Patent application number | Description | Published |
20090258494 | INLINE INTEGRATED CIRCUIT SYSTEM - An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe. | 10-15-2009 |
20090283889 | INTEGRATED CIRCUIT PACKAGE SYSTEM - An integrated circuit package system includes: providing a heat spreader; attaching an upper substrate to the heat spreader, the upper substrate having an upper through-opening provided therein; attaching a top semiconductor die to the heat spreader through the upper through-opening, the top semiconductor die having a top die interconnect to the upper substrate; attaching a base substrate to the upper substrate, the base substrate having a base through-opening provided therein larger than the upper through-opening; and attaching an external interconnect connected to the base substrate. | 11-19-2009 |
20090321908 | STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSULATION - A stacked integrated circuit package system includes: mounting a first integrated circuit over a first carrier; mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect over the first carrier and the first integrated circuit; and forming an intra-stack encapsulation between the first carrier and the second carrier surrounding the intra-stack interconnect. | 12-31-2009 |
20100123232 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PROTRUSION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation. | 05-20-2010 |
20100244217 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED CONFIGURATION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a first stack layer including a first device over a first substrate, the first device including a through silicon via; configuring a second stack layer over the first stack layer, the second stack layer including an analog device; configuring a third stack layer over the second stack layer; and encapsulating the integrated circuit packaging system. | 09-30-2010 |
20110062599 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base package substrate; mounting a flip chip integrated circuit die on the base package substrate; applying a flip chip protective layer on the flip chip integrated circuit die including covering only a back side of the flip chip integrated circuit die; and mounting an upper package on the base package substrate including positioning an upper package substrate adjacent to the flip chip protective layer. | 03-17-2011 |
20110244635 | METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM - A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe. | 10-06-2011 |
20120133038 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE - An integrated circuit package system includes a trace frame includes: an encapsulant; a first series of bonding pads along a length of the encapsulant; a second series of the bonding pads along a width of the encapsulant; conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and a first integrated circuit die on the encapsulant and on the conductive traces that extend beyond the first integrated circuit die. | 05-31-2012 |
20120235307 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME STACKING MODULE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit die having an active side and a passive side; providing a contact pad having a top side oriented in a same direction as the passive side; connecting an inner bond wire to the contact pad and the integrated circuit die; and molding a stacking structure around the contact pad, the inner bond wire, and the integrated circuit die with the passive side and the top side exposed, and the stacking structure having a top structure surface on top and adjacent to or below the integrated circuit die, and a horizontal member under the integrated circuit die and forming a cavity. | 09-20-2012 |
Patent application number | Description | Published |
20080288958 | Near Field Communication Host Controller Interface - Provided is a communication interface between an NFCH and an NFC device and a method for controlling an NFC HCI. In the method, a command message is transmitted from the host to the device. The command message includes one of recording data, reading data of the device, requesting the device to transmit predetermined data, and setting the device. A response message informing a performance result of a relevant command is transmitted from the device to the host in response to the command message. After that, an event message is transmitted from the device to the host when needed. | 11-20-2008 |
20100169686 | NEAR FIELD COMMUNICATION HOST CONTROLLER INTERFACE - Provided is a communication interface between an NFCH and an NFC device and a method for controlling an NFC HCI. In the method, a command message is transmitted from the host to the device. The command message includes one of recording data, reading data of the device, requesting the device to transmit predetermined data, and setting the device. A response message informing a performance result of a relevant command is transmitted from the device to the host in response to the command message. After that, an event message is transmitted from the device to the host when needed. | 07-01-2010 |
20110041063 | METHOD AND APPARATUS FOR PROVIDING SOCIAL NETWORK SERVICE - A method for controlling a mobile terminal including receiving, via a wireless communication unit and using a messaging service on the mobile terminal, a bulletin board invitation message from a host terminal and including an invitation to join a bulletin board created by the host terminal; transmitting, via the wireless communication unit using the messaging service, an acceptance message to the host terminal indicating the mobile terminal accepts the invitation for joining the bulletin board created by the host terminal; displaying, on a display of the mobile terminal, the bulletin board created by the host terminal; and transmitting, via the wireless communication unit using the messaging service, contents to be displayed on the bulletin board to the host terminal. | 02-17-2011 |
20140165191 | APPARATUS AND METHOD FOR DETECTING IN-VEHICLE NETWORK ATTACK - An apparatus for detecting an in-vehicle network attack, is configured to cumulatively count packets for each device that has a respective ID and is connected to an in-vehicle network bus. The apparatus is configured to cumulate a check value every time the packets are cumulatively counted to calculate a cumulated value, and determine that an attack is conducted when an average cumulated value obtained by dividing the cumulated value by a cumulative counted value does not exceed a first threshold value. | 06-12-2014 |
20150043594 | GATEWAY APPARATUS AND MESSAGE ROUTING METHOD - A gateway apparatus and a message routing method are provided. The gateway apparatus includes: a network adaptor transmitting and receiving a message through a vehicle network or a diagnosing CAN positioned inside a vehicle; a CAN driver transferring the message received through the network adaptor; a message router routing the message transferred from the CAN driver and filtering valid data of the message; an application invoking a signal routing application to detect validity of data of each signal of the message transferred from the CAN driver and route data of a valid signal; and a CAN diagnostor processing a message of a diagnosing apparatus performing an access through the diagnosing CAN positioned inside the vehicle to control a diagnosing operation. | 02-12-2015 |
20150046342 | SYSTEM AND METHOD FOR TELEMATICS SERVICE OF VEHICLE - Disclosed are a system and a method for a telematics service of a vehicle through which various vehicle related services such as a remote diagnosis or an e-Call can be continuously used through a gateway without causing a compatibility problem even when a telematics unit is replaced. The system for a telematics service includes: a gateway having a service stub file containing cooperation execution information of a telematics service; and a telematics unit configured to request and receive a service stub file from the gateway. A service stub is created for connection to the gateway and execution of cooperation of a service based on information in the service stub file received from the gateway. | 02-12-2015 |
20150154818 | PREVENTION DEVICE FOR OPERATING VEHICLE RUNNING RECORD - A prevention device for operating a vehicle running record is provided. The device includes a cluster controller that is configured to convert a received and stored accumulated running distance of the vehicle from a cluster of the vehicle to generate a plurality of different distributed secret pieces. In addition, a plurality of other controllers are configured to receive and store each of the plurality of distributed secret pieces from the cluster controller. | 06-04-2015 |
Patent application number | Description | Published |
20130090032 | POLYESTER FIBER AND PREPARATION METHOD THEREOF - This disclosure relates to high strength polyester fiber for industrial application such as a seat belt, webbing and the like, particularly to polyester fiber having elongation of 0.4% or more at stress of 1.0 g/d, elongation of 3.5% or more at stress of 4.0 g/d, and elongation of 6.0% or more at stress of 7.0 g/d, as measured at room temperature, and a method for manufacturing the same. | 04-11-2013 |
20130172516 | POLYESTER FIBER AND METHOD FOR PRODUCING SAME - Disclosed is a high strength and high elongation polyester fiber being used for anchoring, mooring, or towing a ship, and particularly is a polyester fiber wherein the recovered work ratio at the elongation corresponding to 10% of the maximum load measured at room temperature is 70% or more, the recovered work ratio at the elongation corresponding to 20% of the maximum load is 50% or more, and the recovered work ratio at the elongation corresponding to 30% of the maximum load is 40% or more, a method of preparing the same, and a polyester fiber rope including the same. | 07-04-2013 |
20130273344 | POLYESTER YARN AND PRODUCTION METHOD THEREOF - Disclosed is a polyester yarn which can be used in a fabric for an airbag. A content of one or more inorganic fillers selected from the group consisting of TiO | 10-17-2013 |