Reitinger
Albert Reitinger, Berglen DE
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20080290633 | Restraint System - A passenger vehicle restraint system that is capable of being placed in different positions, consisting of an interior defined by a housing and at least one airbag, at least one gas generator for delivering gas to the interior in order to inflate the airbag, at least one controllable outlet provided on the housing which may be closed by a closing element, such that an internal pressure in the interior may be adjusted according to parameters relevant to passenger load during an accident. A restraint system, which is easy to construct and can be manufactured cost-effectively, is provided by an adjustable stop element limiting the opening movement of the closing element, which is coupled to the vehicle seat such that the stop element is displaced according to parameters relevant to passenger load, in order to adjust the outlet cross section defined by the closing element located in its closed position. | 11-27-2008 |
Axel Reitinger, Munich DE
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20100121809 | Method and system for predicting test time - A computer implemented method and a system are disclosed for predicting the remaining numbers of error or the remaining time to the end of test mainly applicable in software projects. In at least one embodiment, the prediction can be improved by using the test progress of the current project and the gradient derived from at least one former project having similar characteristics as the current project e.g. release developments for determining parameters for a reliability growth model. The method and the system can be implemented by adapted software and hardware commercially available off the shelf. | 05-13-2010 |
Bernhard Reitinger, Alkoven AT
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20160054122 | METHOD FOR DETERMINING THE LAYER THICKNESS OF A CONNECTING LAYER BETWEEN TWO PACKAGING LAYERS - For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers ( | 02-25-2016 |
Bernhard Reitinger, Krumegg AT
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20140300736 | MULTI-SENSOR CAMERA RECALIBRATION - One or more techniques and/or systems are providing for facilitating recalibration of a multi-sensor camera. That is, a multi-sensor camera may comprise a nadir sensor and one or more oblique sensors. Temperature, mechanical stress, and other factors can lead to misalignment of one or more sensors within the multi-sensor camera. Accordingly, a set of tie points and/or observations may be generated based upon a search matching technique, a densification technique, and/or a virtual matching technique. A bundle technique may be utilized to generate updated eccentricity information based upon the set of tie points and/or observations. The updated eccentricity information (e.g., orientation and/or position information of a sensor, such as an oblique sensor, with respect to a nadir view) may be used to recalibrate the multi-sensor camera, such as in real-time (e.g., during a flight mission that utilizes the multi-sensor camera to capture aerial images of a city or other scene). | 10-09-2014 |
Bernhard Josef Reitinger, Alkoven AT
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20150300813 | METHOD AND DEVICE FOR LASER-OPTICAL DETECTION OF A SURFACE MOVEMENT OF A SAMPLE - A method for laser-optical detection of a surface movement of a sample ( | 10-22-2015 |
Erich Reitinger, Emmering DE
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20120107757 | Method and Apparatus for Thermally Processing Plastic Discs, in particular Mould Wafers - The present invention provides a method and apparatus for thermally processing plastic discs, in particular mould wafers. The method comprises the following steps: clamping a mould wafer ( | 05-03-2012 |
Klemens Reitinger, Starnberg DE
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20120311858 | APPARATUS FOR CONDITIONING SEMICONDUCTOR CHIPS AND TEST METHOD USING THE APPARATUS - The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard. | 12-13-2012 |
Norbert Reitinger, Graz AT
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20150016107 | LED MODULE HAVING A HIGHLY REFLECTIVE CARRIER - An LED module, including a carrier having high reflectivity, wherein a metal layer, preferably a silver layer or a layer of high-purity aluminum, is applied to the carrier. Also disclosed is an LED module, including a carrier having high reflectivity, wherein a metal layer is applied to the carrier, at least one LED chip, and a dam, wherein the metal layer partially covers the surface of the carrier lying under the dam. | 01-15-2015 |
RĂ¼diger Reitinger, Mautern An Der Donau AT
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20150103548 | LIGHTING DEVICE FOR A MOTOR VEHICLE - The invention relates to a lighting device ( | 04-16-2015 |