Patent application number | Description | Published |
20080197173 | Method for Forming Solder Bump and Method for Mounting Semiconductor Device - [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device. | 08-21-2008 |
20080251894 | Mounted Body and Method for Manufacturing the Same - A mounted body ( | 10-16-2008 |
20080284046 | Flip chip mounting method and bump forming method - A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin | 11-20-2008 |
20090008776 | Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method - In an electronic component mounted body, an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a solder connecter, and the solder connecter contains solder and insulation filler. Alternatively, a solder bump is formed on the electrode of the electronic component, and the solder bump includes the insulation filler. | 01-08-2009 |
20090008800 | FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS - The flip chip mounted body of the present invention includes: a circuit board ( | 01-08-2009 |
20090023245 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - The invention involves mounting a solder resin composition ( | 01-22-2009 |
20090078746 | BUMP FORMING METHOD AND BUMP FORMING APPARATUS - A method for forming bumps | 03-26-2009 |
20090085227 | FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD - A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body. | 04-02-2009 |
20090102064 | CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME - A connection structure (package | 04-23-2009 |
20090115071 | FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES - A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals. | 05-07-2009 |
20090117688 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin | 05-07-2009 |
20090126876 | Flip chip mounting method and method for connecting substrates - A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board | 05-21-2009 |
20090133901 | METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD | 05-28-2009 |
20090200522 | CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME - The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided. | 08-13-2009 |
20090203170 | FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CHIP MOUNTING BODY - A flip chip mounting method includes holding a circuit board ( | 08-13-2009 |
20090230546 | MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME - A mounted body of the present invention includes: a multilayer semiconductor chip | 09-17-2009 |
20100001411 | METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY, AND MUTUAL CONNECTION STRUCTURE BETWEEN SUBSTRATES - A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent. | 01-07-2010 |
20100007033 | METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCTURE, AND CONNECTION STRUCTURE BETWEEN SUBSTRATES - A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates. | 01-14-2010 |
20100011572 | ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP AND PROCESS FOR PRODUCING THE SAME - A process for producing an electronic component assembly, comprising the steps of: (1) preparing a first electronic component whose surface (A) is provided with a plurality of electrodes (a) and a second electronic component whose surface (B) is provided with a plurality of electrodes (b) wherein at least one concave portion is formed in the surface (A) (except for a surface region on which the electrodes (a) are provided) and/or the surface (B) (except for a surface region on which the electrodes (b) are provided); (2) supplying a resin that comprises a solder powder onto the surface (A) of the first electronic component; (3) bringing the second electronic component into contact with a surface of the resin such that the plurality of electrodes (a) of the first electronic component are opposed to the plurality of electrodes (b) of the second electronic component; and (4) heating the first electronic component and/or the second electronic component, and thereby forming solder connections from the solder powder, the solder connections serving to electrically interconnect the electrodes (a) and (b), wherein, upon the heating step (4), gas bubbles are generated within the resin such that the bubble generation originates at least from the concave portion, and the generated bubbles cause the solder powder to move and congregate onto the electrodes (a) and (b). | 01-21-2010 |
20100044091 | ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP - An electrode structure | 02-25-2010 |
20100148376 | FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY - A flip chip mounting process includes the steps of supplying a resin ( | 06-17-2010 |
20100203675 | FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS - The flip chip mounted body of the present invention includes: a circuit board ( | 08-12-2010 |
20100224986 | MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME - A mounted body ( | 09-09-2010 |
20110201195 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - The invention involves mounting a solder resin composition ( | 08-18-2011 |
20110204366 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY - A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided. | 08-25-2011 |
20110204367 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY - A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided. | 08-25-2011 |