up wiring pattern; and (v) repeating the steps from (i) to (iv) at least one time. | 05-08-2014 |
20140131076 | CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE COMPOSITE - In the present invention, a ceramic substrate composite comprising, on a ceramic substrate, a conductor pattern composite and an insulating layer is provided. The ceramic substrate composite of the present invention is characterized in that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite; and wherein the conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, the insulating portion being an insulating material that constitutes the insulating layer. | 05-15-2014 |
20140151085 | TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - There is provided a transparent electrode comprising a supporting substrate, a first transparent electrically-conductive film provided on the supporting substrate, a transparent insulating film provided on the first transparent electrically-conductive film, and a second transparent electrically-conductive film provided on the transparent insulating film. In the transparent electrode of the present invention, all of the first transparent electrically-conductive film, the second transparent electrically-conductive film and the transparent insulating film provided therebetween comprise a metal compound, and the first transparent electrically-conductive film and the second transparent electrically-conductive film have a crystalline structure, whereas the transparent insulating film has an amorphous structure. | 06-05-2014 |
20140151225 | ELECTROCHEMICAL DETECTOR AND METHOD FOR PRODUCING SAME - An electrochemical detector is an electrochemical detector for detecting a substance in a liquid by generating a redox cycle, the electrochemical detector comprising: a first working electrode having a first electrode surface, a second working electrode having a second electrode surface, and a plurality of insulating spacer particles, wherein the first and second electrode surfaces are placed so as to face each other so that an electric field is formed between the first and second electrode surfaces, and the plurality of spacer particles are placed along the first and second electrode surfaces so as to separate the first and second electrode surfaces from each other. | 06-05-2014 |
20150076545 | ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING SAME - There is provided a method for manufacturing an electronic component package. The method includes the steps: (i) disposing a metal pattern layer on an adhesive carrier; (ii) placing at least one kind of electronic component on the adhesive carrier, the placed electronic component being not overlapped with respect to the metal pattern layer; (iii) forming a sealing resin layer on the adhesive carrier, and thereby producing a precursor of the electronic component package; (iv) peeling off the adhesive carrier of the precursor, whereby the metal pattern layer and an electrode of the electronic component are exposed at the surface of the sealing resin layer; and (v) forming a metal plating layer such that the metal plating layer is in contact with the exposed surface of the metal pattern layer and the exposed surface of the electrode of the electronic component. | 03-19-2015 |
20150084080 | LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME - There is provided a light-emitting device comprising a light-emitting element and a substrate for light-emitting element. The light-emitting element is in a mounted state on a mounting surface of the substrate, the mounting surface being one of two opposed main surfaces of the substrate. The substrate is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer. The mounted light-emitting element is in an overlapping relation with the voltage-dependent resistive layer. A reflective layer is provided on at least one of the substrate and the voltage-dependent resistive layer such that the reflective layer is located adjacent to the first electrode which is in contact with a substrate exposure surface of the voltage-dependent resistive layer. | 03-26-2015 |