Patent application number | Description | Published |
20080296055 | Printed circuit board and method of fabricating the same - This invention relates to a printed circuit board and a method of fabricating the same, in which the thickness of a circuit pattern is decreased to thus realize a fine circuit, the circuit pattern is embedded in an insulating layer to thus decrease the thickness of a printed circuit board, and the time and cost required for the process of fabricating a printed circuit board are decreased. | 12-04-2008 |
20080307641 | Method of fabricating paste bump for printed circuit board - This invention relates to a method of fabricating a paste bump for a printed circuit board, which can decrease the number of printings to thus reduce the fabrication cost and process time in the formation of the paste bump on the printed circuit board. | 12-18-2008 |
20080308315 | Multilayer printed circuit board and method of fabricating the same - This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity. | 12-18-2008 |
20090236130 | Multilayered printed circuit board and method of manufacturing the same - Disclosed herein is a multilayered circuit board, including: a metal base layer including a metal layer formed through-holes, an insulating film formed on a surface of the metal layer, a first circuit layer having circuit patterns formed on one side of the metal layer and a second circuit layer having protruding connecting pads, formed on the other side of the metal layer; a build-up layer formed on the first circuit layer; and a solder resist layer. The multilayered printed circuit board is advantageous in that the thickness thereof is decreased and the bending strength and radiation characteristics thereof are improved. | 09-24-2009 |
20090236131 | Multilayered printed circuit board and method of manufacturing the same - Disclosed herein is a multilayered circuit board, including: a multilayered printed circuit board manufactured using the method includes an insulating resin layer having via holes, on one side of which a first circuit layer including circuit patterns is formed, and on the other side of which a second circuit layer, including connecting pads, is formed, the pads protruding over the via holes; a build-up layer formed on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and a solder resist layer formed on an outermost layer of the build-up layer. | 09-24-2009 |
20090250259 | Multilayered printed circuit board and method of manufacturing the same - Disclosed herein is a multilayered printed circuit board, including: a build-up layer including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer, including bumps, formed on the outermost circuit layer of one side of the build-up layer; and a solder resist layer formed on the outermost layer of the other side of the build-up layer. The multilayered printed circuit board is manufactured by sequentially placing a build-up layer and a solder resist layer on one side of an insulating resin layer, the other side of which is provided with bumps. The present invention is advantageous in that the thickness of the multilayered printed circuit board is decreased, the production processes thereof is simplified, and the production efficiency is increased. | 10-08-2009 |
20090294956 | Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof - Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin. | 12-03-2009 |
20090301767 | Printed circuit board and method of manufacturing the same - Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density. | 12-10-2009 |
20090308650 | Printed circuit board and method of manufacturing the same - The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved. | 12-17-2009 |
20100175915 | Printed circuit board and method of manufacturing the same - The invention relates to a printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The invention makes the printed circuit board slim, and increases reliability and the degree of design freedom. | 07-15-2010 |
20100230146 | CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties. | 09-16-2010 |
20110114380 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD COMPRISING THE SAME - Disclosed herein is an electromagnetic bandgap structure, including: a dielectric layer; a plurality of conductive plates formed on one side of the dielectric layer; a stitching via serving to electrically connect two adjacent conductive plates of the plurality of conductive plates; and a first dummy via formed each of the plurality of conductive plates in a direction of thickness of the dielectric layer, and a printed circuit board comprising the electromagnetic bandgap structure. The printed circuit board comprising the electromagnetic bandgap structure can solve a mixed signal problem even when an analog circuit and a digital circuit are simultaneously mounted therein. | 05-19-2011 |
20110120758 | DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME - Disclosed is a die mounting substrate, which includes a mounting substrate having a pad, a die having a terminal and surface-mounted on the mounting substrate, and a conductive paste bump formed on the pad or the terminal so as to connect the pad and the terminal to each other. When the die is connected and mounted on the mounting substrate using the conductive paste bump, shear stress is relieved thus preventing reliability from decreasing due to a difference in the coefficient of thermal expansion between the die and the mounting substrate, and also preventing the force of adhesion of the bump from decreasing due to the reduction in size of the pad of the mounting substrate. | 05-26-2011 |
20110308069 | Method of manufacturing cooling fin and package substrate with cooling fin - A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object. | 12-22-2011 |
20120005894 | Method of manufacturing multilayered printed circuit board - A method of manufacturing a multilayered circuit board, including: providing a double-sided copper clad laminate including via holes formed therethrough and openings for forming circuit patterns, formed by patterning copper foil formed on one side thereof; filling the via holes and the openings with conductive paste; removing the copper foil from the double-sided copper clad laminate to form a first circuit layer including circuit patterns on one side thereof and to form a second circuit layer including connecting pads for attaching solder balls thereto on the other side thereof; forming a build-up layer on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and forming a solder resist layer on an outermost layer of the build-up layer. | 01-12-2012 |
20120055706 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a core layer having a first circuit layer formed on an outer surface thereof; and a capacitor layer stacked on the core layer to be electrically connected to the first circuit layer, having an inner insulating layer therebetween, and including a plurality of conductive projection parts formed on the opposite surfaces of an upper electrode layer and a lower electrode layer and a dielectric layer formed between the upper electrode layer and the lower electrode layer. | 03-08-2012 |
20120080401 | METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD - A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer. | 04-05-2012 |
20120148960 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps. | 06-14-2012 |
20120175162 | PRINTED CIRCUIT BOARD - A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer. | 07-12-2012 |
20120222299 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased. | 09-06-2012 |
20120266463 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board, including: forming a complex solder resist layer including a solder resist having an open part for forming a metal post and a cover film contacting the solder resist on a base substrate having an outer-layer circuit including a plating lead line; forming a metal post on the open part for forming the metal post by performing electroplating; removing the plating lead line; and exposing the metal post by removing the cover film. | 10-25-2012 |
20140106510 | DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME - In accordance with various embodiments, there is provided a method of fabricating a die mounting substrate, including the steps of preparing a mounting substrate including a pad and a die including a terminal, and printing a conductive paste bump on one of the pad or the terminal. The method further includes the step of connecting the pad and the terminal to each other using the conductive paste bump, thereby surface-mounting the die on the mounting substrate. | 04-17-2014 |