Patent application number | Description | Published |
20080286562 | THERMOSETTING ENCAPSULATION ADHESIVE SHEET - A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device ( | 11-20-2008 |
20100164127 | EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof. | 07-01-2010 |
20100324164 | PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a photocurable resin composition including the following ingredients (A), (B) and (C): (A) a linear chain epoxy resin represented by the following general formula (1), in which m indicates an integer of from 2 to 10, and R | 12-23-2010 |
20110058776 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL-SEMICONDUCTOR-DEVICE LEAD FRAME OBTAINED USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to a resin composition for optical semiconductor devices, the resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a polyorganosiloxane; and (D) a white pigment. | 03-10-2011 |
20110201763 | THERMOSETTING RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED MATERIAL THEREOF, AND OPTICAL-SEMICONDUCTOR DEVICE OBTAINED USING THE SAME - The present invention relates to a thermosetting resin composition for optical-semiconductor element encapsulation, the thermosetting resin composition including the following ingredients (A) to (D): (A) an epoxy group-containing siloxane compound represented by the following general formula (1) in which R | 08-18-2011 |
20110298003 | EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING THE SAME - The present invention relates to an epoxy resin composition for optical use including the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) an inorganic filler including (c1) an inorganic filler having a refractive index larger than a refractive index of a cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler and (c2) an inorganic filler having a refractive index smaller than the refractive index of the cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler. | 12-08-2011 |
20120010319 | PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredients (A) and (B) in combination, and the oxetane compound includes the following ingredient (C): (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at 60° C. or higher; (B) a solid epoxy resin having at least two epoxy groups in one molecule thereof and having a refractive index of 1.6 or more by itself; and (C) an oxetane compound represented by the following general formula (1) in which n is an integer of 1 to 6. | 01-12-2012 |
20120010320 | PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredient (A), and the oxetane compound includes the following ingredient (B), and the ingredient (A) is contained in an amount of from 60 to 95% by weight and the ingredient (B) is contained in an amount of from 5 to 40% by weight relative to 1000% by weight of a total resin amount in the resin composition: (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at room temperature; and (B) an oxetane compound represented by the following general formula (1) in which n is an integer of from 1 to 6. | 01-12-2012 |
20120165424 | LIGHT-CURING RESIN COMPOSITION AND OPTICAL MATERIAL - A light-curing resin composition includes an epoxy resin having two or more epoxy groups in one molecule; a photopolymerization initiator including an anion component and a cation component; and an aralkyl compound having an alcoholic hydroxyl group. | 06-28-2012 |
20120299039 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a curing accelerator; (D) a specific silicone resin; and (E) a specific alcohol compound. | 11-29-2012 |
20140183593 | ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE - A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element. | 07-03-2014 |
Patent application number | Description | Published |
20090246918 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a method of manufacturing a semiconductor device in which a semiconductor element is mounted on a wiring circuit board and a clearance between the wiring circuit board and the semiconductor element is sealed with a sealing material, the method including: a sealing material arranging step of arranging the sealing material on at least one of a terminal-provided surface of the semiconductor element and a terminal-provided surface of the wiring circuit board; a sealing step of pressing the semiconductor element to the wiring circuit board under such a condition that a terminal of the semiconductor element and a terminal of the wiring circuit board are opposed with each other via the sealing material at a reduced pressure of 13300 Pa (absolute pressure) or less, thereby combining the semiconductor element with the wiring circuit board; and subsequent to the sealing step, a terminal connecting step of heating and fusing at least one of the terminal of the semiconductor element and the terminal of the wiring circuit board at an atmospheric pressure, thereby connecting the terminal of the semiconductor element and the terminal of the wiring circuit board. | 10-01-2009 |
20090295003 | RESIN COMPOSITION FOR OPTICAL COMPONENTS, OPTICAL COMPONENT USING THE SAME AND PRODUCTION METHOD OF OPTICAL LENS - The present invention relates to a resin composition for optical components, which is an ultraviolet-curable transparent resin composition used as a material for an optical component, in which the resin composition includes (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an oxetane compound having one or more oxetanyl groups in one molecule thereof and (C) a photo-acid generator, and in which the component (C) is contained in an amount of 0.01 to 2.0 parts by weight based on 100 parts by weight of a total amount of the components (A) and (B). The present invention also relates to an optical component obtained by using the resin composition for optical components, and a production method thereof. | 12-03-2009 |
20090311630 | PROCESS FOR PRODUCING OPTICAL COMPONENT - The present invention relates to a process for producing an optical component, the process including: disposing a transparent stamp tool on a substrate or an imaging element through a transparent ultraviolet-curable resin composition layer; and irradiating the resin composition layer with an ultraviolet ray through the transparent stamp tool to thereby cure the resin composition layer, in which a resin composition contained in the resin composition layer contains a thermosetting resin as a main component and a photo-acid generator, and the ultraviolet ray passing through the transparent stamp tool is an ultraviolet ray having a wavelength of 320 nm or more. | 12-17-2009 |
20100148379 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME - An epoxy resin composition for semiconductor encapsulation, which comprises: (A) an epoxy resin having at least two epoxy groups in a molecule thereof; (B) a compound having at least two phenolic hydroxyl groups in a molecule thereof; and (C) particles of a compound represented by general formula (1), the particles having a maximum particle diameter of not greater than 30 μm and a standard deviation of not greater than 5 μm, the particles being dispersed in the epoxy resin composition: | 06-17-2010 |
20100292358 | RESIN COMPOSITION FOR OPTICAL COMPONENTS AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a resin composition for optical components, the resin composition being an ultraviolet-curable transparent resin composition to be used as a material for an optical component, in which the resin component includes the following component (A) as a main component and the following component (B) being a photo-cationic polymerization initiator: (A) an epoxy resin having two or more epoxy groups in one molecule thereof; and (B) an onium salt containing a hexafluorophosphate ion as an anion component. | 11-18-2010 |
20120153513 | THERMOSETTING ENCAPSULATION ADHESIVE SHEET - A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device ( | 06-21-2012 |