Patent application number | Description | Published |
20080205021 | MICROSTRUCTURE AND MICROSTRUCTURE MANUFACTURE METHOD - A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face. | 08-28-2008 |
20080239456 | MICRO OSCILLATING DEVICE AND MICRO OSCILLATING DEVICE ARRAY - A micro oscillating device includes a frame, an oscillating part including a first drive electrode for application of a reference electric potential, and a connecting part for connecting the frame and the oscillating part to each other, where the connecting part defines an axis of an oscillating motion of the oscillating part. A second drive electrode is fixed to the frame to cooperate with the first drive electrode for generation of a driving force for the oscillating movement. The first drive electrode includes a first end extension and a second end extension separated from each other and extending in a direction crossing the axis. The second drive electrode is within a separation distance between the first and the second end extensions. | 10-02-2008 |
20080285108 | Micro-actuation element provided with torsion bars - The micro-actuation element (X | 11-20-2008 |
20090001487 | PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME - A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip. | 01-01-2009 |
20090001847 | MICRO-OSCILLATION ELEMENT AND ARRAY OF MICRO-OSCILLATION ELEMENTS - A micro-oscillation element includes a base frame, an oscillating portion, and a link portion connecting the base frame and the oscillating portion to each other. The oscillating portion has a movable functional portion, a first driving electrode connected to the movable functional portion, and a weight portion joined to the first driving electrode. The link portion defines an axis of the oscillating motion of the oscillating portion. The second driving electrode, fixed to the base frame, generates driving force for the oscillating motion in cooperation with the first driving electrode. | 01-01-2009 |
20090267445 | MICRO ROCKING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A micro rocking device includes a frame, a rocking portion, a torsion connecting portion, and a second comb-like electrode, the rocking portion including a first comb-like electrode. The torsion connecting portion connects the frame and the rocking portion. The torsion connecting portion defines the axis of rotational displacement of the rocking portion. The second comb-like electrode attracts the first comb-like electrode and rotationally displaces the rocking portion. The first comb-like electrode has a plurality of first parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction. The second comb-like electrode has a plurality of second parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction. | 10-29-2009 |
20100007940 | MICRO OSCILLATING DEVICE - A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base. | 01-14-2010 |
20100018635 | METHOD FOR MANUFACTURING MICRO MOVABLE ELEMENT - A method for manufacturing a micro movable element includes: forming a movable section, a frame, and a connecting section connecting the movable section with the frame on a substrate; bonding a film to a surface of the substrate in forming the movable section, the frame, and the connecting section; and patterning the film to form a support structure being bridged between the movable section and the frame. | 01-28-2010 |
20100092130 | MICRO MOVABLE DEVICE AND OPTICAL SWITCHING APPARATUS - A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame. | 04-15-2010 |
20100194235 | MICRO MOVABLE ELEMENT AND MICRO MOVABLE ELEMENT ARRAY - A micro movable device suitable for suppressing deterioration of driving characteristics, and a micro movable device array including such a micro movable device are provided. The micro movable device (X | 08-05-2010 |
20100245964 | MICRO-STRUCTURE - A micro-structure produced by utilizing a MEMS technology or the like includes: a frame including a portion having a first layer and a portion having a second layer on the lower side of the first layer; a movable body including a portion having the first layer and a portion having the second layer; and at least one swing supporting portion which is having the first layer, and connects the portion having the first layer in the frame and the portion having the first layer in the movable body, to support the movable body to be capable of swinging. A frame side end portion of the swing supporting portion is supported from underneath by the portion having the second layer in the frame, and a movable body side end portion of the swing supporting portion is supported from underneath by the portion having the second layer in the movable body. | 09-30-2010 |
20110124143 | PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME - A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip. | 05-26-2011 |
20110171806 | Integrated electronic device and method of making the same - An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion. | 07-14-2011 |
20110192635 | MICROSTRUCTURE AND MICROSTRUCTURE MANUFACTURE METHOD - A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face. | 08-11-2011 |
20120105936 | MICROMIRROR UNIT AND METHOD OF MAKING THE SAME - A method is provided for making a micromirror unit which includes a frame, a mirror forming base, and bridges connecting the frame to the mirror forming base. The method includes the following steps. First, a first mask pattern is formed on a substrate for masking portions of the substrate which are processed into the frame and the mirror forming base. Then, a second mask pattern is formed on the substrate for masking portions of the substrate which are processed into the bridges. Then, the substrate is subjected to a first etching process with the first and the second mask patterns present as masking means. Then, the second mask pattern is removed selectively. Then, the substrate is subjected to a second etching process with the first mask pattern present as masking means. Finally, the first mask pattern is removed. | 05-03-2012 |
20120153455 | SEMICONDUCTOR DEVICE, COOLING DEVICE, AND COOILNG DEVICE FABRICATION METHOD - A semiconductor device includes a semiconductor chip having an electric circuit; and a cooling device including at least one channel serving as a flow path through which coolant flows, an external surface including projections, and a metallic layer formed over the external surface including the projections. In the semiconductor device, the projections of the external surface of the cooling device are brought into contact with a first surface of the semiconductor chip via the metallic layer such that the semiconductor chip is cooled by allowing the coolant to flow through the channel formed in the cooling device. | 06-21-2012 |