Patent application number | Description | Published |
20120191805 | METHOD AND TRANSCODING PROXY FOR TRANSCODING A MEDIA STREAM THAT IS DELIVERED TO AN END-USER DEVICE OVER A COMMUNICATIONS NETWORK - Methods and transcoding proxies for transcoding media streams are described. In one embodiment, a method for transcoding a media stream that is delivered to an end-user device over a communications network involves selecting a transcoding technique for the media stream, transcoding a portion of the media stream using the selected transcoding technique, streaming the transcoded portion of the media stream to the end-user device, while the transcoded portion of the media stream is being streamed to the end-user device, detecting a change in a condition of the communications network, selecting a different transcoding technique in response to the change in the condition of the communications network, transcoding a subsequent portion of the media stream using the different transcoding technique, and streaming the transcoded subsequent portion of the media stream to the end-user device. Other embodiments are also described. | 07-26-2012 |
20140325627 | AUTHENTICATION SYSTEM AND METHOD FOR EMBEDDED APPLETS - A system and method for authenticating user requests issued from embedded applets running on web-accessible user devices. The server system generates authentication tokens associated with user credentials, in response to user requests for HTML pages that include the embedded applets. The server system stores the authentication tokens on the server system, and includes the authentication tokens in URLs within applet tags in the HTML pages returned to the user devices. When the applets download and request content from the server system, the applets supply the previously included authentication tokens in the URLs that identify the requested content. Upon finding a match between the applet-supplied authentication tokens and the stored authentication tokens, the server identifies the user as a trusted user, and responds with the requested content. This can be used to eliminate HTTP- based authentication challenges for subsequent user access. | 10-30-2014 |
Patent application number | Description | Published |
20080284000 | Integrated Circuit Packages, Methods of Forming Integrated Circuit Packages, And Methods of Assembling Integrated Circuit Packages - Some embodiments include methods of assembling integrated circuit packages in which at least two different conductive layers are formed over a bond pad region of a semiconductor die, and in which a conductive projection associated with an interposer is bonded through a gold ball to an outermost of the at least two conductive layers. The conductive layers may comprise one or more of silver, gold, copper, chromium, nickel, palladium, platinum, tantalum, titanium, vanadium and tungsten. In some embodiments, the bond pad region may comprise aluminum, an inner of the conductive layers may comprise nickel, an outer of the conductive layers may comprise gold, the conductive projection associated with the interposer may comprise gold; and the thermosonic bonding may comprise gold-to-gold bonding of the interposer projection to a gold ball, and gold-to-gold bonding of the outer conductive layer to the gold ball. Some embodiments include integrated circuit packages. | 11-20-2008 |
20100151630 | Methods of Forming Integrated Circuit Packages, and Methods of Assembling Integrated Circuit Packages - Some embodiments include methods of assembling integrated circuit packages in which at least two different conductive layers are formed over a bond pad region of a semiconductor die, and in which a conductive projection associated with an interposer is bonded through a gold ball to an outermost of the at least two conductive layers. The conductive layers may comprise one or more of silver, gold, copper, chromium, nickel, palladium, platinum, tantalum, titanium, vanadium and tungsten. In some embodiments, the bond pad region may comprise aluminum, an inner of the conductive layers may comprise nickel, an outer of the conductive layers may comprise gold, the conductive projection associated with the interposer may comprise gold; and the thermosonic bonding may comprise gold-to-gold bonding of the interposer projection to a gold ball, and gold-to-gold bonding of the outer conductive layer to the gold ball. Some embodiments include integrated circuit packages. | 06-17-2010 |
20100224989 | MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION TO INTERPOSER SUBSTRATES, AND ASSOCIATED METHODS OF PACKAGING MICROELECTRONIC DEVICES WITH INTERMEDIATE CONTACTS - Microelectronic devices having intermediate contacts, and associated methods of packaging microelectronic devices with intermediate contacts, are disclosed herein. A packaged microelectronic device configured in accordance with one embodiment of the invention includes a microelectronic die attached to an interconnecting substrate. The microelectronic die includes an integrated circuit electrically coupled to a plurality of terminals. Each of the terminals is electrically coupled to a corresponding first contact on the die with an individual wire-bond. Each of the first contacts on the die is electrically coupled to a corresponding second contact on the interconnecting substrate by a conductive coupler such as a solder ball. | 09-09-2010 |
20110233745 | Integrated Circuit Packages - Some embodiments include methods of assembling integrated circuit packages in which at least two different conductive layers are formed over a bond pad region of a semiconductor die, and in which a conductive projection associated with an interposer is bonded through a gold ball to an outermost of the at least two conductive layers. The conductive layers may comprise one or more of silver, gold, copper, chromium, nickel, palladium, platinum, tantalum, titanium, vanadium and tungsten. In some embodiments, the bond pad region may comprise aluminum, an inner of the conductive layers may comprise nickel, an outer of the conductive layers may comprise gold, the conductive projection associated with the interposer may comprise gold; and the thermosonic bonding may comprise gold-to-gold bonding of the interposer projection to a gold ball, and gold-to-gold bonding of the outer conductive layer to the gold ball. Some embodiments include integrated circuit packages. | 09-29-2011 |
20130082384 | MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION TO INTERPOSER SUBSTRATES, AND ASSOCIATED METHODS OF PACKAGING MICROELECTRONIC DEVICES WITH INTERMEDIATE CONTACTS - Microelectronic devices having intermediate contacts, and associated methods of packaging microelectronic devices with intermediate contacts, are disclosed herein. A packaged microelectronic device configured in accordance with one embodiment of the invention includes a microelectronic die attached to an interconnecting substrate. The microelectronic die includes an integrated circuit electrically coupled to a plurality of terminals. Each of the terminals is electrically coupled to a corresponding first contact on the die with an individual wire-bond. Each of the first contacts on the die is electrically coupled to a corresponding second contact on the interconnecting substrate by a conductive coupler such as a solder ball. | 04-04-2013 |