Takahiro Kumakawa
Takahiro Kumakawa, Souraku-Gun JP
Patent application number | Description | Published |
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20080203538 | Semiconductor wafer with division guide pattern - A plurality of semiconductor elements and division regions are provided on a semiconductor subsubstrate. A modification region is provided in the semiconductor substrate. A division guide pattern is provided at least in a portion of each division region. A cleavage produced from a starting point corresponding to the modification region is guided by the division guide pattern. | 08-28-2008 |