Patent application number | Description | Published |
20110138117 | MEMORY CONTROLLER, NONVOLATILE STORAGE DEVICE, ACCESSING DEVICE, NONVOLATILE STORAGE SYSTEM, AND METHOD AND PROGRAM FOR WRITING DATA - A digital still camera performs temporary high-speed writing when capturing a large number of images in a short time. Lengthy processing for erased block allocation or copying performed inside a nonvolatile storage device may disable the captured images to be written completely (may cause some frames to drop). A nonvolatile storage system includes an access device ( | 06-09-2011 |
20110167208 | NONVOLATILE MEMORY DEVICE, ACCESS DEVICE, NONVOLATILE MEMORY SYSTEM, AND MEMORY CONTROLLER - The nonvolatile memory device prevents data writing from temporarily slowing down significantly in the middle of writing data to a block when an access device writes all the data in the block in units of a smaller size than the block. The nonvolatile memory device ( | 07-07-2011 |
20110213915 | NONVOLATILE STORAGE DEVICE, ACCESS DEVICE AND NONVOLATILE STORAGE SYSTEM - A nonvolatile storage device includes a nonvolatile memory that stores data and a memory controller that controls the nonvolatile memory. The memory controller accepts a pause instruction to pause writing from the access device within a period in which data from the access device are written, and writes the data received from the access device to the nonvolatile memory within a predetermined time interval, then pauses the writing and accepts read and/or write of new data from the access device. | 09-01-2011 |
20110225370 | NON-VOLATILE STORAGE DEVICE, ACCESS DEVICE, AND NON-VOLATILE STORAGE SYSTEM - When multiple pieces of content data are being recorded continuously to a nonvolatile storage device having page cache function, a preparation time before starting next content data recording is reduced. When a cache releasing section of a nonvolatile storage device ( | 09-15-2011 |
20110258372 | MEMORY DEVICE, HOST DEVICE, AND MEMORY SYSTEM - A memory device, a host device, and a memory system enable real-time recording of a plurality of files of data while preventing the buffer size of a host device from increasing. A memory device ( | 10-20-2011 |
20110320692 | ACCESS DEVICE, INFORMATION RECORDING DEVICE, CONTROLLER, REAL TIME INFORMATION RECORDING SYSTEM, ACCESS METHOD, AND PROGRAM - Provided is a method for stabilizing and increasing the speed of processing for writing a plurality of different-sized files such as a video file and a management file in parallel in the case where the area in a non-volatile memory of an information recording module is managed by a file system. An access module ( | 12-29-2011 |
20120317340 | MEMORY CONTROLLER AND NON-VOLATILE STORAGE DEVICE - A non-volatile storage device comprises non-volatile memories for storing data; and a memory controller for carrying out control of the non-volatile memory. The memory controller stores second error correcting code as well as first error correcting code stored in the same page of the data. The memory controller, when writing data smaller than a predefined size, does not add the second error correcting code, and stores duplexed data of the data and the first correcting code in a different page. The memory controller, when reading, corrects data using the first and/or second correcting code. The valid data management table manages which logical block stores valid data with respect to an identical logical address. | 12-13-2012 |
20120317341 | MEMORY CONTROLLER AND NON-VOLATILE STORAGE DEVICE - A non-volatile storage device, which communicates with an access device and carries out reading and/or writing of data in accordance with a command from the access device, the device comprises one or more non-volatile memories for storing data and a memory controller for carrying out control of the non-volatile memory. The memory controller writes data to the error correcting group and writes a provisional error correcting code with respect to the data to the parity table if a data size is smaller than the first size when writing the data. | 12-13-2012 |
20120317458 | MEMORY CONTROLLER AND NON-VOLATILE STORAGE DEVICE - A non-volatile storage device includes one or more non-volatile memories for storing data, and a memory controller for carrying out the control of the non-volatile memory. The non-volatile memory includes the plurality of blocks, which are erase units, and the block includes the plurality of pages, which are write units of data, in each of the blocks at least one set of pages existing which include at least two pages sharing one word line. The memory controller configures a plurality of error correcting groups, each including at least one data page, which is a page for storing data, and at least one error correcting code page for storing a code for error correcting calculation of the data page, and assigns a page of a separate word line with respect to each of the data page and the error correcting page in the same error correcting group. | 12-13-2012 |
20150149690 | RECORDING DEVICE, ACCESS DEVICE, RECORDING SYSTEM, AND RECORDING METHOD - A recording device operates in accordance with an instruction from an access device. The recording device comprising a nonvolatile memory that stores data, a communication unit that receives an instruction issued by the access device, and a memory controller that controls the nonvolatile memory. When a recording instruction for recording data into the nonvolatile memory is received from the access device, the memory controller starts recording of data into the nonvolatile memory. When the memory controller receives from the access device a suspension instruction for suspending the recording of data, the memory controller stores suspension information into the nonvolatile memory, the suspension information indicating a suspended position as a position in a recording area of the nonvolatile memory at which the data is being recorded upon reception of the suspension instruction. | 05-28-2015 |
Patent application number | Description | Published |
20080199081 | Image processing apparatus, image processing method and computer-readable medium - An image processing apparatus includes an extracting unit, a representative-image generating unit and a vector converting unit. The extracting unit extracts pixel blocks from image data. The representative-image generating unit generates representative images from the pixel blocks extracted by the extracting unit, based on a similarity between the pixel blocks. The vector converting unit converts the representative images generated by the representative-image generating unit into vector information. | 08-21-2008 |
20090097765 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, COMPUTER-READABLE MEDIUM AND COMPUTER DATA SIGNAL - An image processing apparatus includes an image extracting unit, a vector information generating unit and a color information adding unit. The image extracting unit extracts an image to be vectorized from a multilevel image as a binary image. The vector information generating unit vectorizes the binary image extracted by the image extracting unit to generate vector information. The color information adding unit adds color information to the vector information generated by the vector information generating unit. | 04-16-2009 |
20100226588 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD AND COMPUTER-READABLE MEDIUM - An image processing apparatus includes a binarization unit, a determination unit and a pixel value calculating unit. The binarization unit binarizes image data. The determination unit determines as to whether or not each pixel of the image data binarized by the binarization unit forms a peripheral portion of a pixel block. The pixel value calculating unit calculates a corrected pixel value of the pixel block based on (i) pixel values of pixels which are determined by the determination unit not to form the peripheral portion of the pixel block and (ii) pixel values of pixels forming the pixel block. | 09-09-2010 |
20110044539 | INFORMATION PROCESSING DEVICE, COMPUTER READABLE MEDIUM STORING INFORMATION PROCESSING PROGRAM, AND INFORMATION PROCESSING METHOD - An information processing device includes: a document receiving unit that receives a document containing at least one page, wherein positions of document components of a page of the at least one page are fixed within the page; a page dividing unit that divides the document received by the document receiving unit into at least one page; a page heading determining unit that determines a heading of a page of the at least one page divided by the page dividing unit based on components included in the page; and a processing unit that assigns the heading determined by the page heading determining unit to the page divided by the page dividing unit as first level outline information of the page. | 02-24-2011 |
20110129150 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND COMPUTER READABLE MEDIUM - According to an aspect of the invention, an image processing apparatus includes a count unit, a transform unit, a first calculation unit, a second calculation unit, and a binarization unit. The count unit counts the number of pixels of an original binary image. The transform unit transforms the original binary image into a transformed image based on a given transform level. The first calculation unit calculates the number of pixels of the transformed image, based on the given transform level and the number of pixels of the original binary image. The second calculation unit calculates a threshold level based on the number of pixels for each pixel value of the transformed image and the number of pixels of the transformed image. The binarization unit binarizes the transformed image based on the threshold level. | 06-02-2011 |
Patent application number | Description | Published |
20080295957 | Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component - A bonding material is placed on an electronic component. a heat conductive member is superposed on the surface of the bonding material so that a thermosetting adhesive is interposed between the heat conductive member and a substrate. The thermosetting adhesive is then cured at a temperature lower than the melting point of the bonding material. The bonding material melts after the thermosetting adhesive has cured. While a distance is maintained between the heat conductive member and the substrate, the thermosetting adhesive is cured. The heat conductive member is thus reliably prevented from a downward movement regardless of the melting of the bonding material. A space is maintained between the heat conductive member and the electronic component. The cured bonding material is reliably prevented from suffering from a reduction in the thickness. | 12-04-2008 |
20080296755 | Semiconductor device - A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component. | 12-04-2008 |
20090242258 | ELECTRONIC DEVICE PACKAGE WITH CONNECTION TERMINALS INCLUDING UNEVEN CONTACT SURFACES - An electronic device package includes an electronic device including a plurality of input/output terminals, a wiring board which places the electronic device on a first surface and includes wiring connected to the input/output terminals of the electronic device, and a first connection terminal formed on a second surface of the wiring board and connected to the wiring, wherein the first connection terminal has an uneven contact surface formed to receive solder material placed thereon. | 10-01-2009 |
20100013089 | Semiconductor component and manufacturing method of semiconductor component - A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member. | 01-21-2010 |
20100226102 | PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board. | 09-09-2010 |
20100243634 | ELECTRONIC APPARATUS, POWER CONTROL DEVICE FOR CONTROLLING A HEATER, AND METHOD OF CONTROLLING POWER CONTROL DEVICE - An electronic apparatus has a printed circuit board, a semiconductor device mounted on the printed circuit board by a plurality of solder bumps, a heater that heats the printed circuit, a power supply unit that supplies electric power to the semiconductor device and the heater, and a controller that controls the power supply unit to supply electric power to the heater when the electric power is not supplied to the semiconductor device. | 09-30-2010 |
20110254149 | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT - A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member. | 10-20-2011 |
20120210776 | CONDENSATION SENSING DEVICE, ELECTRONIC APPARATUS, AND CONDENSATION SENSING METHOD - A condensation sensing device that detects a water droplet to sense the condensation, the condensation sensing device comprising: a surface having a recesses and productions; and a water droplet detector that detects a water droplet guided by any of the recesses on the surface. | 08-23-2012 |
20120216992 | DEW-CONDENSATION DETECTING APPARATUS, ELECTRONIC EQUIPMENT COOLING SYSTEM, AND DEW-CONDENSATION DETECTING METHOD - A dew-condensation detecting apparatus includes a dew-condensation detector provided in a middle of a cold-liquid supply passage. The cold-liquid supply passage supplies a cooling liquid to electronic equipment. The dew-condensation detector detects dew condensation by detecting water droplets due to the dew condensation. A heating part heats the cooling liquid which has exited from the dew-condensation detector. | 08-30-2012 |
20140071631 | PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board. | 03-13-2014 |
20140239488 | ELECTRONIC COMPONENT UNIT AND FIXING STRUCTURE - An electronic component unit includes a semiconductor package mounted on a front surface of a substrate, a heat sink including a pushing plate installed on the semiconductor package, a reinforcing plate disposed on a back surface of the substrate, and a plurality of fasteners that connect corner portions of the pushing plate and the reinforcing plate to each other, wherein the semiconductor package is pressed and fixed on the substrate by fastening the plurality of fasteners, and the reinforcing plate includes a base plate portion including a connection portion to which each of the plurality of fasteners is connected, and a pressing plate portion which is disposed at a planar central side of the base plate portion, and separably laminated on the base plate portion to press the back surface of the substrate. | 08-28-2014 |
20150055301 | CARD-TYPE ELECTRONIC COMPONENT COOLING STRUCTURE AND ELECTRONIC DEVICE - A cooling structure for a card-type electronic component, including: a printed circuit board on which a card-type electronic component is detachably mounted; a thermally-conductive heat transfer member, disposed facing the card-type electronic component; a press contact portion that places the heat transfer member in press contact with the card-type electronic component; and a pair of flow path portions that are disposed at both width direction sides of the card-type electronic component, that form flow paths in which coolant flows, and that support the heat transfer member so as to enable heat exchange between the heat transfer member and the coolant. | 02-26-2015 |
20150062827 | HEAT SINK AND SUBSTRATE UNIT - A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit. | 03-05-2015 |
20150068702 | DEW CONDENSATION DETECTING DEVICE, COOLING SYSTEM AND COOLING MEDIUM FLOW RATE CONTROLLING METHOD - A dew condensation detecting device includes a dew condensation detector and a heat transfer part. The dew condensation detector is provided to a supply pipe, which supplies a cooling medium from a cooling medium supply apparatus to a device to be cooled. The dew condensation detector detects a dew condensation by detecting a water droplet due to the dew condensation. The heat transfer part transfers heat from the cooling medium flowing in a return pipe, which returns the cooling medium from the device to be cooled to the cooling medium supply apparatus, to the cooling medium flowing in the supply pipe between the dew condensation detector and the device to be cooled. | 03-12-2015 |
20150092347 | COOLING DEVICE, ELECTRONIC APPARATUS AND METHOD OF ATTACHING COOLING DEVICE - A cooling device includes a cooling member connected with a cooling pipe through which a cooling medium flows, a first fastening mechanism part provided at a first position on the cooling member and configured to fasten the cooling member and a substrate in a state where an electronic part to be cooled is sandwiched between the cooling member and the substrate, and a second fastening mechanism part provided at a second position on the cooling member that is different from the first position, the second position being located at a position where a first load exerted on the cooling member and a second load exerted on the cooling member maintain a balance in the electronic part, the first load being applied by the cooling pipe and the first fastening mechanism part, the second load being applied by the second fastening mechanism part. | 04-02-2015 |
20150184949 | COOLING DEVICE AND ELECTRONIC EQUIPMENT - A cooling device includes: an evaporator that vaporizes a part of a refrigerant by heat generated by an electronic component; a condenser that cools the refrigerant; a refrigerant circulation loop coupled to the evaporator and the condenser, an inside of the refrigerant circulation loop is depressurized; and a pump that circulates the refrigerant, wherein a filling ratio of the liquid refrigerant to a volume of the refrigerant circulation loop is 50% or more. | 07-02-2015 |
20150250075 | COOLER AND ELECTRONIC DEVICE - A cooler includes: a casing arranged opposed to a heat releasing surface of a heater element; and a first flow channel which is provided in the casing and through which a refrigerant flows, wherein in a direction orthogonal to the heat releasing surface, a length of the first flow channel on a heat releasing surface side is shorter than a length of the first flow channel on the opposite side to the heat releasing surface. | 09-03-2015 |