Patent application number | Description | Published |
20110035762 | Emergency Ejecting Apparatus for Optical Disc Drive - The present invention discloses an optical disc drive including a pickup head for reading data from a disc; a spindle motor for supporting and rotating the disc; a loading/ejecting apparatus for loading or ejecting the disc; and an emergency ejecting apparatus. The emergency ejecting apparatus includes a slider for connecting the loading/ejecting apparatus, a rack, an elastic component for connecting the slider and the rack and a rotator rotated with the movement of the slider. When a user drives the rotator and the elastic component is elastically deformed, the slider is moved in the optical disc drive to drive the loading/ejecting apparatus to eject the disc. | 02-10-2011 |
20110157076 | Method and Apparatus for Adjusting Touch Control Parameter - A method utilized for adjusting touch control parameters, for deciding time for updating a touch control parameter of a touch control device, is disclosed. The touch control parameter includes an equivalent value of base capacitance corresponding to an environmental capacitance and a threshold value corresponding to a touch event. The method includes determining an amount of a touch sensing signal being located in an invalid range when the touch sensing signal is located in the invalid range, and starting to update the equivalent value of base capacitance when the amount of the touch sensing signal being located in the invalid range is greater than a first default value. | 06-30-2011 |
20110273192 | CAPACITANCE MEASUREMENT DEVICE FOR A TOUCH CONTROL DEVICE - A capacitance measurement device includes a charging control unit for charging a measured capacitor, a discharging control unit for discharging the measured capacitor, a first switch coupled to the measured capacitor and the charging control unit for controlling a connection between the measured capacitor and the charging control unit according to a first switching signal, a second switch coupled to the measured capacitor and the discharging control unit for controlling a connection between the measured capacitor and the discharging control unit according to a second switching signal, a first A/D converter coupled to the measured capacitor for converting a voltage signal on the measured capacitor into a first signal, and a duty cycle detecting circuit coupled to the measured capacitor for converting the voltage signal on the measured capacitor into a count value that represents the capacitance of the measured capacitor and outputting the count value to a processing unit. | 11-10-2011 |
20110273193 | TOUCH DETECTION METHOD AND RELATED TOUCH CONTROL DEVICE - A touch detection method for a touch control device including a touch panel includes examining whether a charging capacity for charging a measured capacitor of the touch panel and a discharging capacity for discharging the measured capacitor are determined; charging and discharging the measured capacitor by using the charging capacity and the discharging capacity when the charging capacity and the discharging capacity are determined and receiving a count value representing the capacitance of the measured capacitor, examining whether a base count value is set, calculating a difference between the count value and the base count value when the base count value is set, for determining whether the touch panel is touched, examining whether the count value is in a predetermined range, and performing a charging and discharging capacity setting process when the count value is out of the predetermined range, for adjusting the charging capacity and the discharging capacity. | 11-10-2011 |
20110309114 | HIGH EFFICIENCY CHEMICAL CONNECTING DEVICE AND LIQUID CHEMICAL DISPENSING SYSTEM USING THE SAME - A connecting device for ensuring proper connection of liquid containers is provided. The connecting device comprises a bottle closure having a dip tube passage and a first key code pattern at the top. A rupturable film is disposed in the bottle closure. A connector is provided for coupling with the bottle closure. The connector has an upper member and a lower member. The bottom surface of the upper member has a second key code pattern configured to mate with the first key code pattern. The lower member is pivotally coupled to the upper member. A dip tube penetrates the upper member of the connector. A pre-check member having a puncturing structure for puncturing through the rupturable film is also provided. The pre-check member has a key code pattern substantially identical to the second key code pattern to mate with the first key code pattern. | 12-22-2011 |
20120148069 | MICROPHONE ARRAY STRUCTURE ABLE TO REDUCE NOISE AND IMPROVE SPEECH QUALITY AND METHOD THEREOF - The present invention discloses a microphone array structure able to reduce noise and improve speech quality and a method thereof. The method of the present invention comprises steps: using at least two microphone to receive at least two microphone signals each containing a noise signal and a speech signal; using FFT modules to transform the microphone signals into frequency-domain signals; calculating an included angle between a speech signal and a noise signal of the microphone signal, and selecting a phase difference estimation algorithm, a noise reduction algorithm or both to reduce noise according to the included angle; if the phase difference estimation algorithm is used, calculating phase difference of the microphone signals to obtain a time-space domain mask signal; and multiplying the mask signal and the average of the microphone signals to obtain the speech signals of the microphone signals. Thereby is eliminated noise and improve speech quality. | 06-14-2012 |
20120249446 | TOUCH-SENSING APPARATUS - A touch-sensing apparatus including a touch panel and a touch-sensing controller is provided. The touch panel includes a plurality of touch blocks. Each of the touch blocks includes a first portion and a second portion. The touch-sensing controller includes a driving line and a plurality of sensing lines. The driving line is coupled to the first portions of the touch blocks, and the sensing lines are respectively coupled to the second portions of the touch blocks. The touch-sensing controller outputs a driving signal to the first portions through the driving line and receives a plurality of sensing signals generated by the second portions according to the driving signal through the sensing lines, so as to determine a touch coordinates corresponding to one of the touch blocks. | 10-04-2012 |
20130257790 | CAPACITIVE TOUCH DEVICE AND SENSING METHOD THEREOF - A capacitive touch device includes a capacitive touch panel, a driving control unit, k ADCs, a multiplex network and a processing unit. The capacitive touch panel has an m×n sensing point matrix formed by m driving line and n sensing lines. The driving control unit is coupled to the m driving lines. The multiplex network connects the n sensing lines and the k ADCs by time-domain multiplexing. The processing unit is coupled to the k ADCs. At least a part of the driving lines and at least a part of the sensing lines are assigned to be electrically connected. The processing unit senses according to multiple frequencies to obtain multiple signal strength values, and selects the frequency corresponding to a smallest signal value to be a sensing frequency of the capacitive touch device. | 10-03-2013 |
20130271420 | TOUCH CONTROL APPARATUS AND TOUCH DETECTION METHOD THEREOF - A touch detection method is used in a touch panel. The touch panel is capacitive touch panel integrated with a display panel. The method includes at least obtaining at least one control signal carrying synchronous information from the display panel. The control signal is used to control the display panel to display an image. The method also includes analyzing the control signal to obtain an interference time period, at which the touch panel is possibly interfered, and generating a trigger signal. A driving voltage signal and a sensing period of the touch panel are controlled according to the trigger signal, so that the sensing period is not overlapped with the interference time period. | 10-17-2013 |
20140015793 | CAPACITIVE TOUCH DEVICE AND DETECTION METHOD THEREOF - A detection method for a capacitive touch device is provided. The detection method includes steps of: driving an M | 01-16-2014 |
20140092033 | TOUCH DETECTION METHOD FOR TOUCH PANEL - A touch detection method for a touch panel. The touch panel has a plurality of sensing nodes. Each sensing node has a baseline value. Each sensing node is sensed to obtain a scanned value. A touch event is detected according to a comparison with a finger-on threshold. When there is no touch event, the method detects whether or not an abnormal object has entered the sensing node. When entered, the method judges whether a difference count between the scanned value and baseline value is larger than a calibration level. When the difference count is larger, then the scanned value is used to update the baseline value. When no abnormal object, then the method judges whether the difference count is larger than a noise threshold. When the difference count is larger, then the scanned value is used to update the baseline value. The calibration level is smaller than finger-on threshold. | 04-03-2014 |
20140368223 | CAPACITANCE MEASUREMENT DEVICE AND ELECTRONIC DEVICE THEREOF - A capacitance measurement device for measuring the capacitance of a measured capacitor includes a charging control unit for charging the measured capacitor; a discharging control unit for discharging the measured capacitor; a voltage converting circuit coupled to the measured capacitor, for converting a voltage signal on the measured capacitor into a value that represents the capacitance of the measured capacitor; wherein in a first period, one of the charging control unit and the discharge control unit charges/discharges the measured capacitor and in a second period after the first period, the other one of the charging control unit and the discharge control unit discharges/charges the measured capacitor. | 12-18-2014 |
20150309603 | PHASE COMPENSATION METHOD FOR MULTI-SCAN IN TOUCH SENSING SYSTEM AND PHASE COMPENSATION CIRCUIT THEREOF - A phase compensation method for multi-scan in touch sensing system is provided. The phase compensation method includes the following steps. A plurality of carrier signals are received, and a demodulating operation is preformed on each of the carrier signals to obtain a first component signal and a second component signal of each of the carrier signals. An inverse matrix operation is respectively preformed on the first component signal and the second component signal both demodulated by the demodulating operation. A signal mixing operation is preformed on the first component signal and the second component signal both processed by the inverse matrix operation to obtain raw data of each of the carrier signals. Furthermore, a phase compensation circuit applying afore-said phase compensation method is also provided. | 10-29-2015 |
20150338448 | NOISE DETECTION DEVICE, SYSTEM AND METHOD - A noise detection device, system, and a method of detecting noise signals are disclosed. The noise detection device includes a drive circuit, a sense circuit and a controller. The drive circuit drives a plurality of drive lines having a first polarity pattern and a second polarity pattern, wherein an operation of the first polarity pattern and the second polarity pattern substantially equals zero over a predetermined time period. The sense circuit senses a plurality of sense signals from at least one sense line during the predetermined time period. The controller derives a magnitude of a noise signal from the at least one sense line according to the sense signals. | 11-26-2015 |
20150338992 | TOUCH APPARATUS, TOUCH CONTROLLER THEREOF AND NOISE DETECTION METHOD - A noise detection method including the following steps is provided. During different time periods, plural sets of driving signals are respectively transmitted to driving lines of the touch panel to drive sensing lines of the touch panel to generate plural sets of sensing signals. The plural sets of sensing signals are respectively received and calculated to obtain plural sets of summation signals. One set of summation signals includes first summation signals, and another set of summation signals includes second summation signals. A part or all of the first summation signals is replaced by the second summation signals. A signal value of a combination of the first and the second summation signals is calculated to obtain a summation thereof. The summation of the signal value of the combination is smaller than a summation of a signal values of the first summation signals before recombination. | 11-26-2015 |
20150338993 | Method of Determining Touch Event in Touch Detection System - A method of determining a touch event in a touch detection system includes transmitting at least one driving signal to a touch panel of the touch detection system; receiving a sensing signal corresponding to the driving signal from the touch panel; determining whether the touch event occurs by performing an initial digital operation on the sensing signal; determining whether the sensing signal is interfered with by a noise signal; and performing an entire determination on the sensing signal when the touch event is determined to occur or the sensing signal is determined to be interfered with by the noise signal. | 11-26-2015 |
Patent application number | Description | Published |
20100168871 | ARTIFICIAL DURA BIOMEDICAL DEVICE AND BRAIN SURGERY METHOD UTILIZING THE SAME - An artificial dura biomedical device and a brain surgery method utilizing the same are disclosed. The steps includes: fixing an artificial dura to a partial skull; and fixing the partial skull with the artificial dura to a cut hole of a whole skull. The artificial dura biomedical device includes an artificial dura and a connecting element. The connecting element fixes the partial skull with the artificial dura. | 07-01-2010 |
20110015654 | SPINAL DISC ANULUS REPAIR METHOD AND APPARATUS - An apparatus for anulus fibrosus repair includes a shaft, a pair of curved suturing needles mounted in parallel on the shaft, and a rotational driving mechanism connected to the shaft, which is configured to rotate the shaft and the pair of needles about a rotation axis of the shaft. Each needle includes a substantially semi-annular body having a proximal end, a distal end, an inner periphery, and an outer periphery, and an arm extending radially inward from the proximal end, in which a concavity is formed in the body proximate to the distal end extending in a direction away from it. Also disclosed is a suturing technique associated with use of the repair apparatus. | 01-20-2011 |
20120215322 | ARTIFICIAL DURA BIOMEDICAL DEVICE AND BRAIN SURGERY METHOD UTILIZING THE SAME - An artificial dura biomedical device and a brain surgery method utilizing the same are disclosed. The steps includes: fixing an artificial dura to a partial skull; and fixing the partial skull with the artificial dura to a cut hole of a whole skull. The artificial dura biomedical device includes an artificial dura and a connecting element. The connecting element fixes the partial skull with the artificial dura. | 08-23-2012 |
20150108607 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF - An integrated circuit includes a stacked MIM capacitor and a thin film resistor and methods of fabricating the same are disclosed. A capacitor bottom metal in one capacitor of the stacked MIM capacitor and the thin film resistor are substantially at the same layer of the integrated circuit, and the capacitor bottom metal and the thin film resistor are also made of substantially the same materials. The integrated circuit with both of a stacked MIM capacitor and a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above. | 04-23-2015 |
20160104785 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a first gate layer and a first dielectric layer thereon, and a shallow trench isolation (STI) in the substrate and surrounding the first gate layer and the first dielectric layer; removing the first dielectric layer; forming a first spacer on the sidewall of the STI above the first gate layer; and using the first spacer as mask to remove part of the first gate layer and part of the substrate for forming a first opening while defining a first gate structure and a second gate structure. | 04-14-2016 |
Patent application number | Description | Published |
20100301758 | FLAT DISPLAY DEVICE BLACKLIGHT MODULE THEREOF FOR NIGHT VISION IMAGING SYSTEM - A flat display device is adapted for human eye observation with or without applying a NVIS (Night Vision Imaging System). The flat display device includes a display panel, a backlight module and a backlight driving unit. The backlight module includes multiple red light LEDs (Light Emitting Diodes), green light LEDs and blue light LEDs that form together a light source array, so as to generate a backlight by mixing and projecting the red light, green light and blue light to the display panel. The backlight driving unit is electrically connected with the light source array and used to drive and control the red light LEDs, green light LEDs and blue light LEDs. At a night-vision mode, the backlight driving unit may, upon actuation of a actuating signal, adjust or disable the red light LED by for example decreasing or turning off the driving electricity sent to the red light LED, thereby achieving the requirements for nigh vision purposes. | 12-02-2010 |
20130031572 | TILT ADJUSTING DEVICE FOR OPTICAL PICKUP HEAD - A tilt adjusting device for an optical pickup head (OPU) is fixed on a chassis of an optical drive. The device includes a first screw and a secondary guide rail. The secondary guide rail includes a guide rail part, a base part, an extension part, and an elastic element. The guide rail part is embedded into a rail notch of the OPU and the extension part has a first end and a second end connected with the base part and the guide rail part. A first compressible space is defined between the base part, the elastic element and the chassis. The first screw is penetrated through the base part and the first compressible space and screwed in the chassis. By changing a screwed depth of the first screw in a screw hole, an altitude of the guide rail part is correspondingly adjusted. | 01-31-2013 |
20140001346 | IMAGE PROJECTION DEVICE AND DETECTION METHOD THEREOF | 01-02-2014 |
Patent application number | Description | Published |
20100009185 | Enameled wire containing a nano-filler - An enameled wire containing a nano-filler includes a metallic wire and at least one layer of insulating coating. At least one layer of the at least one layer of insulating coating includes a nano-filler. The nano-filler is a modified silicon dioxide slurry comprising silicon dioxide, organic solvent and organic silane coupling agent. The nano-filler comprises silicon dioxide modified with an organic silane coupling agent to improve dispersion of the nano-filler and maintain properties of the insulating coating. In addition, material and manufacturing costs of the enameled wire can be lowered. | 01-14-2010 |
20100193469 | METHOD FOR MANUFACTURING MICRO/NANO THREE-DIMENSIONAL STRUCTURE - A method for manufacturing a micro/nano three-dimensional structure including the following steps is described. A mold is provided, and a pattern structure including a plurality of convex portions and concave portions is set in the mold. A transfer material layer including a first portion on the convex portions and a second portion on the concave portions is formed. A flexible substrate is disposed on the mold and contacts with the first portion of the transfer material layer. A heating step is performed to partially heat the flexible substrate through the first portion. A pressure is applied on the flexible substrate to adhere or press the first portion to the flexible substrate. The mold is removed. An etching step is performed on the flexible substrate by using the first portion of the transfer material layer as a mask to form a micro/nano three-dimensional structure in the flexible substrate. | 08-05-2010 |
20120295437 | METHOD FOR FABRICATING THROUGH-SILICON VIA STRUCTURE - A method for fabricating through-silicon via structure is disclosed. The method includes the steps of: providing a semiconductor substrate; forming a through-silicon via in the semiconductor substrate; covering a liner in the through-silicon via; performing a baking process on the liner; forming a barrier layer on the liner; and forming a through-silicon via electrode in the through-silicon via. | 11-22-2012 |
20120305403 | Electrical Chemical Plating Process - An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure. | 12-06-2012 |
20130140688 | Through Silicon Via and Method of Manufacturing the Same - The present invention discloses a through silicon via and method of manufacturing the same comprising the steps of providing a substrate, forming a plurality of through silicon via (TSV) holes in said substrate, forming a seed layer on the surface of said substrate and said a plurality of TSV holes, forming a patterned mask on said substrate, wherein said patterned mask comprises a plurality of first openings corresponding to said TSV holes and a plurality of second openings adjacent to or surrounding said a plurality of first openings, forming a material layer on said substrate, wherein said material layer is filled into said TSV holes and said first openings to form a plurality of through silicon vias, and said material layer is filled into said second openings to form a plurality of dummy bumps. | 06-06-2013 |
20140346645 | THROUGH SILICON VIA AND PROCESS THEREOF - A through silicon via includes a substrate and a conductive plug. The substrate has a hole in a side. The conductive plug is disposed in the hole, and the conductive plug having an upper part protruding from the side, wherein the upper part has a top part and a bottom part, and the top part is finer than the bottom part. Moreover, a through silicon via process formed said through silicon via is also provided, which includes the following step. A hole is formed in a substrate from a side. A first conductive material is formed to cover the hole and the side. A patterned photoresist is formed to cover the side but exposing the hole. A second conductive material is formed on the exposed first conductive material. The patterned photoresist is removed. The first conductive material on the side is removed to form a conductive plug in the hole. | 11-27-2014 |
20150041952 | SEMICONDUCTOR STRUCTURE - A semiconductor structure is provided. The semiconductor structure includes an interposer structure. The interposer structure includes an interposer substrate, a ground, through vias, a dielectric layer, and an inductor. The through vias are formed in the interposer substrate and electrically connected to the ground. The dielectric layer is on the interposer substrate. The inductor is on the dielectric layer. | 02-12-2015 |
20150179516 | INTEGRATED STRUCTURE AND METHOD FOR FABRICATING THE SAME - A method for fabricating integrated structure is disclosed. The method includes the steps of: providing a substrate; forming a through-silicon hole in the substrate; forming a patterned resist on the substrate, wherein the patterned resist comprises at least one opening corresponding to a redistribution layer (RDL) pattern and exposing the through-silicon hole and at least another opening corresponding to another redistribution layer (RDL) pattern and connecting to the at least one opening; and forming a conductive layer to fill the through-silicon hole, the at least one opening and the at least another opening in the patterned resist so as to form a through-silicon via, a through-silicon via RDL pattern and another RDL pattern in one structure. | 06-25-2015 |
20150179580 | HYBRID INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME - A method for fabricating hybrid interconnect structure is disclosed. The method includes the steps of: providing a material layer; forming a through-silicon hole in the material layer; forming a patterned resist on the material layer, wherein the patterned resist comprises at least an opening for exposing the through-silicon hole; and forming a conductive layer to fill the through-silicon hole and the opening in the patterned resist. | 06-25-2015 |
Patent application number | Description | Published |
20100027722 | WIRED SIGNAL RECEIVING APPARATUS - A wired signal receiving apparatus including a signal receiver, a signal peak detector, and a signal comparator is disclosed. The signal receiver includes an operation current detecting circuit for detecting an operation current. The signal receiver further receives a transmission signal. The signal peak detector receives the operation current, detects a peak thereof, and generates a peak current. The signal comparator compares a reference signal and the peak current to generate an output current for regulating the operation current. | 02-04-2010 |
20110249510 | EMBEDDED STORAGE APPARATUS AND TEST METHOD THEREOF - An embedded storage apparatus including a control unit, a storage unit, and a signal processing and measurement unit is provided. The control unit outputs a plurality of signals, wherein the signals include a mode selection signal and a plurality of control signals. The storage unit is controlled by the control unit to read a data from a predetermined address. The storage unit has a plurality of output terminals. The signal processing and measurement unit has a plurality of input terminals and a plurality of output terminals, wherein the input terminals are connected to the output terminals of the storage unit. The signal processing and measurement unit reads the data from the output terminals and determines whether to perform a predetermined processing on the data according to the mode selection signal. After that, the signal processing and measurement unit outputs the data through the output terminals. | 10-13-2011 |
20140009191 | OUTPUT BUFFER - An output buffer is disclosed. The output buffer includes an input-stage circuit, an output-stage circuit and a compensation circuit. The compensation circuit includes a capacitor, a first switch, a second switch, a third switch, and a fourth switch. The input-stage circuit receives a differential input signal and outputting a response signal. The output-stage circuit receives the response signal and outputting an output signal. The first switch controls a connection between the input-stage circuit and a first terminal of the capacitor. The second switch controls the connection between an output terminal of the compensation circuit and a second terminal of the capacitor. The third switch controls the connection between the input-stage circuit and the second-terminal of the capacitor. The forth switch controls the connection between the output terminal of the compensation circuit and the first terminal of the capacitor. | 01-09-2014 |
Patent application number | Description | Published |
20120092806 | PROTECTION STRUCTURE FOR METAL-OXIDE-METAL CAPACITOR - A capacitor structure includes first and second sets of electrodes and a plurality of line plugs. The first set of electrodes has a first electrode and a second electrode formed in a first metallization layer among a plurality of metallization layers, wherein the first electrode and the second electrode are separated by an insulation material. The second set of electrodes has a third electrode and a fourth electrode formed in a second metallization layer among the plurality of metallization layers, wherein the third electrode and the fourth electrode are separated by the insulation material. The line plugs connect the second set of electrodes to the first set of electrodes. | 04-19-2012 |
20120119306 | METAL GATE TRANSISTOR, INTEGRATED CIRCUITS, SYSTEMS, AND FABRICATION METHODS THEREOF - A method of forming an integrated circuit structure includes providing a gate strip in an inter-layer dielectric (ILD) layer. The gate strip comprises a metal gate electrode over a high-k gate dielectric. An electrical transmission structure is formed over the gate strip and a conductive strip is formed over the electrical transmission structure. The conductive strip has a width greater than a width of the gate strip. A contact plug is formed above the conductive strip and surrounded by an additional ILD layer. | 05-17-2012 |
20150115381 | MECHANISMS FOR FORMING RADIO FREQUENCY (RF) AREA OF INTEGRATED CIRCUIT STRUCTURE - Embodiments of mechanisms of forming a radio frequency area of an integrated circuit are provided. The radio frequency area of an integrated circuit structure includes a substrate, a buried oxide layer formed over the substrate, and an interface layer formed between the substrate and the buried oxide layer. The radio frequency area of an integrated circuit structure also includes a silicon layer formed over the buried oxide layer and an interlayer dielectric layer formed in a deep trench. The radio frequency area of an integrated circuit structure further includes the interlayer dielectric layer extending through the silicon layer, the buried oxide layer and the interface layer. The radio frequency area of an integrated circuit structure includes an implant region formed below the interlayer dielectric layer in the deep trench and a polysilicon layer formed below the implant region. | 04-30-2015 |
20150155096 | METHOD OF FORMING CAPACITOR STRUCTURE - A method of forming a capacitor structure includes forming a first set of electrodes having a first electrode and a second electrode, wherein each electrode of the first set of electrodes has an L-shaped portion. The method further includes forming a second set of electrodes having a third electrode and a fourth electrode, wherein each electrode of the second set of electrodes has an L-shaped portion. The method further includes forming insulation layers between the first set of electrodes and the second set of electrodes. The method further includes forming a first L-shaped line plug connecting the first electrode to the third electrode, wherein an entirety of an outer surface of the first L-shaped line plug is recessed with respect to an outer surface of the L-shaped portion of the first electrode. The method further includes forming a second line plug connecting the second electrode to the fourth electrode. | 06-04-2015 |
20150206902 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - Embodiments for forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a buried oxide layer formed over the substrate. An interface layer is formed between the substrate and the buried oxide layer. The semiconductor device structure also includes a silicon layer formed over the buried oxide layer; and a polysilicon layer formed over the substrate and in a deep trench. The polysilicon layer extends through the silicon layer, the buried oxide layer and the interface layer. | 07-23-2015 |
20160099169 | MECHANISMS FOR FORMING RADIO FREQUENCY (RF) AREA OF INTEGRATED CIRCUIT STRUCTURE - The methods for forming a radio frequency area of an integrated circuit are provided. The method includes forming a buried oxide layer over a substrate, and an interface layer is formed between the substrate and the buried oxide layer. The method also includes etching through the buried oxide layer and the interface layer to form a deep trench, and a bottom surface of the deep trench is level with a bottom surface of the interface layer. The method further includes forming an implant region directly below the deep trench and forming an interlayer dielectric layer in the deep trench. | 04-07-2016 |
Patent application number | Description | Published |
20120174917 | PRESS-TYPE MEDICAL NEBULIZER AND PRESSING MEANS THEREOF - In a press-type medical nebulizer and a pressing means thereof, the nebulizer includes a medicament container having an intake channel and a medical spray generator. The pressing means includes a base, a pressing element and a switching element. The base has a gas-delivering tube, a gas-releasing hole and a trough. The pressing element comprises an operating arm pivotally connected into the trough and a valve for closing the gas-releasing hole. The switching element is slidingly provided on the operating arm to be selectively engaged into the trough for fixing the operating arm. When the switching element is engaged into the trough, the switching element causes the valve to close the gas-releasing hole, so that the pressurized gas can continuously flow through the gas-delivering tube and enter the intake channel. By this arrangement, the user needs not to press the pressing means repeatedly, which is convenient and labor-saving. | 07-12-2012 |
20130191661 | EXTERNAL ELECTRONIC DEVICE - An external electronic device connected to an electronic device which includes a first transmission interface is provided. The external electronic device includes a power control module, a data control module, a second transmission interface and a switch module. The power control module receives an external power. The second transmission interface corresponds to the first transmission interface. The switch module controls the second transmission interface to electrically connect to the power control module or the data control module, and thus the external electronic device enters a power mode or a transfer mode. | 07-25-2013 |
20130346962 | MECHANISM AND SYSTEM FOR DEPLOYING SOFTWARE OVER CLOUDS - A mechanism for deploying software over clouds is provided. The mechanism comprises the following steps. A source cloud platform stores a software project and builds up an environmental transfer configuration. The source cloud platform collects the settings of the software project and related resources to obtain a list file, and a target cloud platform receives the list file and assigns a corresponding data transmission status as un-transmitted. When the data transmission status is un-transmitted, the target cloud platform requests the source cloud platform for the software project. The source cloud platform transmits the software project to the target cloud platform. When the target cloud platform confirms that the software project has been received completely according to the list file, the target cloud platform accordingly installs the software project and builds up related resources. | 12-26-2013 |
20140192557 | EDGE-LIT BACKLIGHT MODULE - Disclosed is an edge-lit backlight module having a rectangular back panel with a reflective microstructure, and a first light portion with an inclined plane or a camber is provided for reflecting lights emitted from a plurality of LEDs and with a relatively smaller normal included angle, and a second light portion is provided for reflecting a light with a slightly greater included angle, and a third light portion is provided for reflecting the light with the greatest included angle to guide lights of different intensities to different paths and project the lights to every position of a front panel, so as to achieve a light extraction efficiency with a uniform distribution of luminous intensity of an LED light source. | 07-10-2014 |
20150253611 | TWO-SIDED LIQUID CRYSTAL DISPLAY - A two-sided liquid crystal display includes a base; a supporting pipe disposed at the base; a frame body connected to the supporting pipe; a first liquid crystal display panel unit disposed in the frame body; a second liquid crystal display panel unit disposed in the frame body and being parallel and adjacent to the first liquid crystal display panel unit; a first edge-lit backlight unit disposed in the frame body; a second edge-lit backlight unit disposed in the frame body; a control unit disposed in the base and electrically connected to the first liquid crystal display panel unit, second liquid crystal display panel unit, first edge-lit backlight unit and second edge-lit backlight unit; and a power unit disposed in the base and electrically connected to the control unit. Accordingly, the two-sided liquid crystal display has a simple structure, a low weight, and a small thickness. | 09-10-2015 |
20160097662 | ELECTROMAGNETIC FLOWMETER WITH VOLTAGE-AMPLITUDE CONDUCTIVITY-SENSING FUNCTION FOR A LIQUID IN A TUBE - An electromagnetic flowmeter with voltage-amplitude conductivity-sensing function for a liquid in a tube includes a first microprocessor, a transducer, flow-sensing device, an exciting-current generating device, a voltage-amplitude conductivity-sensing device, and a switch. The transducer includes coils and sensing electrodes. The switch is electrically connected to the first microprocessor and the sensing electrode. The switch is selectively connected to the flow-sensing device or the voltage-amplitude conductivity-sensing device according to the signals sent from the microprocessor. The microprocessor makes the exciting-current generating device to generate an exciting current when the switch is connected to the flow-sensing device. The microprocessor makes the exciting-current generating device to stop generating exciting current and computing conductivity of liquid when the switch is electrically connected to the voltage-amplitude conductivity-sensing device. | 04-07-2016 |
20160135291 | PRINTED CIRCUIT BOARD STRUCTURE - A printed circuit board structure includes a main body and a connecting interface. The connecting interface connects and is located at a side of the main body. The connecting interface includes conductive layers and insulation layers. The conductive layers at least include a first, a second, a third, a fourth conductive layer. The insulation layers at least include a first, a second, a third insulation layers. The insulation layers and the conductive layers are alternately disposed. The first insulation layer is located between the first conductive layer and the second conductive layer. The first conductive layer and the second conductive layer are partially overlapped in their orthographic projections on the first insulation layer. The second insulation layer is located between the second conductive layer and the third conductive layer. The third insulation layer is located between the third conductive layer and the fourth conductive layer. | 05-12-2016 |
Patent application number | Description | Published |
20140047447 | WORK SCHEDULING METHOD AND SYSTEM IMPLEMENTED VIA CLOUD PLATFORM - A work scheduling method implemented via a cloud platform is provided. The work scheduling method is used in a cloud platform work schedule system. The method includes: arranging, by a developing interface of a developing module, a work schedule; generating, by the developing module, a dynamic linking library (DLL) which corresponds to the work schedule and uploading the dynamic linking library to the cloud platform through the internet; transferring, by a disposing module, the dynamic linking library to a Application service; computing, by a scheduling module, a scheduling time according to the work schedule; and executing, by an executing module, the application service according to the scheduling time. | 02-13-2014 |
20150249615 | RESOURCE ADJUSTMENT METHODS AND SYSTEMS FOR VIRTUAL MACHINES - A resource adjustment system and method for virtual machines (VMs) are provided. The method includes: obtaining, by a monitoring module, performance and status information of a first server and at least one VM of the first server; estimating, by an estimating module, the first server and each VM according to the performance and status information and an evaluation index and obtaining a server estimation score of the first server and a virtual machine estimation score of every VM; and finding, by a moving module, a second server according to the performance and status information and the evaluation index when a virtual machine estimation score of at least one first VM of the first server or the server estimation score exceeds a threshold, finding at least one VM suitable to be moved according to a moving order, and moving the at least one VM to the second server. | 09-03-2015 |