Patent application number | Description | Published |
20080293195 | GATE STRAINING IN A SEMICONDUCTOR DEVICE - Gate straining techniques as described herein can be utilized during the fabrication of NMOS transistor devices, PMOS transistor devices, or CMOS device structures. For an NMOS device, conductive vias are formed in TEOS oxide regions surrounding the sidewall spacers of a metal gate structure, where the metal gate structure includes compressive nitride material within the gate opening. After forming the conductive vias the remaining TEOS oxide is removed and tensile nitride material is deposited between the sidewall spacers and the conductive vias. The sidewall spacers serve as retaining walls for the tensile nitride material, which preserves the tensile characteristics of the material. A similar fabrication technique is utilized to form a PMOS device. For a PMOS device, however, the metal gate structure includes tensile nitride material within the gate opening, and compressive nitride material between the sidewall spacers and the conductive vias. | 11-27-2008 |
20090146212 | NEGATIVE DIFFERENTIAL RESISTANCE DIODE AND SRAM UTILIZING SUCH DEVICE - A negative differential resistance (NDR) diode and a memory cell incorporating that NDR diode are provided. The NDR diode comprises a p-type germanium region in contact with an n-type germanium region and forming a germanium pn junction diode. A first gate electrode overlies the p-type germanium region, is electrically coupled to the n-type germanium region, and is configured for coupling to a first electrical potential. A second gate electrode overlies the n-type germanium region and is configured for coupling to a second electrical potential. A third electrode is electrically coupled to the p-type germanium region and may be coupled to the second gate electrode. A small SRAM cell uses two such NDR diodes with a single pass transistor. | 06-11-2009 |
20090212363 | Method for forming a one-transistor memory cell and related structure - According to one exemplary embodiment, a method for fabricating a one-transistor memory cell includes forming an opening by removing a portion of a gate stack of a silicon-on-insulator (SOI) device, where the SOI device is situated over a buried oxide layer. The method further includes forming a bottom gate of the one-transistor memory cell in a bulk substrate underlying the buried oxide layer. The method further includes forming a charge trapping region in the buried oxide layer. The charge trapping region is formed at an interface between a silicon layer underlying the gate stack and the buried oxide layer. The charge trapping region causes the one-transistor memory cell to have an increased sensing margin. The method further includes forming a top gate of the one-transistor memory cell in the opening. Also disclosed is an exemplary one-transistor memory cell fabricated utilizing the exemplary disclosed method. | 08-27-2009 |
20090256206 | P-Channel germanium on insulator (GOI) one transistor memory cell - According to one exemplary embodiment, a p-channel germanium on insulator (GOI) one transistor memory cell comprises a buried oxide (BOX) layer formed over a bulk substrate, and a gate formed over a gate dielectric layer situated over a germanium layer formed over the buried oxide (BOX) layer. A source region is formed in the germanium layer adjacent to a channel region underlying the gate and overlaying the BOX layer, and a drain region is formed in the germanium layer adjacent to the channel region. The source region and the drain region are implanted with a p-type dopant. In one embodiment, a p-channel GOI one transistor memory cell is implemented as a capacitorless dynamic random access memory (DRAM) cell. In one embodiment, a plurality of p-channel GOI one transistor memory cells are included in a memory array. | 10-15-2009 |
20100015778 | METHOD OF FORMING FINNED SEMICONDUCTOR DEVICES WITH TRENCH ISOLATION - A method of manufacturing a semiconductor device structure, such as a FinFET device structure, is provided. The method begins by providing a substrate comprising a bulk semiconductor material, a first conductive fin structure formed from the bulk semiconductor material, and a second conductive fin structure formed from the bulk semiconductor material. The first conductive fin structure and the second conductive fin structure are separated by a gap. Next, spacers are formed in the gap and adjacent to the first conductive fin structure and the second conductive fin structure. Thereafter, an etching step etches the bulk semiconductor material, using the spacers as an etch mask, to form an isolation trench in the bulk semiconductor material. A dielectric material is formed in the isolation trench, over the spacers, over the first conductive fin structure, and over the second conductive fin structure. Thereafter, at least a portion of the dielectric material and at least a portion of the spacers are etched away to expose an upper section of the first conductive fin structure and an upper section of the second conductive fin structure, while preserving the dielectric material in the isolation trench. Following these steps, the fabrication of the devices is completed in a conventional manner. | 01-21-2010 |
20100051897 | DEVICE AND PROCESS OF FORMING DEVICE WITH DEVICE STRUCTURE FORMED IN TRENCH AND GRAPHENE LAYER FORMED THEREOVER - A graphene-based device is formed with a substrate having a trench therein, a device structure on the substrate and within the trench, a graphene layer over the device structure, and a protective layer over the graphene layer. Fabrication techniques include forming a trench in a substrate, forming a device structure within the trench, forming a graphene layer over the device structure, and forming a protective layer over the graphene layer. | 03-04-2010 |
20100051960 | DEVICE AND PROCESS OF FORMING DEVICE WITH PRE-PATTERNED TRENCH AND GRAPHENE-BASED DEVICE STRUCTURE FORMED THEREIN - A graphene-based device is formed with a trench in one or more layers of material, a graphene layer within the trench, and a device structure on the graphene layer and within the trench. Fabrication techniques includes forming a trench defined by one or more layers of material, forming a graphene layer within the trench, and forming a device structure on the graphene layer and within the trench. | 03-04-2010 |
20100055388 | SIDEWALL GRAPHENE DEVICES FOR 3-D ELECTRONICS - A device is provided that includes a structure having a sidewall surface, a layer of material provided on the sidewall surface, and a device structure provided in contact with the layer of material. Fabrication techniques includes a process that includes forming a structure having a sidewall surface, forming a layer of material on the sidewall surface, and forming a device structure in contact with the layer of material, where the device structure and the layer of material are components of a device. | 03-04-2010 |
20100055577 | PROCESS OF PATTERNING SMALL SCALE DEVICES - A process is provided that includes forming a first mask on an underlying layer, where the mask has two adjacent portions with an open gap therebetween, and depositing a second mask material within the open gap and at an inclined angle with respect to an upper surface of the underlying layer to form a second mask. In another implementation, a process is provided that includes forming a first mask on an underlying layer, where the mask has a pattern that includes an open gap, and depositing a second mask material within the open gap to form a second mask, where particles of the second mask material are directed in parallel or substantially in parallel to a line at an inclined angle with respect to an upper surface of the underlying layer. | 03-04-2010 |
20100248454 | METHOD OF FORMING FIN STRUCTURES USING A SACRIFICIAL ETCH STOP LAYER ON BULK SEMICONDUCTOR MATERIAL - A method of manufacturing semiconductor fins for a semiconductor device may begin by providing a bulk semiconductor substrate. The method continues by growing a layer of first epitaxial semiconductor material on the bulk semiconductor substrate, and by growing a layer of second epitaxial semiconductor material on the layer of first epitaxial semiconductor material. The method then creates a fin pattern mask on the layer of second epitaxial semiconductor material. The fin pattern mask has features corresponding to a plurality of fins. Next, the method anisotropically etches the layer of second epitaxial semiconductor material, using the fin pattern mask as an etch mask, and using the layer of first epitaxial semiconductor material as an etch stop layer. This etching step results in a plurality of fins formed from the layer of second epitaxial semiconductor material. | 09-30-2010 |
20110147709 | SIGNAL CONTROL ELEMENTS IN FERROMAGNETIC LOGIC - A chain of field coupled nanomagnets includes at least one elements having substantially different anisotropy energy from that of the other nanomagnets. A signal can propagate from a first input nanomagnet having a relatively high anisotropy energy through the chain to an output nanomagnet. The output nanomagnet may have a relatively lower anisotropy energy than the other nanomagnets. Signal flow direction thus can be controlled. The higher anisotropy energy nanomagnet may be attained by use of a ferromagnet material having a higher anisotropy constant and/or configured with a larger volume than the other elements. The lower anisotropy energy magnet may be attained by use of a ferromagnet material having a lower anisotropy constant and/or configured with a smaller volume than the other elements. Logic signal flow control can also be attained making use of three dimensional geometries of nanomagnets with two different orientations. | 06-23-2011 |
20110253983 | SIDEWALL GRAPHENE DEVICES FOR 3-D ELECTRONICS - A device is provided that includes a structure having a sidewall surface, a layer of material provided on the sidewall surface, and a device structure provided in contact with the layer of material. Fabrication techniques includes a process that includes forming a structure having a sidewall surface, forming a layer of material on the sidewall surface, and forming a device structure in contact with the layer of material, where the device structure and the layer of material are components of a device. | 10-20-2011 |
20110263094 | METHOD OF FORMING FINNED SEMICONDUCTOR DEVICES WITH TRENCH ISOLATION - A method of manufacturing a semiconductor device structure, such as a FinFET device structure, is provided. The method begins by providing a substrate comprising a bulk semiconductor material, a first conductive fin structure formed from the bulk semiconductor material, and a second conductive fin structure formed from the bulk semiconductor material. The first conductive fin structure and the second conductive fin structure are separated by a gap. Next, spacers are formed in the gap and adjacent to the first conductive fin structure and the second conductive fin structure. Thereafter, an etching step etches the bulk semiconductor material, using the spacers as an etch mask, to form an isolation trench in the bulk semiconductor material. A dielectric material is formed in the isolation trench, over the spacers, over the first conductive fin structure, and over the second conductive fin structure. Thereafter, at least a portion of the dielectric material and at least a portion of the spacers are etched away to expose an upper section of the first conductive fin structure and an upper section of the second conductive fin structure, while preserving the dielectric material in the isolation trench. Following these steps, the fabrication of the devices is completed in a conventional manner. | 10-27-2011 |
20120038051 | BURIED SILICIDE LOCAL INTERCONNECT WITH SIDEWALL SPACERS AND METHOD FOR MAKING THE SAME - A buried local interconnect and method of forming the same counterdopes a region of a doped substrate to form a counterdoped isolation region. A hardmask is formed and patterned on the doped substrate, with a recess being etched through the patterned hardmask into the counterdoped region. Dielectric spacers are formed on the sidewalls of the recess, with a portion of the bottom of the recess being exposed. A metal is then deposited in the recess and reacted to form silicide at the bottom of the recess. The recess is filled with fill material, which is polished. The hardmask is then removed to form a silicide buried local interconnect. | 02-16-2012 |
20120081944 | CROSSBAR ARRAY MEMORY ELEMENTS AND RELATED READ METHODS - Apparatus and related fabrication and read methods are provided for crossbar memory elements. An exemplary crossbar memory element includes a crossbar array structure including a set of access lines, unswitched resistance elements coupled electrically in series between the set of access lines and a reference voltage node, and switched resistance elements coupled electrically in series between the first set of access lines and the reference voltage node. To read from a selected access line, the switched resistance element associated with that access line is enabled while the remaining switched resistance elements are disabled. | 04-05-2012 |
20120252193 | DOUBLE AND TRIPLE GATE MOSFET DEVICES AND METHODS FOR MAKING SAME - A double gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin, a first gate and a second gate. The first gate is formed on top of the fin. The second gate surrounds the fin and the first gate. In another implementation, a triple gate MOSFET includes a fin, a first gate, a second gate, and a third gate. The first gate is formed on top of the fin. The second gate is formed adjacent the fin. The third gate is formed adjacent the fin and opposite the second gate. | 10-04-2012 |
20130223162 | METHODS AND SYSTEMS FOR MEMORY DEVICES WITH ASYMMETRIC SWITCHING CHARACTERISTICS - Methods and apparatus are provided for storing data in a non-volatile memory device. A method includes comparing bits of a write instruction with bits in a memory block to determine bits to be switched in the memory block; determining a switch type for each bit to be switched in the memory block; and evaluating the switch type for each bit to be switched in the memory block. The method further comprises when at least one switch type is a first switch type, performing a first operation on the memory block, and when all of the switch types are not the first switch type, performing a second operation on each bit to be switched in the memory block. | 08-29-2013 |
20140015015 | FINFET DEVICE WITH A GRAPHENE GATE ELECTRODE AND METHODS OF FORMING SAME - One illustrative device disclosed herein includes at least one fin comprised of a semiconducting material, a layer of gate insulation material positioned adjacent an outer surface of the fin, a gate electrode comprised of graphene positioned on the layer of gate insulation material around at least a portion of the fin, and an insulating material formed on the gate electrode. | 01-16-2014 |
20140145332 | METHODS OF FORMING GRAPHENE LINERS AND/OR CAP LAYERS ON COPPER-BASED CONDUCTIVE STRUCTURES - One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a graphene liner layer in at least the trench/via, forming a copper-based seed layer on the graphene liner layer, depositing a bulk copper-based material on the copper-based seed layer so as to overfill the trench/via, and performing at least one chemical mechanical polishing process to remove at least excess amounts of the bulk copper-based material and the copper-based seed layer positioned outside of the trench/via to thereby define a copper-based conductive structure with a graphene liner layer positioned between the copper-based conductive structure and the layer of insulating material. | 05-29-2014 |
20140312434 | FINFET DEVICE WITH A GRAPHENE GATE ELECTRODE AND METHODS OF FORMING SAME - One illustrative device disclosed herein includes at least one fin comprised of a semiconducting material, a layer of gate insulation material positioned adjacent an outer surface of the fin, a gate electrode comprised of graphene positioned on the layer of gate insulation material around at least a portion of the fin, and an insulating material formed on the gate electrode. | 10-23-2014 |