Magoshi
Atsuo Magoshi, Osaka JP
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20090246545 | Shining coating film formation method and coated article - There are provided: a method for forming a shining coating film which can form a coating film extremely excellent in a leveling property and a brightness with good workability and can also realize the reduction of environmental burden; and a coated article excellent in a design property obtained by this method. In a method comprising the steps of sequentially coating a shining material-containing solvent type first base coat coating, a shining material-containing solvent type second base coat coating and a top clear coating onto a base material and baking a formed multilayered coating film at the same time, an improvement is made so that the resin composition and coating nonvolatile concentration of the first and second base coat coatings and the amount of nonvolatiles in the first and second base coating films will have specific conditions. | 10-01-2009 |
Hidetaka Magoshi, Tokyo JP
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20090063772 | Methods and apparatus for controlling hierarchical cache memory - Methods and apparatus for controlling hierarchical cache memories permit controlling a first level cache memory including a plurality of cache lines and controlling a next lower level cache memory including a plurality of cache lines. An additional memory may be associated with the next lower level cache memory and include a plurality of memory lines, the number of memory lines corresponding to the number of cache lines in a way set of the first level cache memory. Alternatively, the memory lines may include L-flags for multiple cache lines of each way set of the next lower level cache memory. L-flags associated with a given index plus any index offset from the first level cache memory may be contained in a single memory line of the additional memory. | 03-05-2009 |
Hideyuki Magoshi, Funabashi JP
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20140208152 | RELAY NODE, CONTROL METHOD OF RELAY NODE AND NETWORK SYSTEM - A first network device includes: a forwarding controller configured to forward received data; and a fault detector configured to detect occurrence of a failure in a remote second relay node. The forwarding controller includes: a forwarding unit configured to forward the received data; and a modifier configured to modify the received data for detection of the occurrence of a failure in the second relay node. The modifier includes (i) a flag option marker configured to attach a flag to data; (ii) a sequence adding unit configured to add a protocol specific number to a sequence number; and (iii) a sequence subtracting unit configured to subtract the protocol specific number from an acknowledgement number. The fault detector detects the occurrence of a failure in the remote second relay node, based on at least one of the flag and the acknowledgement number. | 07-24-2014 |
Shunko Magoshi, Tokyo JP
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20080214010 | SEMICONDUCTOR DEVICE FABRICATION METHOD AND PATTERN FORMATION MOLD - According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material. | 09-04-2008 |
20080293169 | LITHOGRAPHY EVALUATING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND PROGRAM MEDIUM - A lithography evaluating method comprises preparing a substrate, the substrate including a semiconductor substrate and a wiring structure including at least one wiring layer formed on the semiconductor substrate, partitioning the substrate into a plurality of regions to be evaluated, and obtaining a value of property relating to the wiring structure previously, and evaluating proximity effect on each of the plurality of regions to be evaluated based on the value of the property relating to the wiring structure. | 11-27-2008 |
20100021848 | METHOD FOR FORMING PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a method for forming a pattern including: applying a photosensitive resin onto a film on a wafer substrate; partly exposing the photosensitive resin to light and developing the photosensitive resin to form a first pattern having an opening portion; applying a photo-curable material onto the film exposed by the opening portion of the first pattern; bringing one face of an optically-transmissive template having a second pattern formed on the one face into contact with the photo-curable material, the second pattern including projections and reentrants; irradiating the photo-curable material with light; and separating the template from the photo-curable material. | 01-28-2010 |
20110065254 | Semiconductor device fabrication method and pattern formation mold - According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material. | 03-17-2011 |