Patent application number | Description | Published |
20080205021 | MICROSTRUCTURE AND MICROSTRUCTURE MANUFACTURE METHOD - A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face. | 08-28-2008 |
20080239456 | MICRO OSCILLATING DEVICE AND MICRO OSCILLATING DEVICE ARRAY - A micro oscillating device includes a frame, an oscillating part including a first drive electrode for application of a reference electric potential, and a connecting part for connecting the frame and the oscillating part to each other, where the connecting part defines an axis of an oscillating motion of the oscillating part. A second drive electrode is fixed to the frame to cooperate with the first drive electrode for generation of a driving force for the oscillating movement. The first drive electrode includes a first end extension and a second end extension separated from each other and extending in a direction crossing the axis. The second drive electrode is within a separation distance between the first and the second end extensions. | 10-02-2008 |
20080285108 | Micro-actuation element provided with torsion bars - The micro-actuation element (X | 11-20-2008 |
20090001487 | PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME - A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip. | 01-01-2009 |
20090001847 | MICRO-OSCILLATION ELEMENT AND ARRAY OF MICRO-OSCILLATION ELEMENTS - A micro-oscillation element includes a base frame, an oscillating portion, and a link portion connecting the base frame and the oscillating portion to each other. The oscillating portion has a movable functional portion, a first driving electrode connected to the movable functional portion, and a weight portion joined to the first driving electrode. The link portion defines an axis of the oscillating motion of the oscillating portion. The second driving electrode, fixed to the base frame, generates driving force for the oscillating motion in cooperation with the first driving electrode. | 01-01-2009 |
20090107949 | Micro-oscillating element and method of making the same - A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force for the oscillating motion of the movable functional portion about the torsional joint. The first comb-tooth electrode includes a plurality of first electrode teeth each having a first conductor, an insulator and a second conductor laminated in the direction of the oscillating motion, where the first conductor and the second conductor are electrically connected with each other. The second comb-tooth electrode includes a plurality of second electrode teeth caused not to face the second conductor but to face the first conductor of the first electrode teeth during non-operation. The second electrode teeth are longer than the first conductor in the direction of the oscillating motion. | 04-30-2009 |
20090218909 | Micro-oscillation element and method for driving the same - A micro-oscillation element includes a movable main section, a first frame and a second frame, and a first connecting section that connects the movable main section and the first frame and defines a first axis of rotation for a first rotational operation of the movable main section with respect to the first frame. The element further includes a second connecting section that connects the first frame and the second frame and defines a second axis of rotation for a second rotational operation of the first frame and the movable main section with respect to the second frame. A first drive mechanism is provided for generating a driving force for the first rotational operation. A second drive mechanism is provided for generating a driving force for the second rotational operation. The first axis of rotation and the second axis of rotation are not orthogonal. | 09-03-2009 |
20090267445 | MICRO ROCKING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A micro rocking device includes a frame, a rocking portion, a torsion connecting portion, and a second comb-like electrode, the rocking portion including a first comb-like electrode. The torsion connecting portion connects the frame and the rocking portion. The torsion connecting portion defines the axis of rotational displacement of the rocking portion. The second comb-like electrode attracts the first comb-like electrode and rotationally displaces the rocking portion. The first comb-like electrode has a plurality of first parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction. The second comb-like electrode has a plurality of second parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction. | 10-29-2009 |
20090296181 | Micro electro mechanical device having an opening between a fixing portion and a torsion bar - A micro electro mechanical device includes an inner frame provided with a movable part and an outer frame provided in a circumference of the inner frame. The outer frame has a fixing part fixed by a joining material. A first torsion bar is provided between the outer frame and the inner frame so as to swingablly support the inner frame on the outer frame. A first opening is formed in the outer frame in a vicinity of the first torsion bar. The first opening is positioned between the fixing part of the outer frame and the first torsion bar. | 12-03-2009 |
20100007940 | MICRO OSCILLATING DEVICE - A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base. | 01-14-2010 |
20100018635 | METHOD FOR MANUFACTURING MICRO MOVABLE ELEMENT - A method for manufacturing a micro movable element includes: forming a movable section, a frame, and a connecting section connecting the movable section with the frame on a substrate; bonding a film to a surface of the substrate in forming the movable section, the frame, and the connecting section; and patterning the film to form a support structure being bridged between the movable section and the frame. | 01-28-2010 |
20100067083 | Micro-movable device - A micro-movable device includes a frame, a movable section including a body section, and a torsion coupling section for coupling the frame with the movable section to define an axis of oscillation of the movable section, wherein the frame includes a first extending portion and a second extending portion that are spaced apart from each other in a direction parallel to the axis and extend along the body section, and oppose the body section via a gap. | 03-18-2010 |
20100085623 | MICRO MOVABLE DEVICE AND OPTICAL SWITCHING APPARATUS - A micro movable device includes: a micro movable substrate including a micro movable unit, the micro movable unit including a frame section, a movable section, and a coupling section which couples the frame section and the movable section to each other; a support base; a first spacer and a second spacer which are provided between the frame section of the micro movable substrate and the base, the first and second spacers joining the frame section and the base to each other; and a fixation member provided between the frame section of the micro movable substrate and the base, the fixation member including a spacer portion which joins the frame section and the base to each other and an adhesive portion which covers the spacer portion and joins the frame section and the base to each other, the fixation member being provided between the first and second spacers. | 04-08-2010 |
20100092130 | MICRO MOVABLE DEVICE AND OPTICAL SWITCHING APPARATUS - A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame. | 04-15-2010 |
20100194235 | MICRO MOVABLE ELEMENT AND MICRO MOVABLE ELEMENT ARRAY - A micro movable device suitable for suppressing deterioration of driving characteristics, and a micro movable device array including such a micro movable device are provided. The micro movable device (X | 08-05-2010 |
20100208347 | MICRO MOVABLE DEVICE AND INTERFEROMETER - A micro movable device includes a movable member, a stationary portion, and connecting portions each connected to the movable member and the stationary portion. The movable member includes a pair of electrodes. The stationary portion includes a pair of electrodes cooperating with the electrodes of the movable member to generate a driving force for translating the movable member in its thickness direction. The connection points at which the respective connecting portions are connected to the movable member are spaced from each other. The electrodes of the movable member are positioned between two mutually spaced connection points, as viewed along the spacing direction of the two connection points. | 08-19-2010 |
20100231087 | Micro oscillating element - A micro oscillating element includes a frame and an oscillation section connected to the frame via a torsional joining section. The oscillation section includes a movable functional section, an arm section and a first comb-tooth electrode. The arm section extends from the functional section. The first comb-tooth electrode includes first electrode teeth extending from the arm section in a direction intersecting the arm section. The micro oscillating element further includes a second comb-tooth electrode to cooperate with the first comb-tooth electrode for causing the oscillation section to oscillate about an oscillation axis defined by the torsional joining section. The second comb-tooth, electrode includes second electrode teeth extending from the frame in a direction intersecting the arm section. | 09-16-2010 |
20110124143 | PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME - A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip. | 05-26-2011 |
20110187348 | POWER STRIP AND ELECTRIC POWER MEASUREMENT SYSTEM - The following disclosure provides a power strip including: a busbar electrically connected to a power source; multiple electrical outlets allowing multiple power plugs to be inserted thereinto, respectively; distribution bars which are branched out from the busbar and respectively supply the electrical outlets with electric currents of the power source; and a plurality of electric current measurement units each configured to measure the electric current flowing through a corresponding one of the distribution bars. | 08-04-2011 |
20110192635 | MICROSTRUCTURE AND MICROSTRUCTURE MANUFACTURE METHOD - A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face. | 08-11-2011 |
20110222137 | MICRO-MIRROR ARRAY AND OPTICAL SWITCH - A micro-mirror array including a plurality of micro-mirror elements and each of the micro-mirror elements includes a mirror rotating around two axes and a support unit connected to an outer frame and supporting the mirror. The support unit extends between the mirror of the micro-mirror elements including the support unit and one of two mirrors adjacent to the mirror, and both ends of the support unit are connected to the outer frame. | 09-15-2011 |
20120057214 | MICRO MOVABLE ELEMENT ARRAY AND A COMMUNICATION APPARATUS - A micro movable element array includes a first frame; a second frame; a first movable part row including plural first movable parts and a second movable part row including plural second movable parts. The first movable parts include first movable main parts. The second movable parts include second movable main parts. The first and second frames are stacked such that the first and second movable part rows are opposed to each other. In the first movable part row, the first movable parts are located such that the first movable main parts are arranged in a first direction and the first movable main parts and gaps are disposed alternately. In the second movable part row, the second movable parts are located such that the second movable main parts are arranged in the first direction and the second movable main parts are opposed to the corresponding gaps. | 03-08-2012 |
20120105936 | MICROMIRROR UNIT AND METHOD OF MAKING THE SAME - A method is provided for making a micromirror unit which includes a frame, a mirror forming base, and bridges connecting the frame to the mirror forming base. The method includes the following steps. First, a first mask pattern is formed on a substrate for masking portions of the substrate which are processed into the frame and the mirror forming base. Then, a second mask pattern is formed on the substrate for masking portions of the substrate which are processed into the bridges. Then, the substrate is subjected to a first etching process with the first and the second mask patterns present as masking means. Then, the second mask pattern is removed selectively. Then, the substrate is subjected to a second etching process with the first mask pattern present as masking means. Finally, the first mask pattern is removed. | 05-03-2012 |
20120153455 | SEMICONDUCTOR DEVICE, COOLING DEVICE, AND COOILNG DEVICE FABRICATION METHOD - A semiconductor device includes a semiconductor chip having an electric circuit; and a cooling device including at least one channel serving as a flow path through which coolant flows, an external surface including projections, and a metallic layer formed over the external surface including the projections. In the semiconductor device, the projections of the external surface of the cooling device are brought into contact with a first surface of the semiconductor chip via the metallic layer such that the semiconductor chip is cooled by allowing the coolant to flow through the channel formed in the cooling device. | 06-21-2012 |
20130045626 | POWER STRIP AND ELECTRICAL POWER MEASUREMENT SYSTEM - A power strip includes a casing including a plurality of plug insertion portions each having a first insertion port and a second insertion port into which first and second plug blades of a socket plug are to be respectively inserted, a magnetic core which is provided in each of the plurality of plug insertion portions and includes a first opening into which the first plug blade is to be inserted, a second opening into which the second plug blade is to be inserted, and a slit to communicate between the first plug blade and the second plug blade, and a magnetic sensor provided inside the slit. | 02-21-2013 |
20130060494 | METHOD OF CALCULATING CURRENT CORRECTION FORMULA FOR POWER STRIP, CURRENT MEASURING METHOD, AND POWER STRIP - A method of calculating a current correction formula may include first measuring voltage values at each of current measuring parts configured to measure currents in socket parts of a power strip in a state in which no current flows in the socket parts, second measuring the voltage values at each of the current measuring parts in a state in which a current flows in one of the socket parts, and calculating a correction formula formed by a inverse matrix of a matrix having as its elements differences between the voltage values measured by the second measuring and the voltage values measured by the first measuring. | 03-07-2013 |
20130313899 | POWER STRIP AND POWER MEASUREMENT METHOD - A power strip includes: jack portions; current meters each configured to measure a current being supplied from the corresponding jack portion to one of external electrical devices, and to output a measurement signal corresponding to a magnitude of the current; and a computing unit configured to obtain instantaneous values of the current at a plurality of time points on the basis of the measurement signal, and to calculate a power value using the instantaneous values. The computing unit configured to obtain the instantaneous values of the current by using any one of a first zero point and a second zero point as a reference. | 11-28-2013 |
20130315757 | ACTUATOR, MICROPUMP, AND ELECTRONIC EQUIPMENT - An actuator includes a first part having a magnetomotive element and configured to absorb heat up to at least a first temperature; a second part arranged so as to face the first part; a temperature-sensitive magnetic body provided between the first part and the second part and configured to move between a first position for contact with the first part and a second position for contact with the second part, the temperature-sensitive magnetic body having a Curie point lower than the first temperature and higher than a temperature of the second part; and a restoring part configured to restore the temperature-sensitive magnetic body from the first position to the second position. | 11-28-2013 |
20130317770 | POWER STRIP AND POWER MEASUREMENT METHOD - A power strip includes: a first power line; a second power line between which and the first power line a power supply voltage is applied; a jack portion; a current meter configured to measure a current being supplied to an external electrical device from the jack portion; a first photocoupler including a first light emitting diode connected between the first power line and the second power line and configured to output a first output signal whose level is changed when the power supply voltage exceeds a first threshold; and a computing unit configured to calculate a power value by using instantaneous values of the current measured by the current meter and instantaneous values of the power supply voltage estimated from the length of a period when the level of the first output signal is changed. | 11-28-2013 |
20140027895 | THREE-DIMENSIONAL MOUNTING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THREE-DIMENSIONAL MOUNTING SEMICONDUCTOR DEVICE - A three-dimensional mounting semiconductor device includes a layer structure including a plurality of first substrates with a trench-shaped concavity formed in and a plurality of second substrates with semiconductor elements formed in, which are alternately stacked, wherein an unevenness defined by a size difference between the first substrate and the second substrate is formed on a side surface, and a first through-hole are defined by an inside surface of the trench-shaped concavity and a surface of the second substrate, and a third substrate jointed to the side surface of the layer structure and having an unevenness formed on a surface jointed to the layer structure which are engaged with the unevenness formed on the side surface of the layer structure. | 01-30-2014 |
20140216058 | MICRO CHANNEL COOLING DEVICE, MICRO CHANNEL COOLING SYSTEM, AND ELECTRONIC INSTRUMENT - A microchannel cooling device includes a heat sink having a liquid refrigerant flow channel having a microscopic cross section and connected to a heat source thermally, and a thermoelectric element provided on the heat sink and extending parallel to a direction of extension of the liquid refrigerant flow channel. | 08-07-2014 |
20140318588 | THERMOELECTRIC CONVERSION ELEMENT AND METHOD FOR MANUFACTURING SAME - The present invention relates to a thermoelectric conversion element and a method for manufacturing the same and relates to suppression of breakage and deterioration of the thermoelectric conversion element due to partial pressurization from the vertical direction. This thermoelectric conversion element has: at least one n-type semiconductor body; at least one p-type semiconductor body; a first connecting electrode; a first out-put electrode for n-side output; and a second output electrode for p-side output, wherein areas of respective joint sections of the n-type semiconductor body with the first connecting electrode, the first output electrode, and the second output electrode and of the p-type semiconductor body with the first connecting electrode, the first output electrode, and the second output electrode are greater than respective cross-sectional areas in other positions, in an axial direction, of the n-type semiconductor body and the p-type semiconductor body. | 10-30-2014 |
20150084723 | CURRENT SENSOR - A downsized current sensor with a switch function is disclosed. The current sensor includes: a magnetic circuit to converge a magnetic flux generated from an electric circuit at a magnetic sensor; a switch to open and close the electric circuit in a way that operates together with a movable magnetic body configuring a part of the magnetic circuit; and a magnetizing coil to generate magnetic force enabling the movable magnetic body to be attracted to a fixed magnetic body configuring a part of the magnetic circuit. | 03-26-2015 |