Patent application number | Description | Published |
20080282537 | Wiring forming method of printed circuit board - The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating. | 11-20-2008 |
20100101370 | COMPOSITE NICKEL PARTICLES AND A PREPARING METHOD THEREOF - Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics. | 04-29-2010 |
20100108952 | Core-shell structure metal nanoparticles and its manufacturing method thereof - Metal nanoparticles, containing a copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur. | 05-06-2010 |
20100171064 | NANOPARTICLES, CONDUCTIVE INK AND CIRCUIT LINE FORMING DEVICE - A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration. | 07-08-2010 |
20100271432 | Nanoparticles, conductive ink and circuit line forming device - A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines. | 10-28-2010 |