Ikedo, JP
Akihito Ikedo, Yokkaichi JP
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20150263018 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including a semiconductor substrate having an active region and an element isolation region; memory-cell transistors and select-gate transistors each formed above the substrate and having a gate electrode formed above the active region via a first insulating film, the gate electrode including a floating gate electrode, an interelectrode insulating film, and a control gate electrode; the element isolation region being formed of a trench and an insulating film filled in the trench, a position of an upper surface of the insulating film located between the gate electrodes of the memory cell transistors being higher than a position of the upper surface of the floating gate electrode, and a position of an upper surface of the insulating film located between the gate electrodes of the select-gate transistors being lower than a position of the upper surface of the floating gate electrode. | 09-17-2015 |
Gaku Ikedo, Kanagawa JP
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20080285170 | Magnetic disk drive and method of controlling the same - Embodiments of the present invention provide a magnetic disk drive, in which a disturbance component contained in an output signal from a rotational vibration detector, can be appropriately suppressed irrespective of frequency of the component, and a method of controlling the drive. According to one embodiment, in a magnetic disk drive having a rotational vibration detector for detecting rotational vibration of a drive housing, a main control circuit performs a head moving step of driving a voice coil motor to move a magnetic head on a magnetic disk, a frequency estimation step of estimating a frequency of each disturbance component contained in an output signal from the rotational vibration detector after moving the magnetic head, and a suppressor setting step of setting a notch filter for suppressing the disturbance component based on the estimated frequency. | 11-20-2008 |
Hideki Ikedo, Kawasaki-Shi JP
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20100039538 | IMAGE PROCESSING DEVICE, IMAGE SENSING APPARATUS, AND IMAGE PROCESSING METHOD - An image processing device is comprised of: a frequency component resolution section for resolving an image obtained from an image sensor having a light-shielded pixel area and a non-light-shielded pixel area into two or more frequency components; a noise amount calculation section for calculating a noise amount for the frequency component based on the frequency component in the light-shielded pixel area; a noise suppression section for suppressing the noise component for the frequency component in the non-light-shielded pixel area according to the noise amount that has been calculated by the noise amount calculation section; and a frequency component synthesis section for synthesizing the frequency component that has been resolved by the frequency component resolution section to thereby form an image. | 02-18-2010 |
20140002702 | SOLID-STATE IMAGE SENSOR AND IMAGE PICKUP APPARATUS | 01-02-2014 |
20140118587 | IMAGE PICKUP APPARATUS AND DRIVING METHOD THEREFOR - An image pickup apparatus includes an image pickup unit including a plurality of photoelectric conversion elements provided correspondingly to each of microlenses arranged two-dimensionally, reads out a first signal through addition from the photoelectric conversion elements corresponding to the microlense, reads out a second signal from one of the photoelectric conversion elements corresponding to the microlense, and sets one of a first and second read-out modes to read signals from the image pickup unit in accordance with a photographing condition, wherein the first and second read-out modes differ in read-out density of the second signal in a read-out area in accordance with one of a thinning-out rate and an addition rate of a area from which the second signal is read out being different as compared to a area from which the first signal is read out. | 05-01-2014 |
20140192237 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD AND PROGRAM, AND IMAGE PICKUP APPARATUS INCLUDING IMAGE PROCESSING APPARATUS - The image processing apparatus processes an image signal obtained from an image pickup element, using an image pickup optical system arranged to obtain directional traveling information of object image light corresponding to a pupil division area of a photographing lens. The apparatus includes: a unit of setting a focal position at which the refocused image is generated; and a unit of correcting an image signal of a defect pixel of the image pickup element using an image signal of other pixel. The apparatus determines the other pixel to be used for correcting the image signal of the defect pixel on the basis of the set focal position and the directional traveling information of the object image light. | 07-10-2014 |
20140320735 | IMAGE CAPTURING APPARATUS AND METHOD OF CONTROLLING THE SAME - An image capturing apparatus comprising an image sensor including a plurality of pixels each including a plurality of photoelectric conversion units, and a first holding unit and a second holding unit configured to store signals output from the plurality of pixels and a driving unit configured to perform first write processing for writing first signals supplied from a first number of photoelectric conversion elements of each pixel in the first holding unit and second write processing for writing second signals supplied from a second number of photoelectric conversion units of each pixel. | 10-30-2014 |
Keisuke Ikedo, Osaka JP
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20150370190 | LIQUID DEVELOPING AGENT - The object of the present invention is to provide a liquid developing agent for electrophotography or electrostatic recording obtained by utilizing the coacervation method, wherein such liquid developing agent has good abrasion resistance. To this end, a liquid developing agent is provided which is obtained by utilizing the coacervation method, comprising insulating liquid in which colored resin particles formed by at least pigment, pigment dispersant, acid-group-containing resin, binder resin, and resin whose glass transition temperature is −120 to −60° C. are dispersed, wherein the resin whose glass transition temperature is −120 to −60° C. is contained in the colored resin particle by 1.0 to 5.0 percent by mass. | 12-24-2015 |
Kenji Ikedo, Nagano JP
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20110002370 | SAMPLING POINT DETECTION CIRCUIT, TRANSMISSION SYSTEM, PRE-EMPHASIS INTENSITY ADJUSTMENT METHOD, LOGIC ANALYZER, AND EVALUATION METHOD FOR EVALUATING TRANSMISSION PATH - A sampling point detection circuit | 01-06-2011 |
Kenshi Ikedo, Kobe-Shi JP
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20100264197 | APPARATUS AND METHOD FOR SOLDERING FLAT WORK PIECE - A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber. | 10-21-2010 |
20120291921 | FLUX FOR SOLDER PASTE, AND SOLDER PASTE - A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C | 11-22-2012 |
20120291922 | SOLDER PASTE - A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of | 11-22-2012 |
Masato Ikedo, Otawara-Shi JP
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20090076374 | Magnetic resonance imaging apparatus - A magnetic resonance imaging apparatus includes an acquisition unit which acquires first data in which a tissue of interest has higher signal intensity than a background and second data in which the tissue of interest has lower signal intensity than the background, with regard to images of the same region of the same subject, and a generation unit which generates, on the basis of the first data and the second data, third data in which the contrast of the tissue of interest to the background is higher than those in the first and second data. | 03-19-2009 |
20110071384 | MAGNETIC RESONANCE IMAGING APPARATUS - A magnetic resonance imaging apparatus includes an acquisition unit that acquires first data in which a tissue of interest has higher signal intensity than a background and second data in which the tissue of interest has lower signal intensity than the background, with regard to images of the same region of the same subject, and a generation unit that generates, on the basis of the first data and the second data, third data in which the contrast of the tissue of interest to the background is higher than those in the first and second data. | 03-24-2011 |
Masato Ikedo, Nasushiobara-Shi JP
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20110304331 | MAGNETIC RESONANCE IMAGING APPARATUS AND MAGNETIC RESONANCE IMAGING METHOD - According to one embodiment, a magnetic resonance imaging apparatus includes an image generating unit, a judging unit and a correction unit. The image generating unit receives, from an object, a magnetic resonance signal caused by transmission of an RF pulse to cause a nuclear magnetic resonance, and generates image data of the object based on the magnetic resonance signal. The judging unit identifies an implant region where an implant part exists inside the object, based on the image data. The correction unit acquires magnetic resonance frequency information from a body region which is a region inside the object excluding the implant region, and corrects a center frequency of the RF pulse based on the magnetic resonance frequency information. | 12-15-2011 |
Norio Ikedo, Osaka JP
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20090072221 | NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A nitride semiconductor device comprises: a well layer of nitride semiconductor containing In and Ga; barrier layers of nitride semiconductor sandwiching the well layer, containing Al and Ga, and having a larger band gap energy than the well layer; and a thin film layer provided between the well layer and the barrier layer. The thin film layer is formed during lowering of the substrate temperature after formation of the barrier layer or during elevation of the substrate temperature after formation of the well layer. | 03-19-2009 |
20100027575 | SEMICONDUCTOR LASER DEVICE - A semiconductor laser device includes a multilayer structure made of group III nitride semiconductors formed on a substrate. The multilayer structure includes a MQW active layer, and also includes a step region selectively formed in an upper portion thereof. In another upper portion of the multilayer structure, a ridge stripe portion including a waveguide, which extends in parallel to a principal surface of the multilayer structure, is formed. In the vicinity of the step region, a first region, in which the MQW active layer has a bandgap energy of Eg | 02-04-2010 |
20110206081 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light-emitting device includes an n-type cladding layer formed on a substrate, an active layer formed on the n-type cladding layer and including a well layer and a barrier layer, and a p-type cladding layer formed on the active layer. The well layer is made of an indium-containing nitride semiconductor, and has a hydrogen concentration greater than that of the n-type cladding layer and less than that of the p-type cladding layer. | 08-25-2011 |
Norio Ikedo, Hyogo JP
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20140153216 | PHOSPHOR OPTICAL ELEMENT AND LIGHT-EMITTING DEVICE USING THE SAME - A phosphor optical element includes: a base member; a phosphor-containing member that includes a transparent member containing a phosphor particle; and a cover member, wherein the base member, the phosphor-containing member, and the cover member are sequentially formed on a transparent base that is transparent to a wavelength of incident light from an excitation light source, the phosphor particle has a diameter no greater than the wavelength of the incident light, and in an arbitrary cross section of the phosphor-containing member in a direction perpendicular to a main surface of the transparent base, the phosphor-containing member has, in a direction perpendicular to the main surface of the transparent base, a thickness no greater than the wavelength of the incident light. | 06-05-2014 |
Shigeo Ikedo, Tsu-Shi JP
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20090268151 | PRODUCTION PROCESS OF A DISPLAY DEVICE, AND A DISPLAY DEVICE - A production process of a display device is performed such that, even if exposure displacement is caused by an error in stitching divided regions, a linear protrusion in the vicinity of a divisional boundary is prevented from becoming thin or disappearing because of double exposure. The display device having an insulating substrate on which a plurality of dots are arranged in a matrix includes a linear protrusion which is formed on the insulating substrate by performing divisional exposure on a plurality of divided regions on the insulating substrate, wherein the boundary between the adjacent divided regions provides, in the vicinity of the linear protrusion in one of the divided regions, at least a bent portion that extends into the other divided region at a predetermined distance. | 10-29-2009 |
Taichi Ikedo, Kanagawa JP
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20090262863 | AMPLITUDE CONTROL CIRCUIT, POLAR MODULATION TRANSMISSION CIRCUIT AND POLAR MODULATION METHOD - The amplitude control circuit of the present invention can reduce output noise and suppress a decrease in reception sensitivity. An amplitude control section ( | 10-22-2009 |
20100066429 | POWER SUPPLY VOLTAGE FORMING DEVICE AND POLAR MODULATION TRANSMISSION DEVICE - Provided is a power voltage forming device which can correct an offset voltage of a high-frequency power amplifier without degrading distortion characteristic of a high-frequency power amplifier. The power voltage forming device ( | 03-18-2010 |
20120082265 | AMPLITUDE CONTROL CIRCUIT, POLAR MODULATION TRANSMISSION CIRCUIT, AND POLAR MODULATION METHOD - A reference voltage adjustment unit ( | 04-05-2012 |
20120094712 | AMPLITUDE MODULATOR - An amplitude modulator comprises: a signal processing section for receiving a source signal for wide bandwidth use, splitting the source signal into two source signals for lower frequency use and for higher frequency use, respectively, signal processing the two source signals individually, and outputting a lower-frequency-use source signal and a higher-frequency-use source signal; | 04-19-2012 |
Taichi Ikedo, Osaka JP
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20100219685 | VOLTAGE SUPPLY CIRCUIT - In the voltage supply circuit, a reference voltage generating circuit generates a reference voltage. An operational amplifier circuit generates an output voltage on the basis of the reference voltage. A selection circuit has at least two first terminals to select one of the first terminals and to generate a passed output voltage representing the output voltage passed through the first terminal selected. A second terminal receives the passed output voltage and is capable of outputting the passed output voltage to a load circuit. A detection circuit detects a magnitude of the passed output voltage and generates a detection voltage. The selection circuit selects a voltage corresponding to the passed output voltage generated from among at least two of the detection voltages and generates a detection voltage representing the detection voltage selected. The operational amplifier circuit decreases the difference between the reference voltage and the selected detection voltage. | 09-02-2010 |
Toshiyuki Ikedo, Aichi JP
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20110042008 | PLASMA GENERATOR - To provide a plasma generator having a plasma-generating zone of an increased volume. | 02-24-2011 |
Tsuneo Ikedo, Tokyo JP
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20100020081 | LIGHT REFLECTION INTENSITY CALCULATION CIRCUIT - A circuit for calculating a light reflected component with high accuracy. The circuit for calculating a reflected component of light reflected from an object having a rough surface comprises a means for storing the reflectance of an object in relation to the value φ or the value of cos φ, letting a surface normal vector be denoted by a vector N, a light source incidence unit vector be denoted by a vector L, a line-of-sight unit vector be denoted by V, a half vector of the light source incidence vector L and the line-of-sight vector V be denoted by H and defining the inner products as N·L=cos θ, N·V=cos γ, V·H=cos φ, N·H=cos β; a means for storing a luminance distribution in relation to the value of β or the value of cos β; a means for acquiring information on the reflectance term (F | 01-28-2010 |
Yosuke Ikedo, Saitama JP
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20150182366 | JOINT MECHANISM - A joint mechanism | 07-02-2015 |
Yuichi Ikedo, Kanazawa Ishikawa JP
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20150262982 | PHOTOCOUPLER - A photocoupler includes: a light emitting element; a light receiving element; an inner resin layer; and an outer resin layer. The light emitting element is driven by an input electrical signal. The light receiving element is configured to convert emission light of the light emitting element into an electrical signal. The inner resin layer includes a base resin and a curing agent. The base resin contains isocyanuric acid having an epoxy group. The curing agent contains an acid anhydride having an acid anhydride group. The inner resin layer covers the light emitting element and the light receiving element. Then outer resin layer encloses the inner resin layer and configured to block the emission light. Carbon atomic concentration increases and oxygen atomic concentration decreases with distance in depth direction of the inner resin layer from an interface. | 09-17-2015 |
Yuichi Ikedo, Fukuoka-Ken JP
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20130062613 | LIGHT EMITTING DEVICE - According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The light emitting element is fixed on the first lead. The second lead is provided away from the first lead and electrically connected to the light emitting element via a metal wire. The, molded body made of a sealing resin covers the light emitting element, end portions of the first lead and the second lead, the light emitting element being fixed on the end portion of the first read, and the metal wire being bonded on the end portion of the second lead. The first groove is provided between first and second portions in a front surface of the second lead, the first portion being in contact with an outer edge of the molded body and the metal wire being bonded on the second portion. | 03-14-2013 |
20150076524 | SEALING RESIN, SEMICONDUCTOR DEVICE, AND PHOTOCOUPLER - A semiconductor device includes: a sealing resin and a semiconductor element. The sealing resin includes a base resin and a curing agent. The base resin includes isocyanuric acid having an epoxy group. The curing agent includes an acid anhydride having an acid anhydride group. A mole ratio of the acid anhydride group to the epoxy group is not less than 0.67 and not more than 0.8. A semiconductor element is covered with the sealing resin. | 03-19-2015 |
20150295121 | SEALING RESIN, SEMICONDUCTOR DEVICE, AND PHOTOCOUPLER - A semiconductor device includes: a sealing resin and a semiconductor element. The sealing resin includes a base resin and a curing agent. The base resin includes isocyanuric acid having an epoxy group. The curing agent includes an acid anhydride having an acid anhydride group. A mole ratio of the acid anhydride group to the epoxy group is not less than 0.67 and not more than 0.8. A semiconductor element is covered with the sealing resin. | 10-15-2015 |