Patent application number | Description | Published |
20100236825 | Assemble structure of connection device and electric device, connection device and electric device used for the same - An assemble structure includes: a connection device including a support element on one side of an attachment surface, a first connector on the attachment surface, and a key groove on a support surface of the support element; and the electric device including a casing to be attached to the attachment surface, a second connector on one surface of the casing electrically coupled with the first connector, and a key protruding from the one side of the casing. The electric device is rotatable via a hinge provided by the support element and the casing when one side of the casing faces a support surface of the support element. The key groove on the support surface corresponds to the key on the one side of the casing. | 09-23-2010 |
20140085071 | VEHICLE APPROACH NOTIFICATION DEVICE - In a vehicle approach notification device for notifying approach of a vehicle by emitting a notification sound according to a synthetic sound signal composed of a plurality of frequency components from a speaker, a vehicle speed specifying portion specifies a speed of the vehicle, and a synthetic sound signal generating portion generates the synthetic sound signal. The synthetic sound signal generating portion generates the synthetic sound signal such that the frequency component that belongs to a second frequency range in which a variation in sound pressure outputted from the speaker is equal to or smaller than a predetermined magnitude is shifted according to a change in the speed of the vehicle, without shifting the frequency component that belongs to a first frequency range in which the variation in sound pressure outputted from the speaker is greater than the predetermined magnitude. | 03-27-2014 |
20150035660 | VEHICLE APPROACH WARNING APPARATUS - A vehicle approach warning apparatus outputting a warning sound signal for outputting a warning sound, and generating the warning sound according to the warning sound signal from a speaker, and notifying a pedestrian around a vehicle that the vehicle approaches to the pedestrian is provided. The vehicle approach warning apparatus includes a memory portion, a signal generation portion, a level adjustment portion, a signal synthesizing portion, and an amplifier. The memory portion stores a first sound source data for generating a signal of a low frequency component, and a second sound source data for generating a signal of a high frequency component. The signal generation portion generates the signal of the low frequency component, and the signal of the high frequency component. The level adjustment portion adjusts a level of the signal of the low frequency component and the high frequency component. | 02-05-2015 |
Patent application number | Description | Published |
20080275047 | TETRAHYDRO-NAPHTHALENE DERIVATIVES - This invention relates to tetrahydro-naphthalene derivatives and salts thereof which are useful as an active ingredient of pharmaceutical preparations. The tethrahydro-naphthalene derivatives of the present invention have excellent activity as VR1 antagonist and useful for the prophylaxis and treatment of diseases associated with VR1 activity, in particular for the treatment of urinary incontinence, overactive bladder, urge urinary incontienence, chronic pain, neuropathic pain, post-operative pain, rheumatoid arthritic pain, neuralgia, neuropathies, algesia, nerve injury, ischaemia, neurodegeneration, stroke, inflammatory disorders, asthma and COPD. | 11-06-2008 |
20090209514 | Tetrahydro-Naphthalene Derivatives as Vanilloid Receptor Antagonists - This invention relates to tetrahydro-naphthalene derivatives and salts thereof which is useful as an active ingredient of pharmaceutical preparations. The tetrahydronaphthalene derivatives of the present invention have an excellent activity as VR1 antagonist and useful for the prophylaxis and treatment of diseases associated with VR1 activity, in particular for the treatment of urinary incontinence, urge urinary incontinence, overactive bladder, chronic pain, neuropathic pain, postoperative pain, rheumatoid arthritic pain, neuralgia, neuropathies, algesia, nerve injury, ischaemia, neurodegeneration, stroke, inflammatory disorders, asthma and COPD. | 08-20-2009 |
20110178088 | TETRAHYDRO-NAPHTHALENE DERIVATIVES - This invention relates to tetrahydro-naphthalene derivatives and salts thereof which are useful as an active ingredient of pharmaceutical preparations. The tetrahydro-naphthalene derivatives of the present invention have excellent activity as VR1 antagonist and useful for the prophylaxis and treatment of diseases associated with VR1 activity, in particular for the treatment of urinary incontinence, overactive bladder, urge urinary incontinence, chronic pain, neuropathic pain, post-operative pain, rheumatoid arthritic pain, neuralgia, neuropathies, algesia, nerve injury, ischaemia, neurodegeneration, stroke, inflammatory disorders, asthma and COPD. | 07-21-2011 |
Patent application number | Description | Published |
20080224310 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes: preparing a wiring board having a base substrate and wiring that is plated on surface with a plating metal; pressing a bump that is formed on the active side of the semiconductor chip against an end part of the wiring of the wiring board, thereby exfoliating the area surrounding the pressed portion of the wiring from the base substrate while keeping the end of the wiring bonded with the base substrate; melting the plating metal that is located on the end part of the wiring, thereby causing the plating metal and the bump to form an alloy that bonds the bump and the wiring and infiltrate the plating metal into a space between the wiring and the base substrate; and judging that the bump and the wiring are well bonded if the plating metal has infiltrated a space between the wiring and the base substrate so as to have an area, width or length of infiltration that exceeds a reference value. | 09-18-2008 |
20080284013 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes: when bonding a bump of an IC chip to a bonding position of a wiring pattern that is formed on an insulating film base member and has a surface covered by a plating layer, forming a plating layer around the bonding position among the wiring pattern at least in an outer peripheral section of a peeled surface of a portion of the wiring pattern peeled from the film base member. | 11-20-2008 |
20110006420 | SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes: preparing a wiring board having a base substrate and wiring that is plated on surface with a plating metal; pressing a bump that is formed on the active side of the semiconductor chip against an end part of the wiring of the wiring board, thereby exfoliating the area surrounding the pressed portion of the wiring from the base substrate while keeping the end of the wiring bonded with the base substrate; melting the plating metal that is located on the end part of the wiring, thereby causing the plating metal and the bump to form an alloy that bonds the bump and the wiring and infiltrate the plating metal into a space between the wiring and the base substrate; and judging that the bump and the wiring are well bonded if the plating metal has infiltrated a space between the wiring and the base substrate so as to have an area, width or length of infiltration that exceeds a reference value. | 01-13-2011 |
20120086121 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A semiconductor device includes an insulating film base member and a wiring pattern that is formed on the insulating film base member. The wiring pattern has a surface, with at least a peripheral section of the surface being a peeled surface of the wiring pattern peeled from the insulating film base member. The semiconductor device further includes a plating layer that covers the surface of the wiring pattern, and an IC chip that has an active surface with a bump bonded to the wiring pattern. The peeled surface of the wiring pattern is peeled from the insulating film base member around a bonding position of the wiring pattern bonded with the bump. | 04-12-2012 |
20140291836 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having a plurality of electrodes and a plurality of leads that are connected to the electrodes and a semiconductor element that is mounted on the substrate. The semiconductor element has a rectangular shape including a long side, a short side, and a corner portion, and has bumps connected to the electrodes. An underfill is filled between the substrate and the semiconductor element and extends on the substrate around the semiconductor element. An overcoat covers the leads on the substrate. At least one of the plurality of leads that is connected to the electrode corresponding to the bump arranged nearest to the corner portion along the long side of the semiconductor element has at least two successive bent portions that are bent in the same direction and is laid out toward the short side of the semiconductor element in a plan view. | 10-02-2014 |