Patent application number | Description | Published |
20080224271 | Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device - Passivation films | 09-18-2008 |
20090174052 | ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE - In a conventional UBM made of, for example, Cu, Ni, or NiP, there has been a problem that when an electronic component is held in high-temperature conditions for an extended period, the barrier characteristic of the UBM is lost and the bonding strength decreases due to formation of a brittle alloy layer at a bonding interface. The present invention improves the problem of decrease in long-term connection reliability of a solder connection portion after storage at high temperatures. An electronic component comprises the electronic component includes an electrode pad formed on a substrate or a semiconductor element and a barrier metal layer formed to cover the electrode pad and the barrier metal layer comprises a CuNi alloy layer on the side opposite the side in contact with the electrode pad, the CuNi alloy layer containing 15 to 60 at % of Cu and 40 to 85 at % of Ni. | 07-09-2009 |
20090302430 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r | 12-10-2009 |
20100048019 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device | 02-25-2010 |
20100144091 | Semiconductor device and method of manufacturing the same - A method of manufacturing a semiconductor device includes forming an interconnect member, mounting a first semiconductor chip having a semiconductor substrate in a face-down manner on the interconnect member, forming a resin layer on the interconnect member to cover a side surface of the first semiconductor chip, thinning the first semiconductor chip and the resin layer, forming an inorganic insulating layer on a back surface of the first semiconductor chip so as to be in contact with the back surface and to extend over the resin layer, and forming a through electrode so as to penetrate the inorganic insulating layer and the semiconductor substrate. | 06-10-2010 |
20110027987 | Method and apparatus for manufacturing semiconductor device - A method for manufacturing a semiconductor device includes forming a laminated structure of a plurality of metal films on a semiconductor substrate using an electroless plating method. The forming of the metal films includes: performing an electroless plating process including a reduction reaction using a first plating tank; and performing an electroless plating process by only a substitution reaction using a second plating tank. The electroless plating process including the reduction reaction that is performed using the first plating tank is performed in a shading environment, and the electroless plating process performed by only the substitution reaction using the second plating tank is performed in a non-shading environment. | 02-03-2011 |
20110101541 | SEMICONDUCTOR DEVICE - A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device | 05-05-2011 |
20120100715 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE - The present invention provides a semiconductor device including at least one of an insulating layer and a semiconductor layer each including a hole formed therein, and a through electrode provided in the hole. In the semiconductor device, the side wall of the hole is constituted of a first region from the opening of the hole to a predetermined position between the opening of the hole and the bottom surface of the hole, and a second region from the predetermined position to the bottom surface of the hole. The through electrode includes a seed layer and a plating layer. The seed layer covers the second region and the bottom surface of the hole without covering the first region. In addition, the plating layer covers the seed layer and at least a part of the first region. | 04-26-2012 |
20120211872 | SEMICONDUCTOR DEVICE - A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device | 08-23-2012 |
20120248602 | SEMICONDUCTOR DEVICE - In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r | 10-04-2012 |
20130234295 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME, WIRING BOARD AND METHOD OF MANUFACTURING SAME, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE - Passivation films | 09-12-2013 |
20140231669 | MICROWAVE ION SOURCE AND METHOD FOR STARTING SAME - A microwave ion source includes a plasma chamber, a magnetic field generator that generates a magnetic field in the plasma chamber, and a control unit that controls the magnetic field generator to apply an initial magnetic field for plasma ignition to the plasma chamber and change the initial magnetic field to a normal magnetic field after the plasma ignition. The plasma chamber may have a vacuum window that receives a microwave, and an ion extraction opening. The initial magnetic field may have a flat magnetic field distribution from the vacuum window to the ion extraction opening. | 08-21-2014 |
Patent application number | Description | Published |
20090123466 | ANTI-CD40 MONOCLONAL ANTIBODY - An antibody or a functional fragment thereof, acting agonistically or antagonistically on CD40. | 05-14-2009 |
20090164840 | System and Method For Managing Root File System - There is provided a system including a cluster | 06-25-2009 |
20100234578 | ANTI-CD40 MONOCLONAL ANTIBODY - An antibody or a functional fragment thereof, acting agonistically or antagonistically on CD40. | 09-16-2010 |
20110076722 | STABLE MULTIVALENT ANTIBODY - The present invention relates to a multivalent antibody comprising multiple heavy chain variable regions of antibody linked to each other via a linker comprising an amino acid sequence encoding an immunoglobulin domain or a fragment thereof. | 03-31-2011 |
20110304029 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS - A terminal pad is formed on an active surface of an LSI chip, and a composite barrier metal layer is provided over this terminal pad. In the composite barrier metal layer, a plurality of low-elasticity particles composed of a silicone resin is dispersed throughout a metal base phase composed of NiP. The composite barrier metal layer has a thickness of, e.g., 3 μm, and the low-elasticity particles have a diameter of, e.g., 1 μm. A semiconductor device is mounted on a wiring board by bonding a solder bump to the composite barrier metal layer. The low-elasticity particles are thereby allowed to deform according to the applied stress when the semiconductor device is bonded to the wiring board via the solder bump, whereby the stress can be absorbed. | 12-15-2011 |
20110315972 | ORGANIC ELECTRONIC ELEMENT AND ITS MANUFACTURING METHOD - The present invention provides an organic electronic element manufacturing method which provides a low manufacturing cost and excellent performance stability, and specifically an organic electronic element manufacturing method which provides a low manufacturing cost, and minimizes emission unevenness, lowering of emission efficiency and shortening of lifetime due to deterioration of as barrier property of sealing. The organic electronic element manufacturing method is featured in that it comprises the steps of forming an organic electronic structure composed of a first electrode, at least one organic layer and a second electrode on a flexible substrate, and applying a flexible sealing substrate to the organic electronic structure, followed by heating treatment, wherein a heating temperature, at which the heating treatment is carried out, is less than Tg (a glass transition temperature) of the substrate and not less than Tg of the sealing substrate. | 12-29-2011 |
20120032157 | COATING METHOD, AND ORGANIC ELECTROLUMINESCENCE ELEMENT - Disclosed are a coating method of forming a coating with a stable thickness from a coating solution with a low viscosity employing a slit-type die coater and an organic electroluminescence element prepared employing the coating method. The coating method employing a slit-type die coater comprises the steps of allowing a lip tip of the slit-type die coater to bring close to the substrate to form a coating solution bead between the lip tip and the substrate, and coating on the substrate a coating solution ejected from a slit outlet at the lip tip while relatively moving the slit-type die coater and the substrate, thereby forming at least two coating layers in the stripe shape, featured in that the lip tip has at least one groove in the coating region in the coating width direction, and a pressure at the slit outlet of the coating solution of the bead is negative or zero. | 02-09-2012 |
20120328623 | ANTI-erbB3 ANTIBODY - The present invention relates to an antibody or an antibody fragment thereof which recognizes an extracellular domain of erbB3 and inhibit EGF-like ligand-dependent phosphorylation of erbB3, a DNA encoding the antibody or the antibody fragment thereof, a method of producing the antibody or the antibody fragment thereof, a therapeutic drug including the antibody or the antibody fragment thereof, and therapeutic application using the antibody or the antibody fragment thereof. | 12-27-2012 |
20140105907 | ANTI-CD40 ANTIBODY MUTANTS - A mutant of a potentially therapeutic anti-CD40 antibody is provided which mutant has reduced ADCC and CDC activities designed to be optimized as a pharmaceutical agent. A mutant of an agonistic anti-CD40 antibody, comprising mutation and/or substitution of at least one amino acid in the constant region to reduce the ADCC and/or CDC activities therein, and a mutant of an antagonistic anti-CD40 antibody, comprising at least one mutation or substitution in the constant region to reduce the ADCC and/or CDC activities therein, both mutants having at least a hinge region derived from a human IgG2. | 04-17-2014 |
20140156305 | DATA MANAGEMENT MECHANISM FOR WIDE-AREA DISTRIBUTED MEDICAL INFORMATION NETWORK - A method distributes and manages medical information on a communication network over a wide area. Encrypted medical information is acquired from one of a plurality of first computers by a second computer connected to the communication network, the plurality of first computers being connected to the communication network, holding identical medical information, encrypting medical information, and sending and receiving encrypted medical information. The second computer decrypts the acquired encrypted medical information, browses and updates decrypted medical information, and then encrypts the browsed and updated medical information. The second computer then sends the encrypted browsed and updated medical information to the plurality of first computers. | 06-05-2014 |
20140156988 | MEDICAL EMERGENCY-RESPONSE DATA MANAGEMENT MECHANISM ON WIDE-AREA DISTRIBUTED MEDICAL INFORMATION NETWORK - A method, system, and/or computer program product provides medical information on a communication network. Encrypted medical information in a decryption request is received from a first computer connected to the communication network at a second computer, the second computer holding decryption information. The second computer determines whether or not the second computer holds decryption information for decrypting the encrypted medical information. In response to the second computer determining that the second computer holds the decryption information, the second computer checks with a third computer as to whether the first computer is authenticated. In response to the first computer being authenticated, the second computer: acquires the encryption information from the third computer; decrypts the encrypted medical information to create decrypted medical information; encrypts the decrypted medical information to create encrypted decrypted medical information; and sends the encrypted decrypted medical information to a sender that has sent the encrypted medical information. | 06-05-2014 |
20140248266 | ANTI-CD40 ANTIBODY MUTANTS - A mutant of a potentially therapeutic anti-CD40 antibody is provided which mutant has reduced ADCC and CDC activities designed to be optimized as a pharmaceutical agent. A mutant of an agonistic anti-CD40 antibody, comprising mutation and/or substitution of at least one amino acid in the constant region to reduce the ADCC and/or CDC activities therein, and a mutant of an antagonistic anti-CD40 antibody, comprising at least one mutation or substitution in the constant region to reduce the ADCC and/or CDC activities therein, both mutants having at least a hinge region derived from a human IgG2. | 09-04-2014 |
20150057437 | ANTI-CD40 ANTIBODY MUTANTS - A mutant of a potentially therapeutic anti-CD40 antibody is provided which mutant has reduced ADCC and CDC activities designed to be optimized as a pharmaceutical agent. A mutant of an agonistic anti-CD40 antibody, comprising mutation and/or substitution of at least one amino acid in the constant region to reduce the ADCC and/or CDC activities therein, and a mutant of an antagonistic anti-CD40 antibody, comprising at least one mutation or substitution in the constant region to reduce the ADCC and/or CDC activities therein, both mutants having at least a hinge region derived from a human IgG2. | 02-26-2015 |
Patent application number | Description | Published |
20080283160 | Bent pipe and a method for its manufacture - A bent pipe corresponding to at least API X100 grade and having a base metal with high strength and toughness and a weld metal with high toughness is provided. A steel plate prepared by cooling after hot rolling at a cooling rate at the central portion in the plate thickness direction of at most 5° C. per second at 700-500° C. is formed into a bend mother pipe, which is then heated to 900-1100° C. and subjected to bending, then it is cooled to a temperature of at most 300° C. at a cooling rate in the central portion of the thickness direction of at least 5° C. per second at 700-500° C., after which it is tempered at 300-500° C. | 11-20-2008 |
20090199612 | Hot bend pipe and a process for its manufacture - A high-strength hot bend pipe which has a balance between an excellent strength of at least X70 grade and toughness and which has excellent tensile properties and a weld metal with excellent low temperature toughness is manufactured. A UOE steel pipe having a base metal with a composition of C: 0.03-0.12%, Si: 0.05-0.50%, Mn: 1.4-2.2%, S: at most 0.01%, Al: at most 0.06%, N: at most 0.008%, and a remainder of Fe and impurities, with the carbon equivalent (Ceq) being at most 0.36% and the weld cracking parameter (Pcm) being at most 0.22%, and having a weld metal with a weld cracking parameter (Pcm) of at most 0.28%, a B content of at most 5 ppm, and an O content of at most 280 ppm is heated to a temperature range of 900-1100° C. and subjected to bending, and then is immediately cooled to a temperature range of 300° C. or lower at a cooling rate of at least 3° C./sec, and then is tempered in a temperature range of 300-500° C. | 08-13-2009 |
20110070457 | High-Strength UOE Steel Pipe Excellent in Deformability and Low-Temperature Toughness of Heat Affected Zone - A high-strength UOE steel pipe which has excellent deformability and excellent low-temperature toughness in its heat affected zone and which is suitable for use in a pipeline installed on permafrost in extremely cold regions or in earthquake-prone regions, for example, is provided. The UOE steel pipe has a steel composition consisting essentially of C: 0.03-0.07%, Si: 0.05-0.50%, Mn: 1.6-2.2%, P: at most 0.020%, S: at most 0.003%, Cu: 0.20-0.60%, Cr: at most 0.10%, Ni: 0.20-0.80%, Nb: 0.005-0.030%, Ti: 0.005-0.030%, N: at most 0.0070%, Al: 0.005-0.060%, and a remainder of Fe and impurities, the hardenability index Pcm is at most 0.22%, Cu+Cr+Ni is 0.4-1.5%, Nb+Mo+V is at most 0.05%. The pipe has a yield strength in the longitudinal direction of at least 480 MPa with a yield-tensile ratio of at most 85% and a Charpy absorbed energy of the heat affected zone at −40° C. of at least 40 J. | 03-24-2011 |
20120121453 | HIC-RESISTANT THICK STEEL PLATE AND UOE STEEL PIPE - A thick steel plate and a UOE steel pipe having a high strength of at least X60 grade and improved resistance to HIC have a chemical composition consisting essentially of, in mass percent, C: 0.02-0.07%, Si: 0.05-0.50%, Mn: 1.1-1.6%, P: at most 0.015%, S: at most 0.002%, Nb: 0.005-0.060%, Ti: 0.005-0.030%, Al: 0.005-0.06%, Ca: 0.0005-0.0060%, N: 0.0015-0.007%, at least one of Cu, Ni, Cr, and Mo in a total amount of greater than 0.1% and less than 1.5%, and a remainder of Fe and impurities, wherein the degrees of segregation of Nb and Ti are both at most 2.0, and the ratio of (the degree of Nb segregation)/(the degree of Mn segregation) and the ratio of (the degree of Ti segregation)/(the degree of Mn segregation) are both at least 1.0 and at most 1.5. | 05-17-2012 |
20120216904 | HIGH-STRENGTH UOE STEEL PIPE EXCELLENT IN DEFORMABILITY AND LOW-TEMPERATURE TOUGHNESS OF HEAT AFFECTED ZONE - A method of making an UOE steel pipe having excellent deformability and low-temperature toughness includes providing a steel composition with a controlled composition consisting essentially of C: 0.03-0.07%, Si: 0.05-0.50%, Mn: 1.6-2.2%, P: at most 0.020%, S: at most 0.003%, Cu: 0.20-0.60%, Cr: at most 0.10%, Ni: 0.20-0.80%, Nb: 0.005-0.030%, Ti: 0.005-0.030%, N: at most 0.0070%, Al: 0.005-0.060%, and a remainder of Fe and impurities, a hardenability index Pcm of at most 0.22%, Cu+Cr+Ni is 0.4-1.5%, and Nb+Mo+V is at most 0.05%. The pipe has a yield strength in the longitudinal direction of at least 480 MPa, a yield-tensile ratio of at most 85% and a Charpy absorbed energy of the heat affected zone at −40° C. of at least 40 J. | 08-30-2012 |
20140144551 | HIGH-STRENGTH STEEL SHEET HAVING IMPROVED RESISTANCE TO FRACTURE AND TO HIC - A high-strength steel sheet having improved HIC resistance and fracture resistance even when it is thick has a chemical composition comprising, in mass %, C: 0.02-0.07%, Si: 0.05-0.50%, Mn: 1.10-1.60%, P: at most 0.015%, S: at most 0.0030%, Nb: 0.005-0.030%, Ti: 0.005-0.020%, Al: 0.005-0.060%, Ca: 0.0005-0.0060%, N: 0.0015-0.0070%, at least one of Cu, Ni, Cr, and Mo in a total of greater than 0.1% to less than 1.5%, and a remainder of Fe and impurities and a steel structure composed of at least 10% by area of bainite and a remainder of ferrite and pearlite. The degree of segregation is less than 1.6 for Nb and less than 1.4 for Mn in the central portion of the thickness of the steel sheet. | 05-29-2014 |
Patent application number | Description | Published |
20090127815 | Tractor - The present invention ensures excellent assembly and maintenance of a machine body. A tractor of the present invention includes a prime mover part, a transmission portion interlockingly connected to a rear portion of the prime mover part, a driver portion arranged above the transmission portion, a lifting mechanism mounted on the transmission portion, wherein a working oil tank for storing a working oil for operating at least the lifting mechanism is arranged below a stepped portion formed on the driver portion in an extending manner. Due to such a constitution, a space which constitutes a dead space can be effectively utilized thus ensuring the excellent assembly and maintenance of the machine body. | 05-21-2009 |
20090127816 | Tractor - The present invention provides a tractor which can easily perform maintenance of a pedal interlocking mechanism. In a tractor which includes a driver portion, a stepped portion mounted on the driver portion in an extending manner, and a pedal interlocking mechanism arranged below the stepped portion, a maintenance-use opening portion is formed in the stepped portion, and the maintenance-use opening portion is closed by an open/close lid body in an openable manner. Due to such a constitution, In maintaining the pedal link mechanism, the lid is opened to expose the opening so that the pedal link mechanism can be easily maintained through the maintenance-use opening from above the stepped portion. | 05-21-2009 |
20090260909 | Assembling Method of Tractor and Tractor - The present invention aims at the shortening of a main line which constitutes an assembly line. To achieve such an object, in the present invention, an assembly line is constituted of a main line and sub lines, and a first unit which is constituted by connecting a clutch part and a transmission part, a second unit which constitutes a prime mover part, a third unit to which a support body and parts such as a handle, pedals, a dashboard, a fuel tank and the like which are supported on the support body are assembled, a fourth unit to which a front support body and parts such as a battery and a radiator which are supported on the front support body are assembled, a fifth unit to which steps, fenders and the like are assembled, and a sixth unit which is a hood are preliminarily assembled on sub lines and, thereafter, the above-mentioned first to sixth units are assembled together on the main line. | 10-22-2009 |
20110038112 | ELECTRONIC PACKAGE, DISPLAY DEVICE, AND ELECTRONIC DEVICE - Provided is a liquid crystal display device ( | 02-17-2011 |
20110038128 | ELECTRONIC PACKAGE, DISPLAY, AND ELECTRONIC DEVICE - An FPC board ( | 02-17-2011 |
20120229384 | DISPLAY DEVICE WITH LOCATION DETECTION FUNCTION AND INPUT LOCATION DETECTION SYSTEM - An input position detection system ( | 09-13-2012 |
Patent application number | Description | Published |
20100171783 | IMAGE RECORDING APPARATUS - An image recording apparatus includes a carrying unit that carries a recording medium in a carrying direction. A recording head records on the recording medium carried by the carrying unit by ejecting ink. An application unit applies a treatment liquid to the recording medium carried by the carrying unit. An inclination correction unit is disposed on a downstream side in the carrying direction from the application unit and an upstream side in the carrying direction from the recording head and corrects an inclination of the recording medium carried by the carrying unit. | 07-08-2010 |
20100171804 | IMAGE RECORDING APPARATUS - An image recording apparatus includes a conveyance unit which includes a conveyance belt and an air suction unit for sucking air through the conveyance belt to adsorb a recording medium onto the conveyance belt. A recording head ejects ink to carry out recording on the recording medium conveyed by the conveyance unit. An adsorption force adjusting unit adjusts the adsorption force for the recording medium on the conveyance belt, which occurs by sucking air, according to the size of the recording medium. | 07-08-2010 |
20100253720 | IMAGE FORMING APPARATUS AND POSITIONING UNIT - According to an example of the invention, an image forming apparatus includes, a head mounting section having a head opposed to a medium, a moving section configured to move a conveying section, which is configured to convey the medium, with respect to the head mounting section to come into contact with and separate from the head mounting section, and a positioning mechanism configured to determine positions of the conveying section and the head mounting section through engagement of a head-side engaging section formed in the head mounting section and a conveying-section-side engaging section formed in the conveying section. | 10-07-2010 |
20110199416 | IMAGE FORMING APPARATUS AND METHOD OF INKJET HAVING HUMIDITY ADJUSTMENT MECHANISM - According to one embodiment, an ink-jet image forming apparatus includes an ink-jet head which ejects water-based ink and form an image on a surface of a recording medium, a medium conveying unit which conveys the recording medium, a solution applying unit arranged further on an upstream side in a recording medium conveying direction than the ink-jet head and which applies water solution to a surface of the recording medium on which an image is formed, and a controller configured to calculate an application amount of the water solution to apply the water solution to the recording medium at 1% to 6% of weight of the recording medium and control an application operation to the recording medium. | 08-18-2011 |
20110199447 | IMAGE FORMING APPARATUS AND DRYING METHOD USED IN IMAGE FORMING APPARATUS - According to one embodiment, an image forming apparatus has an image forming unit, a heat pump, and a blow-out port. The image forming unit forms an image on a medium. The heat pump generates air of a decreased low humidity. The low-humidity air generated by the heat pump is blown from the blow-out port to the medium on which the image is formed by the image forming unit. | 08-18-2011 |
20110199448 | IMAGE FORMING APPARATUS AND DRYING METHOD IN IMAGE FORMING APPARATUS - According to one embodiment, an image forming apparatus includes an image forming unit, a tray, a heating mechanism, a blower, and a body casing. The image forming unit forms an image on an image forming medium. The tray stacks the image forming medium, having an image formed thereon by the image forming unit, on the tray. The heating mechanism warms air. The blower sends out the air warmed by the heating mechanism. The body casing has a discharge opening. The discharge opening is used to discharge the air sent from the blower to the image forming medium stacked on the tray. | 08-18-2011 |
20110290137 | IMAGE FORMING APPARATUS - According to one embodiment, an image recording apparatus includes a printing unit and an entry angle changing mechanism. The entry angle changing mechanism is disposed further along the upstream than the printing unit in a conveying direction and changes the entry angle of the paper with an upper surface not printed and a lower surface printed, after printing on the first surface if printing on both sides is performed by the printing unit. | 12-01-2011 |
20110292103 | IMAGE FORMING APPARATUS AND METHOD OF INKJET HAVING HUMIDITY ADJUSTMENT MECHANISM - According to one embodiment, an inkjet image forming apparatus includes an inkjet head configured to discharge water-based ink and form an image on a surface of a recording medium, a medium conveyance part configured to convey the recording medium, a solution imparting part that is disposed upstream of the inkjet head in a recording medium conveyance direction and uses another inkjet head to impart a solution to the surface of the recording medium on which the image is formed, and a controller configured to calculate an imparting amount of the solution to be imparted to the recording medium and control an imparting operation to the recording medium. | 12-01-2011 |
20110310169 | INKJET HEAD UNIT - According to one embodiment, a maintenance unit includes an inkjet head and a cap. The inkjet head includes plural nozzle arrays and discharges a different color of ink from each of the plural nozzle arrays. The cap includes plural protrusions at positions facing the plural nozzle arrays, includes a groove between the plural protrusions, and tightly closes the plural nozzle arrays with the plural protrusions. | 12-22-2011 |
20110316913 | IMAGE FORMING APPARATUS - According to one embodiment, an image forming apparatus includes a support table, a printing head, and a cleaner. The support table rotates around an axis. The printing head faces the support table. The cleaner includes a web coming into contact with the support table. | 12-29-2011 |
20120069114 | IMAGE FORMING APPARATUS AND IMAGE FORMING METHOD - According to one embodiment, an image forming apparatus includes a retaining roller, a nipping device, a retaining device, an image forming head, and a controller. The retaining roller retains a recording medium and rotates. The nipping device is capable of operating to open and close and holds the recording medium between the nipping device and the surface of the retaining roller to mechanically retain the recording medium. The retaining device retains the recording medium on the surface of the retaining roller. The controller controls, on the basis of a condition for use of the recording medium, the nipping device to nip the recording medium between the nipping device and the surface of the retaining roller. | 03-22-2012 |
20120092431 | RECORDING MEDIUM CARRYING DEVICE, IMAGE FORMING APPARATUS, AND RECORDING MEDIUM CARRYING METHOD - According to one embodiment, an apparatus includes a leading end gripper and a trailing end gripper provided on a drum. The leading end gripper is moved by a leading end gripper driving mechanism. The trailing end gripper switches between a standby position where this gripper is stopped relatively to the rotating drum and a grip position where this gripper rotates with the drum. The leading end gripper and a recording medium pass through an inside of the trailing end gripper stopped in the standby position. If a trailing end of the recording medium reaches the trailing end gripper, the trailing end gripper is released and switches to the grip position. Thus, the trailing end of the medium is held on the drum by the trailing end gripper. The trailing end gripper moves in a rotating direction of the drum while continuing nipping the trailing end of the medium. | 04-19-2012 |
Patent application number | Description | Published |
20090022619 | Steel plate for submerged arc welding - A steel plate for submerged arc welding having good low temperature toughness at a fusion line vicinity part and a boundary with the base material in HAZ as well as at the base material and the weld metal is provided. The steel plate for submerged arc welding according to the invention contains, by mass, 0.03% to 0.09% C, 1.5% to 2.5% Mn, 0.005% to 0.025% Nb, 0.005% to 0.02% Ti, 0.01% to 0.06% Al, at most 0.0005% B, 0.001% to 0.008% N, at most 0.015% P, at most 0.015% S, and at most 0.006% O, and the balance consists of Fe and impurities. Therefore, the steel plate according to the present invention has good low temperature toughness not only at the fusion line vicinity part and the boundary with a base material in the HAZ but also in the base material and weld metal. | 01-22-2009 |
20090297872 | High-Tensile Steel Plate, Welded Steel Pipe or Tube, and Methods of Manufacturing Thereof - In a high-tensile steel plate according to the invention, the carbon equivalent Pcm represented in Expression (1) is from 0.180% to 0.220%, the surface hardness is a Vicker's hardness of 285 or less, the ratio of a Martensite Austenite constituent in the surface layer is not more than 10%, the ratio of a mixed structure of ferrite and bainite inside beyond the surface layer is not less than 90%, the ratio of the bainite in the mixed structure is not less than 10%, the thickness of the lath of bainite is not more than 1 μm, the length of the lath is not more than 20 μm, and the segregation ratio as the ratio of the Mn concentration in the center segregation part relative to the Mn concentration at a part in a depth equal to ¼ of the thickness of the plate from the surface is not more than 1.3. Pcm=C+Si/30+(Mn+Cu+Cr)/20+Ni/60+Mo/15+V/10+5B . . . (1) where the element symbols in Expression (1) represent the % by mass of the respective elements. In this way, the high-tensile steel plate according to the invention has a yield strength of at least 551 MPa and a tensile strength of at least 620 MPa as well as high toughness, high propagating shear fracture and high weldability. | 12-03-2009 |
20130170575 | SERIAL DATA COMMUNICATION METHOD AND SERIAL DATA COMMUNICATION DEVICE - A master device and slave devices are connected with each other through an SDA and an SCL, and at least one of a serial communication data signal communicated through the SDA and a serial communication clock signal communicated through the SCL is latched with use of a noise removal clock signal whose frequency is higher than that of the serial communication clock signal, and is taken in. | 07-04-2013 |
Patent application number | Description | Published |
20120252147 | METHOD OF MANUFACTURING ORGANIC ELECTROLUMINESCENCE ELEMENT - A method of manufacturing an organic electroluminescence element having on a belt-formed flexible base material, a first electrode, at least one organic functional layer, and a second electrode, includes continuously forming at least one organic functional layer by coating the same on a first electrode which is formed continuously on the flexible base material in the conveying direction thereof, further forming a second electrode on the organic functional layer, so as to make a plurality of organic electroluminescence element structures in the conveying direction, and then cutting the electroluminescence element structures into individual organic electroluminescence elements so as to manufacture organic electroluminescence elements. | 10-04-2012 |
20130026910 | MANUFACTURING METHOD FOR ORGANIC ELECTROLUMINESCENT PANEL AND ORGANIC ELECTROLUMINESCENT PANEL MANUFACTURED USING THE SAME - A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order. | 01-31-2013 |
Patent application number | Description | Published |
20130255212 | HONEYCOMB STRUCTURE - In the present invention, a honeycomb structure includes a joined honeycomb segment body in which a plurality of honeycomb segments are integrally joined by mutual joining surfaces via a joining material layer, and has a configuration in which a plurality of cells to become through channels of a fluid are arranged in parallel with one another along a central axis direction. The joining material layer contains, as aggregates, inorganic particles, and acicular crystal particles having a shot content ratio smaller than 10 mass %, and the acicular crystal particles include 80 mass % or more of acicular crystal particles having an average length of 20 to 500 μm in a long axis direction of the acicular crystal particles. As the inorganic particles, silicon carbide, cordierite, alumina, zirconia, yttria or the like can be used, and as natural acicular minerals, sepiolite, wollastonite, palygorskite or the like can be used. | 10-03-2013 |
20130316130 | HONEYCOMB STRUCTURE BODY - There is disclosed a honeycomb structure body having joining material layers of a stress relaxing function and joining strength equivalent to those of joining material layers of a conventional honeycomb structure body, and having an excellent heat shock resistance. A honeycomb structure body includes a plurality of honeycomb segments and joining material layers having a plurality of pores and joining the plurality of honeycomb segments in a state where the honeycomb segments are arranged adjacent to each other so that side surfaces of the honeycomb segments face each other. A ratio of the number of pores having a value of 1.2 or less which is obtained by dividing a maximum diameter of each of the pores by a minimum diameter of the each of the pores is 60% or more of the number of all the pores of each of the joining material layers. | 11-28-2013 |