Patent application number | Description | Published |
20080297884 | PROJECTION OBJECTIVE AND PROJECTION EXPOSURE APPARATUS FOR MICROLITHOGRAPHY - Projection objective, projection exposure apparatuses and related systems and components are disclosed. | 12-04-2008 |
20090306921 | SPECIFICATION, OPTIMIZATION AND MATCHING OF OPTICAL SYSTEMS BY USE OF ORIENTATIONAL ZERNIKE POLYNOMIALS - The present disclosure relates to specification, optimization and matching of optical systems by use of orientation Zernike polynomials. In some embodiments, a method for assessing the suitability of an optical system of a microlithographic projection exposure apparatus is provided. The method can include determining a Jones pupil of the optical system, at least approximately describing the Jones pupil using an expansion into orientation Zernike polynomials, and assessing the suitability of the optical system on the basis of the expansion coefficient of at least one of the orientation Zernike polynomials in the expansion. | 12-10-2009 |
20100097592 | HIGH TRANSMISSION, HIGH APERTURE CATADIOPTRIC PROJECTION OBJECTIVE AND PROJECTION EXPOSURE APPARATUS - The disclosure provides projection objectives which may be used in a microlithographic projection exposure apparatus to expose a radiation-sensitive substrate arranged in the region of an image surface of the projection objective with at least one image of a pattern of a mask arranged in the region of an object surface of the projection objective. The disclosure also provides projection exposure apparatus which include such projection objectives, as well as related components and methods. | 04-22-2010 |
20100134891 | OPTICAL SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure concerns an optical system of a microlithographic projection exposure apparatus. To permit comparatively flexible and fast influencing of intensity distribution and/or the polarization state, an optical system includes at least one layer system that is at least one-side bounded by a lens or a mirror. The layer system is an interference layer system of several layers and has at least one liquid or gaseous layer portion with a maximum thickness of one micrometer (μm), and a manipulator for manipulation of the thickness profile of the layer portion. | 06-03-2010 |
20100157268 | ILLUMINATION SYSTEM OF A MICROLOTHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An illumination system of a microlithographic projection exposure apparatus includes a beam deflection array including a number beam deflection elements, for example mirrors. Each beam deflection element is adapted to deflect an impinging light beam by a deflection angle that is variable in response to control signals. The light beams reflected from the beam deflection elements produce spots in a system pupil surface. The number of spots illuminated in the system pupil surface during an exposure process, during which a mask is imaged on a light sensitive surface, is greater than the number of beam deflection elements. This may be accomplished with the help of a beam multiplier unit that multiplies the light beams reflected from the beam deflection elements. In another embodiment the beam deflecting elements are controlled such that the irradiance distribution produced in the system pupil surface changes between two consecutive light pulses of an exposure process. | 06-24-2010 |
20100231888 | OPTICAL SYSTEM - The disclosure provides an optical system having an optical axis, where the optical system includes a polarization manipulator which includes first and second subelements. The first subelement has a non-planar, optically effective surface. For light passing through the first subelement, the first subelement causes a change in the polarization state. A maximum effective retardation introduced by the first subelement along the optical axis is less than a quarter of the working wavelength of the optical system. The first subelement and the second subelement have mutually facing surfaces which are mutually complementary. The optical system also includes a position manipulator to manipulate the relative position of the first and second subelements. | 09-16-2010 |
20100277708 | ILLUMINATION SYSTEM OF A MICROLOTHOGRAPHIC PROJECTION EXPOSURE APPARATUS - An illumination system of a microlithographic projection exposure apparatus includes a beam deflection array including a number beam deflection elements, for example mirrors. Each beam deflection element is adapted to deflect an impinging light beam by a deflection angle that is variable in response to control signals. The light beams reflected from the beam deflection elements produce spots in a system pupil surface. The number of spots illuminated in the system pupil surface during an exposure process, during which a mask is imaged on a light sensitive surface, is greater than the number of beam deflection elements. This may be accomplished with the help of a beam multiplier unit that multiplies the light beams reflected from the beam deflection elements. In another embodiment the beam deflecting elements are controlled such that the irradiance distribution produced in the system pupil surface changes between two consecutive light pulses of an exposure process. | 11-04-2010 |
20110075121 | CATADIOPTRIC PROJECTION OBJECTIVE - Catadioptric projection objective ( | 03-31-2011 |
20110109894 | POLARIZATION-MODULATING OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THEREOF - The disclosure relates to a method of manufacturing a polarization-modulating optical element, wherein the element causes, for light passing through the element and due to stress-induced birefringence, a distribution of retardation between orthogonal states of polarization, the method comprising joining a first component and a second component, wherein a non-plane surface of the first component being provided with a defined height profile is joined with a plane surface of the second component, whereby a mechanical stress causing the stress-induced birefringence is produced in the such formed polarization-modulating optical element. | 05-12-2011 |
20110164235 | PROJECTION OBJECTIVE AND PROJECTION EXPOSURE APPARATUS FOR MICROLITHOGRAPHY - Projection objectives, projection exposure apparatuses and related systems and components are disclosed. | 07-07-2011 |
20110304926 | CATADIOPTRIC PROJECTION OBJECTIVE WITH TILTED DEFLECTING MIRRORS, PROJECTION EXPOSURE APPARATUS, PROJECTION EXPOSURE METHOD, AND MIRROR - A projection objective has an object surface and an image surface. The projection objective includes a plurality of optical elements arranged along an optical axis and configured so that during operation the projection objective images a pattern arranged in the object surface onto the image surface. The optical elements include a concave mirror a first deflecting mirror and a second deflecting mirror. The first deflecting mirror is tilted relative to the optical axis by a first tilt angle, t | 12-15-2011 |
20120208115 | IMAGING OPTICS - An imaging optics includes a plurality of mirrors which reflect imaging light to image an object field in an object plane into an image field in an image plane. A mirror body of at least one of the mirrors has a through-opening for the imaging light to pass through. The through-opening has an internal region of a smallest opening width in the mirror body. The through-opening expands from the internal region towards both edge regions of the mirror body. A disturbing influence of unused light portions is reduced or eliminated completely. | 08-16-2012 |
20120218536 | CATADIOPTRIC PROJECTION OBJECTIVE INCLUDING A REFLECTIVE OPTICAL COMPONENT AND A MEASURING DEVICE - A catadioptric projection objective for images an object field onto an image field via imaging radiation. The projection objective includes at least one reflective optical component and a measuring device. The reflective optical component, during the operation of the projection objective, reflects a first part of the imaging radiation and transmits a second part of the imaging radiation. The reflected, first part of the imaging radiation at least partly contributes to the imaging of the object field. The transmitted, second part of the imaging radiation is at least partly fed to a measuring device. This allows a simultaneous exposure of the photosensitive layer at the location of the image field with the imaging radiation and monitoring of the imaging radiation with the aid of the measuring device. | 08-30-2012 |
20120224186 | METHOD FOR PRODUCING A MIRROR HAVING AT LEAST TWO MIRROR SURFACES, MIRROR OF A PROJECTION EXPOSURE APPARATUS FOR MICROLITHOGRAPHY, AND PROJECTION EXPOSURE APPARATUS - A mirror (M) of a projection exposure apparatus for microlithography configured for structured exposure of a light-sensitive material and a method for producing a mirror (M). The mirror (M) has a substrate body (B), a first mirror surface (S) and a second mirror surface (S′). The first mirror surface (S) is formed on a first side (VS) of the substrate body (B). The second mirror surface (S′) is formed on a second side (RS) of the substrate body (B), the second side being different from the first side of the substrate body (B). The mirror (M) may be embodied, in particular, such that the substrate body (B) is produced from a glass ceramic material. | 09-06-2012 |
20130070227 | IMAGING OPTICAL SYSTEM - An imaging optical system for EUV projection lithography has a plurality of mirrors for imaging an object field in an object plane into an image field in an image plane. An image-side numerical aperture of the imaging optical system is at least 0.3. The imaging optical system has a pupil obscuration which is greater than 0.40 and an image filed size of at least 1 mm×10 mm. The imaging optical system can provide high quality imaging of the object. | 03-21-2013 |
20130301024 | METHOD OF OPERATING A PROJECTION EXPOSURE TOOL FOR MICROLITHOGRAPHY - A method of operating a projection exposure tool for microlithography is provided. The projection exposure tool has a projection objective for imaging object structures on a mask into an image plane using electromagnetic radiation, during which imaging the electromagnetic radiation causes a change in optical properties of the projection objective. The method comprises the steps of: providing the layout of the object structures on the mask to be imaged and classifying the object structures according to their type of structure, calculating the change in the optical properties of the projection objective effected during the imaging process on the basis of the classification of the object structures, and using the projection exposure tool for imaging the object structures into the image plane, wherein the imaging behavior of the projection exposure tool is adjusted on the basis of the calculated change of the optical properties in order to at least partly compensate for the change of the optical properties of the projection objective caused by the electromagnetic radiation during the imaging process. | 11-14-2013 |