Patent application number | Description | Published |
20080290369 | SEMICONDUCTOR LIGHT-RECEIVING DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor light-receiving device and its manufacturing method are provided which are capable of suppressing dark current and deterioration. Semiconductor crystals were sequentially grown over an n-type InP substrate, including an n-type InP buffer layer, an undoped GaInAs light absorption layer, an undoped InP diffusion buffer layer, and a p-type InP window layer. Next, a first mesa was formed by removing a part from the p-type InP window layer to the n-type InP buffer layer with a Br-based etchant having low etching selectivity, so as to form a sloped “normal” mesa structure. Next, a second mesa having a smaller diameter than the first mesa was formed by dry etching, by precisely removing a part from the p-type InP window layer to a certain mid position of the undoped InP diffusion buffer layer. | 11-27-2008 |
20090218594 | SEMICONDUCTOR LIGHT RECEIVING ELEMENT - A semiconductor photosensitive element comprises: a semiconductor substrate of a first conductivity type; a first light absorption layer, a first semiconductor layer of a second conductivity type, a first semiconductor layer of the first conductivity type, a second light absorption layer, and a second semiconductor layer of a second conductivity type, arranged in this order on the semiconductor substrate; a first electrode connected to the second semiconductor layer of the second conductivity type; a second electrode connected to the semiconductor substrate; and a third electrode electrically connecting the first semiconductor layer of the first conductivity type to the first semiconductor layer of the second conductivity type. The third electrode is located outside a light detection region for detecting optical signals. | 09-03-2009 |
20090218595 | SEMICONDUCTOR LIGHT RECEIVING ELEMENT - A semiconductor light detecting element comprises: a semiconductor substrate having a first major surface and a second major surface opposite each other; a first reflective layer, an absorptive layer, a phase adjusting layer, and a second reflective layer sequentially disposed, from the semiconductor substrate, on the first major surface of the semiconductor substrate; and an anti-reflection film on the second major surface of the semiconductor substrate, The first reflective layer is a multilayer reflective layer including laminated semiconductor layers having different refractive indices; the absorptive layer has a band gap energy smaller than band gap energy of the semiconductor substrate; the phase adjusting layer has a band gap energy larger than the band gap energy of the absorptive layer; and the first reflective layer contacts the absorptive layers without intervention of other layers. | 09-03-2009 |
20090243013 | SEMICONDUCTOR PHOTORECEPTOR DEVICE - A semiconductor light detecting device includes an n-contact layer selectively disposed on an Fe—InP substrate. An optical waveguide layer is disposed on the n-contact layer and includes an n-cladding layer, a light absorption layer, and a p-cladding layer, laminated on one another over the n-contact layer, in that order. An Fe—InP current blocking layer is disposed on the n-cladding layer such that sides of the optical waveguide layer are buried in the Fe—InP current blocking layer. A p-electrode includes a contact electrode electrically connected to the p-cladding layer of the optical waveguide layer, a lead-out electrode portion extending on a side wall of the current blocking layer from the contact electrode and extending on the Fe—InP substrate, and an electrode pad disposed on a surface of the Fe—InP substrates with an SiN film between the electrode pad and the surface of the Fe—InP substrate and connected to the lead-out electrode portion. | 10-01-2009 |
20090289316 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device comprises a distributed Bragg reflector layer of a first conductivity type, an optical absorption layer, and a semiconductor layer of a second conductivity type, sequentially formed on a semiconductor substrate; wherein said Bragg reflection layer of the first conductivity type has first semiconductor layers having a band gap wavelength larger than the wavelength of incident light, and second semiconductor layers having a band gap wavelength smaller than the wavelength of incident light; and an optical layer thickness of each of said first semiconductor layers is larger than the optical layer thickness of each of said second semiconductor layers. | 11-26-2009 |
20090294787 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes a distributed Bragg reflection layer of a first conductivity type, a distortion elaxation layer of the first conductivity type, a light absorbing layer, and a semiconductor layer of a second conductivity type, sequentially arranged on a semiconductor substrate. The distortion relaxation layer the same material as the semiconductor substrate. The total optical length of layers between the distributed Bragg reflection layer and the light absorbing layer is an integer multiple of one-half the wavelength of incident light that is detected. | 12-03-2009 |
20090321868 | WAVEGUIDE PHOTODETECTOR - A waveguide photodetector detecting light incident on a light detecting end face includes: a substrate; and a layer stack structure on the substrate and including a semiconductor layer of a first conductivity type, an undoped semiconductor layer, and a semiconductor layer of a second conductivity type. The undoped semiconductor layer includes two or more undoped light absorbing layers and undoped non-light-absorbing layers. One non-light-absorbing layer is disposed between adjacent undoped light absorbing layers. The non-light-absorbing layers have a bandgap wavelength shorter than the wavelength of the incident light that is detected. | 12-31-2009 |
20100006967 | SEMICONDUCTOR PHOTODETECTOR - A semiconductor photodetector comprises: a semiconductor substrate; a first multilayer reflective layer on a first surface of the semiconductor substrate and including semiconductor layers; a first optically-resonant layer on the first multilayer reflective layer; a second multilayer reflective layer on the first optically-resonant layer and including semiconductor layers; a light absorbing layer on the second multilayer reflective layer; a reflective film on the light absorbing layer; and an antireflective film on a second surface of the semiconductor substrate. The first optically-resonant layer has a larger thickness than the semiconductor layers of the first and second multilayer reflective layers. The combined optical thickness of the layers between the second multilayer reflective layer and the reflective film is not equal to the optical thickness of the first optically-resonant layer. | 01-14-2010 |
20100059839 | LIGHT RECEIVING ELEMENT - A light receiving element comprises: a photodiode including an optical waveguide, an end surface of the optical waveguide being a light receiving surface of the photodiode; a signal electrode and a bias electrode on a common surface of the photodiode, the signal electrode being connected to an anode of the photodiode, the bias electrode being connected to a cathode of the photodiode; an insulating film on the bias electrode; and a metal electrode on the insulating film. | 03-11-2010 |
20100133637 | AVALANCHE PHOTODIODE - An avalanche photodiode comprises: a substrate; a semiconductor layer of a first conductivity type on the substrate; and an avalanche multiplication layer, a light absorption layer, and a window layer which are sequentially formed on the semiconductor layer, wherein apart of the window layer is a region of a second conductivity type, and the light absorption layer includes a first light absorption layer, and a second light absorption layer which has higher electric conductivity than electric conductivity of the first light absorption layer. | 06-03-2010 |
20100148216 | SEMICONDUCTOR LIGHT RECEIVING ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT RECEIVING ELEMENT - A semiconductor light detecting element having a mesa structure comprises: a first semiconductor layer having n-type conductivity located on a semiconductor substrate, a light absorbing layer located on the first semiconductor layer, and a second semiconductor layer located on the light absorbing layer; a burying layer burying peripheries of the light absorbing layer and the second semiconductor layer. The burying layer has a band gap larger than the band gap of the light absorbing layer. The second semiconductor layer has a first region having p-type conductivity, and a second region having i-type or n-type conductivity and located between the first region and the burying layer. | 06-17-2010 |
20110073973 | SEMICONDUCTOR LIGHT RECEIVING ELEMENT - A semiconductor light detecting element includes: a semiconductor substrate; and a distributed Bragg reflector layer of a first conductivity type, an optical absorption layer, and a semiconductor layer of a second conductivity type, sequentially laminated on the semiconductor substrate. The distributed Bragg reflector layer includes first and second alternately laminated semiconductor layers with different band-gap wavelengths, sandwiching the wavelength of detected incident light. The sum of thicknesses a first and a second semiconductor layer is approximately one-half the wavelength of the incident light detected. | 03-31-2011 |
20110303949 | SEMICONDUCTOR LIGHT-RECEIVING ELEMENT - A semiconductor light-detecting element includes: a semiconductor substrate of a first conductivity type; a light absorption recoupling layer of the first conductivity type, a multilayer reflection film of the first conductivity type, a light absorbing layer, and a window layer, which are laminated, in that order, on the semiconductor substrate; a doped region of a second conductivity type in part of the window layer; a first electrode connected to the doped region; and a second electrode connected to an underside of the semiconductor substrate. The band gap energy of the window layer is larger than the band gap energy of the light absorbing layer, and the band gap energy of the light absorption recoupling layer is smaller than the band gap energy of the semiconductor substrate. | 12-15-2011 |
20120299141 | AVALANCHE PHOTODIODE AND AVALANCHE PHOTODIODE ARRAY - An avalanche photodiode including a semiconductor substrate of a first conductivity type, an avalanche multiplication layer, an electric field control layer, a light absorption layer, and a window layer wherein the layers are laid one on another in this order on a major surface of the semiconductor substrate, an impurity region of a second conductivity type in a portion of the window layer, and a straight electrode on the impurity region and connected to the impurity region, the straight electrode being straight as viewed in a plan view facing the major surface of the semiconductor substrate. | 11-29-2012 |
20120299144 | SEMICONDUCTOR LIGHT RECEIVING DEVICE - A semiconductor light-detecting device includes: a semi-insulating substrate; and n light-detecting elements (n is a natural number equal to or larger than 4) electrically isolated from each other and on the semi-insulating substrate. Each light-detecting element includes a conductive layer of a first conductivity type, a light absorption layer, a window layer, and an impurity diffusion region of a second conductivity type, which are laminated, one on another, on the semi-insulating substrate. The light absorption layer is a photoelectrical converter. The impurity diffusion region is located in part of the window layer and serves as a light-detecting section. A part of the conductive layer and the light absorption layer use the same material. The n light-detecting elements are not all located on a common straight line. | 11-29-2012 |