Ying-Lin
Ying-Lin Chen, Tu-Cheng TW
Patent application number | Description | Published |
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20080297925 | CAMERA MODULE - An exemplary camera module includes a lens module and a lens holder. The lens module is coupled with the lens holder using threads. The thread coupling section between the lens module and the lens holder is filled with a damping oil for sealing the thread coupling section. | 12-04-2008 |
20080309812 | CAMERA MODULE - A camera module includes a lens module including a holder and configured for imaging, an image sensor module received in the holder of the lens module and configured for capturing images, and a protective film adhered to an outer surface of the lens module. Due to the protective film, the outer and inner screw threads of the barrel and the holder are insulated from the outside. As such, use of the protective film maintains the quality of image produced by the camera module. | 12-18-2008 |
20090011184 | METHOD OF MAKING A FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary method of making an FPC includes forming a substrate comprising metal foil layers interleaved with intervening layers by: (a) laminating intervening layers with metal foil layers; (b) adhering a covering film to outermost surfaces of the substrate; (c) defining a hole in one side of the substrate through the covering film and at least two metal foil layers and the intervening layer between the at least two metal foil layers by etching or laser technology; and (d) plating a portion of an inner wall of the hole with conductive material to form a via to electrically connect the at least two metal foil layers. | 01-08-2009 |
20090109327 | CAMERA MODULE - A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module. | 04-30-2009 |
Ying-Lin Chen, San Jose, CA US
Patent application number | Description | Published |
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20090094258 | OFF-LOADING STAR JOIN OPERATIONS TO A STORAGE SERVER - A method, storage server, and computer readable medium for off-loading star-join operations from a host information processing system to a storage server. At least a first and second set of keys from a first and second dimension table, respectively are received from a host system. Each of the first and second set of keys is associated with at least one fact table. A set of locations associated with a set of foreign key indexes are received from the host system. A set of fact table indexes are traversed. At least a first set of Row Identifiers (“RIDs”) associated with the first set of keys and at least a second set of RIDs associated with the second set of keys are identified. An operation is performed on the first and second sets of RIDs to identify an intersecting set of RIDs. The intersecting set of RIDs are then stored. | 04-09-2009 |
Ying-Lin Liu, Hsinchu City TW
Patent application number | Description | Published |
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20090319968 | DESIGN AND VERIFICATION OF 3D INTEGRATED CIRCUITS - A method of designing a 3D integrated circuit (3D IC) including providing a first layout corresponding to a first device of a 3D IC and a second layout corresponding to a second device of a 3D IC is provided. A verification, such as LVS or DRC, may be performed not only on each device separately, but may also be performed to ensure proper connectivity between devices. The verification may be performed on a single layout file (e.g., GDS II file) including the interface layer of the first and second die. Dummy feature pattern may be determined for the 3D IC using a layout including the interface layers of the first and second devices. | 12-24-2009 |
20120036489 | DESIGN AND VERIFICATION OF 3D INTEGRATED CIRCUITS - A method of designing and verifying 3D integrated circuits (3D IC) including providing a first layout corresponding to a first device of a 3D IC. The first layout includes a first interface layer. A second layout corresponding to a second device of the 3D IC is also provided. The second layout includes a second interface layer. A verification of the 3D is performed by verifying the first and second interface layers. The verification includes performing at least one of a design rule check (DRC) or a layout-versus-schematic (LVS) on the first and/or second interface layers. | 02-09-2012 |