Patent application number | Description | Published |
20080258306 | Semiconductor Device and Method for Fabricating the Same - The present invention provides a semiconductor device and a method for fabricating the same. The semiconductor device includes a chip having an active surface and an opposing non-active surface, wherein a plurality of bond pads are formed on the active surface, and first metal layers are formed on the bond pads and to edges of the non-active surface; conductive traces disposed on the non-active surface of the chip; a dielectric layer covering sides of the chip and formed with a plurality of openings therein to expose a portion of the conductive traces; and a plurality of second metal layers formed in the openings of the dielectric layer and on the first metal layers, such that the bond pads are electrically connected to the conductive traces via the first and second metal layers. | 10-23-2008 |
20130059418 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE DEVICE, AND FABRICATION METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer. | 03-07-2013 |
20150041972 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is disclosed, which includes: a first substrate; a first semiconductor component disposed on the first substrate; a second substrate disposed on the first semiconductor component and electrically connected to the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate and encapsulating the first semiconductor component and the conductive elements. The present invention can control the height and volume of the conductive elements since the distance between the first substrate and the second substrate is fixed by bonding the second substrate to the first semiconductor component. | 02-12-2015 |
20150123287 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE AND PACKAGING STRUCTURE - A method for fabricating a semiconductor package is disclosed, which includes the steps of: providing a first substrate; disposing a second substrate on the first substrate through a plurality of supporting elements, wherein the second substrate has at least a cleaning hole penetrating therethrough; and performing a cleaning process to clean space between the second substrate and the first substrate through the cleaning hole, thereby preventing a popcorn effect from occurring when the first substrate is heated and hence preventing delamination of the semiconductor package. Further, the cleaning hole facilitates to disperse thermal stresses so as to prevent warping of the first and second substrates during a chip-bonding or encapsulating process, thereby overcoming the conventional drawbacks of cracking of the supporting elements and a short circuit therebetween. | 05-07-2015 |
20150187722 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture. | 07-02-2015 |
20150187741 | PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween. | 07-02-2015 |
20150200169 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A method for fabricating a semiconductor package is provided, which includes the steps of: providing a first substrate having a plurality of first conductive posts on a surface thereof and providing a second substrate having a third surface having a chip disposed thereon and a fourth surface opposite to the third surface; disposing the first substrate on the third surface of the second substrate through the first conductive posts; forming an encapsulant between the first substrate and the second substrate, wherein the encapsulant has a first surface adjacent to the first substrate and a second surface opposite to the first surface; and removing the first substrate, thereby effectively preventing solder bridging from occurring. | 07-16-2015 |
20150255360 | PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A package on package (PoP) structure is provided, which includes: a packaging substrate having a plurality of conductive bumps, wherein each of the conductive bumps has a metal ball and a solder material covering the metal ball; and an electronic element having a plurality of conductive posts, wherein the electronic element is stacked on the packaging substrate by correspondingly bonding the conductive posts to the conductive bumps, and each of the conductive posts and the corresponding conductive bump form a conductive element. The present invention facilitates the stacking process through butt joint of the conductive posts and the metal balls of the conductive bumps. | 09-10-2015 |
Patent application number | Description | Published |
20140231972 | MULTI-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided. | 08-21-2014 |
20150123251 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed, which includes: a packaging structure having at least a semiconductor element; and at least three shielding layers sequentially stacked on the packaging structure so as to cover the semiconductor element, wherein a middle layer of the shielding layers is lower in electrical conductivity than adjacent shielding layers on both sides of the middle layer, thereby reducing electromagnetic interferences so as to increase the shielding effectiveness. | 05-07-2015 |
20150162661 | ELECTRONIC COMPONENT - An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component. | 06-11-2015 |
Patent application number | Description | Published |
20140367849 | INTERPOSER AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an interposer is provided, including forming a plurality of first openings on one surface side of a substrate, forming a first metal layer in the first openings, forming on the other surface side of the substrate a plurality of second openings that are in communication with the first openings, forming a second metal layer in the second openings, and electrically connecting the first metal layer to the second metal layer, so as to form conductive through holes. The conductive through holes are formed stage by stage, such that the fabrication time in forming the metal layers is reduced, and a metal material will not be accumulated too thick on a surface of the substrate. Therefore, the metal material has a smoother surface, and no overburden will be formed around end surfaces of the through holes. An interposer is also provided. | 12-18-2014 |
20160049359 | INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOF - An interposer is provided, including a substrate body, a plurality of conductive posts formed in the substrate body, and a plurality of conductive pads formed on the substrate body and electrically connected to the conductive posts. The conductive pads and the conductive posts are integrally formed. As such, no interface is formed between the conductive pads and the conductive posts, thereby preventing delamination or cracking from occurring between the conductive pads and the conductive posts. | 02-18-2016 |
20160066427 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a recess; disposing an electronic element in the recess of the carrier; forming an insulating layer in the recess to encapsulate the electronic element; forming a circuit structure on the carrier, wherein the circuit structure is electrically connected to the electronic element; forming a plurality of through holes penetrating the carrier; and forming a conductive material in the through holes to form a plurality of conductors, wherein the conductors are electrically connected to the circuit structure. By using the carrier as a substrate body, the present invention avoids warping of the package structure. | 03-03-2016 |
20160086903 | SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor structure and a method of fabricating the same. The semiconductor structure includes a carrier, a semiconductor chip and an encapsulant. The semiconductor chip is disposed on the carrier, and has opposing non-active and active surfaces. The non-active surface is coupled to the carrier, and the active surface has a plurality of metallic pillars formed thereon. A under bump metallogy layer is formed between the metallic pillars and the active surface and on side surfaces of the metal pillars. The surface of the encapsulant is flush with end surfaces of the metallic pillars. Therefore, the product yield is increased significantly. | 03-24-2016 |
Patent application number | Description | Published |
20090085396 | TOOL HOLDING DEVICE - A tool holding device is disclosed, and the tool holding device includes a base, a block, and a fastening member for securing the block. The base includes a receiving portion defined between a countering wall and a shoulder wall, a surface defined adjacent to the shoulder wall perpendicularly and away from the countering wall, a penetrated hole defined on the countering wall, and a positioning hole communicating with the penetrated hole. The block includes a holding portion held in the receiving portion, a handle received in the penetrated hole, and a holding hole for holding a chisel. The countering wall and the shoulder wall define an angle less than or equal to 90 degrees. Therefore, the counterforce bearing of the base and block are both enhanced to raise the strength of the tool holding device. | 04-02-2009 |
20090267408 | Track shoe for caterpillar vehicle - A track shoe fastened on a chain of the caterpillar vehicle includes a body and a buffer block. The body includes an first surface adjacent to the chain, a second surface opposite to the first surface, a third surface, a fourth surface opposite to the third surface, a groove defined on the second surface and through the third surface and the fourth surface, and the holes defined through the first surface and the second surface to communicate with the groove. The buffer block includes an embedded portion capable of being embedded within the groove of the body, and multiple lock holes defined through the buffer block to respectively communicate with the holes of the body. The buffer block is secured on the body through the embedment between the embedded portion and the groove, and secured on the chain by the fastening members within the holes and the lock holes. | 10-29-2009 |
20130175848 | CUTTING TOOL HOLDING DEVICE - A cutting tool holding device includes a base, a cutting tool holder and a fastening member. The base includes an abutting portion and a transverse dovetail groove, wherein the abutting portion is defined between a first wall with a mounting surface and a second wall, and the transverse dovetail groove is formed on the mounting surface. The cutting tool holder has a transverse dovetail portion, wherein the cutting tool holder is abutted against the abutting portion, and the transverse dovetail portion is detachably engaged into the transverse dovetail groove on the mounting surface of the second wall. The fastening member is for fastening the cutting tool holder to the base. | 07-11-2013 |
20130207444 | CUTTING TOOL HOLDING DEVICE - A cutting tool holding device includes a base, a positioning tube and a positioning member. The base includes a mounting hole and a through hole, and the through hole is formed at a side of the mounting hole and communicated with the mounting hole. The positioning tube includes an axial receiving hole, an accommodated portion and a limiting groove. The axial receiving hole is formed within the positioning tube for receiving a cutting tool. The accommodated portion is disposed at an end of the positioning tube for being installed into the mounting hole. The limiting groove is formed on a side of the accommodated portion. The positioning member is positioned in the through hole of the base, wherein the positioning member abuts against the limiting groove of the positioning tube. | 08-15-2013 |
Patent application number | Description | Published |
20110178167 | METHOD FOR INHIBITING ACTIVITY AND/OR EXPRESSION OF MATRIX METALLOPROTEINASE, INHIBITING PHOSPHORYLATION OF MITOGEN-ACTIVATED PROTEIN KINASE, AND/OR PROMOTING EXPRESSION OF COLLAGEN USING TERMINALIA CATAPPA LEAF EXTRACT - A method for inhibiting the activity of matrix metalloproteinase (MMP), inhibiting the expression of matrix metalloproteinase, inhibiting the phosphorylation of mitogen-activated protein kinase (MAPK), and/or promoting the expression of collagen in a mammal is provided, and the method comprises administrating an effective amount of a | 07-21-2011 |
20110293758 | METHOD FOR ANTI-OXIDATION, INHIBITING ACTIVITY AND/OR EXPRESSION OF MATRIX METALLOPROTEINASE, AND/OR PROMOTING EXPRESSION OF COLLAGEN USING IXORA PARVIFLORA LEAF EXTRACT - A method for anti-oxidation, inhibiting the activity of matrix metalloproteinase (MMP), inhibiting the expression of matrix metalloproteinase, and/or promoting the expression of collagen in a mammal is provided, and the method comprises administrating an effective amount of an | 12-01-2011 |
20120148694 | METHOD FOR ANTI-OXIDATION, INHIBITING ACTIVITY AND/OR EXPRESSION OF MATRIX METALLOPROTEINASE, AND/OR INHIBITING PHOSPHORYLATION OF MITOGEN-ACTIVATED PROTEIN KINASE USING NEONAUCLEA RETICULATA LEAF EXTRACTS - A method of inhibiting at least one selected from the group consisting of oxidation, the activity of matrix metalloproteinase (MMP), the expression of matrix metalloproteinase, and the phosphorylation of mitogen-activated protein kinase (MAP kinase) in a mammal, comprising administrating to the mammal an effective amount of a | 06-14-2012 |
Patent application number | Description | Published |
20080295663 | Cutting mechanism with adjustable position operating handle - A cutting mechanism includes a guard, a saw blade mounted within the guard, a motor for rotating the saw blade to cut a workpiece, and a handle unit. The handle unit includes an operating handle that has a first end and a second end connected to the first end, the first end of the operating handle being pivotally positioned along the top side of the guard in one of a number of positions including an initial position where a line between the first end and second end of the operating handle is kept in parallel to said saw blade, a left position 90-degrees leftwards from the initial position and a right position 90-degrees rightwards from the initial position. | 12-04-2008 |
20110259165 | Saw machine riving knife adjustment mechanism - A saw machine riving knife adjustment mechanism includes a locating frame, which has a slot, a riving knife, which has a longitudinal slot with at least one notch formed along one side of the longitudinal slot, and which is detachably mounted on the locating frame, a biasing member, which is mounted on the locating frame, and a locking member, which is inserted through the longitudinal slot of the riving knife and the slot of the locating frame. The locking member is biased by the biasing member to a locking position where the locking member is engaged with the at least one notch to lock the riving knife in position. | 10-27-2011 |
20120159763 | SAW BLADE GUARD QUICK RELEASE STRUCTURE AND METHOD FOR LOCKING AND UNLOCKING SAW BLADE GUARD - A saw blade guard quick release structure and a method for locking and unlocking saw blade guard includes a locating member, a connection member, and a retaining unit. The locating member has two retaining notches. The connection member includes a first guide portion and a second guide portion. The retaining unit is installed on the connection member, including a linking member, a drag member movable along the first guide portion, two retaining members respectively pivotally connected to the drag member and movable along the second guide portion, and a spring member. The method includes mounting the connection member directly on the locating member and selectively engaging the retaining members with the locating notches, thereby locking or unlocking the saw blade guard. | 06-28-2012 |
20140250704 | LASER ALIGNMENT DEVICE FOR CIRCULAR SAW - A laser alignment device for a circular saw includes a base located on a blade guard of the circular saw, and a laser module mounted at the base. The laser module includes a retaining seat pivotally connected to the base, an auxiliary seat mounted at the retaining seat, and a laser beam generator installed in the auxiliary seat. A first adjusting unit includes a first knob and a first eccentric shaft connected to the first knob and coupled to a first elongated slot in the retaining seat for allowing adjustment of the angle of inclination of the laser beam generator by rotating the first knob. A second adjusting unit includes a second knob and a second eccentric shaft connected to the second knob and coupled to a second elongated slot in the auxiliary seat for allowing adjustment of the angular position of the laser beam generator by rotating the second knob. | 09-11-2014 |
Patent application number | Description | Published |
20120240341 | Combination Tool - A combination tool includes a handle having an enlarged head used as a striking tool, and having a chamber formed in the head for rotatably receiving a follower, and a pawl pivotally attached to the handle and having two engaging members for selectively engaging with the follower and for determining a rotational movement of the follower relative to the handle and for forming a ratchet wrench tool, and a tool member changeably disposed on the other end portion of the handle for conducting various kinds of works, a spring-biased projection is engaged in the handle and biased to engage with the pawl for anchoring either of the engaging members in engagement with the follower. | 09-27-2012 |
20130319188 | TOOL HOLDER DEVICE - A tool holder device includes a number of slots formed in a housing, a receptacle having two conduits perpendicular to each other, the housing has an end portion engaged into one of the conduits, a spindle is rotatably engaged in the housing, a shaft is rotatably engaged in the receptacle and has a bevel gear meshed with a bevel gear of the spindle, a barrel is attached onto the housing and has two ears, a handle has a cam member pivotally mounted to the ears of the barrel, the cam member is engageable with either of the slots of the housing for anchoring the handle and the barrel to the housing at selected angular positions when the handle is pivoted relative to the housing to the perpendicular working position. | 12-05-2013 |
20140165794 | FASTENER HOLDER FOR POWER TOOL - A fastener holder includes a driving tool stem having a number of orifices, a driving tool shank engaged in the stem for engaging with a tool element and having a number of depressions formed in the shank, a number of bearing members engaged in the orifices of the stem for engaging with the depressions of the shank and for selectively anchoring the shank to the stem, and a barrel includes a relatively smaller segment for selectively engaging with the bearing members and for forcing the bearing members to engage into the depressions of the shank and to anchor and lock the driving shank to the stem and for allowing the driving shank and the tool element to be selectively rotated and driven by the stem. | 06-19-2014 |
20140260818 | ADJUSTABLE WRENCH DEVICE - An adjustable wrench device includes a housing engaged in a head and having an internal gear, a rotary member engaged in the housing, a sleeve attached to the housing and engaged with the rotary member for confining the rotary member in the housing, the sleeve includes an opening having two spirally arranged cam surfaces and having two or more pairs of depressions, two jaw members are engaged with the rotary member and moveable toward and away from each other to engage with either pair of depressions for adjusting the spacing distance between the jaw members and for adjustably gripping bolt heads or nuts or fittings of different sizes or dimensions or diameters. | 09-18-2014 |
Patent application number | Description | Published |
20140021591 | EMI SHIELDING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR STACK STRUCTURE - A semiconductor element is provided, including: a substrate having a plurality of first conductive through holes and second conductive through holes formed therein; a redistribution layer formed on the substrate and having a plurality of conductive pads electrically connected to the first conductive through holes; and a metal layer formed on the redistribution layer and electrically connected to the second conductive through holes. The metal layer further has a plurality of openings for the conductive pads of the redistribution layer to be exposed from the openings without electrically connecting the first metal layer. As such, the metal layer and the second conductive through holes form a shielding structure that can prevent passage of electromagnetic waves into or out of the redistribution layer or side surfaces of the semiconductor element, thereby effectively shield electromagnetic interference. | 01-23-2014 |
20140231972 | MULTI-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided. | 08-21-2014 |
20150137337 | SEMICONDUCTOR PACKAGE AND LEAD FRAME - A semiconductor package is disclosed, which includes: a die paddle portion; a plurality of conductive portions circumventing the die paddle portion; a power bus bar and a ground bus bar formed around the periphery of the die paddle portion; a semiconductor element attached to the die paddle portion and electrically connected to the conductive portions, the power bus bar, and the ground bus bar by a plurality of bonding wires; and an encapsulant encapsulating the semiconductor element and the bonding wires. The ground bus bar extends outward along the power bus bar and is mutually configured with the power bus bar so as to reduce the loop inductance and resistance of the power bus bar while in use. | 05-21-2015 |
Patent application number | Description | Published |
20100175241 | Method of continuously mounting clips to two abutted and crossed rods - A method of continuously mounting clips to first and second rods, which are abutted and crossed with each other, includes the steps of a) providing a clip dispensing gun; b) providing clips each having a first rod clipping portion fittable with the first rod and a second rod clipping portion fittable with the second rod; c) loading clips into a clip guiding portion of the clip dispensing gun; d) pushing one of the clips by a clip feeding member of the clip dispensing gun to advance one clip to a ready-to-be-fired position, and e) ejecting the clip in the ready-to-be-fired position out of the clip dispensing gun by using a striker of the clip dispensing gun for enabling first and second rod clipping portions of the ejected clip to be fitted with the first and second rods respectively. | 07-15-2010 |
20110315738 | FASTENER FEEDING DEVICE FOR A DRIVING TOOL - A fastener feeding device for repeatedly feeding fasteners into a striking path of a driving tool includes an uplifting unit having a pivotable member which is pivotable about a torsion axis parallel to the striking path and movable in a feeding direction, a claw member which is biased by a torsion spring to hold a second fastener during an upward movement of the fasteners when the pivotable member is displaced from a lower position to an upper position, and a lifting member which extends transversely. A force transmitting unit is disposed to couple a contact arm of the driving tool to the lifting member to effect the upward movement of the fasteners in response to a rearward displacement of the contact arm when the contact arm is pressed by a targeted object to be fastened. | 12-29-2011 |
20140026409 | Bar Connecting Apparatus and a String of Clips Usable Therewith - A bar connecting apparatus is used for firing a string of clips one at a time to connect two intersecting bars together. The bar connecting apparatus includes: a main body having a front end portion formed with an ejection opening; a driving unit including a hammer disposed in the main body, and a drive disposed in the main body for reciprocating the hammer; and a magazine unit including a magazine connected to the main body and adapted for storing the clips, and a clip pushing device for pushing one of the clips into the ejection opening so that a portion of the one of the clips extends outwardly from the main body through the ejection opening. | 01-30-2014 |
20140361066 | NAIL MAGAZINE FOR A POWER NAIL-DRIVING TOOL - A nail magazine for a power nail-driving tool includes an elongated magazine unit and a leaf spring unit which includes an elongated body and first and second guiding members. The elongated body has a rearward end fixed to the elongated magazine, and a forward end which is movable between a blocking position and a yielded position. The first guiding member has a barrier shoulder configured to block loading movement of a nail strip when the nail strip is loaded in a wrong orientation. The second guiding member has a ramp-up region configured to permit the nail strip to depress the forward end to the yielded position when the nail strip is loaded in a correct orientation. | 12-11-2014 |
Patent application number | Description | Published |
20140166750 | Sights and Methods of Operation Thereof - A sight and methods of operation thereof are provided. In some embodiments, an image is captured via an image capture unit, and a center position is calculated according to the positions of at least three impact points in the image, and a predefined view center of a display unit is set to the center position. In some embodiments, an angle of dip of the sight to a plane is detected via a dip angle detector. A predictive impact point is calculated according to the angle of dip and at least one calculation parameter, and an impact point indication is accordingly displayed in the display unit. When the angle of dip is changed, the predictive impact point is recalculated according to the new angle of dip, and the corresponding impact point indication is displayed. | 06-19-2014 |
20150069121 | Sights and Methods of Operation Thereof - A sight and methods of operation thereof are provided. In some embodiments, an image is captured via an image capture unit, and a center position is calculated according to the positions of at least three impact points in the image, and a predefined view center of a display unit is set to the center position. In some embodiments, an angle of dip of the sight to a plane is detected via a dip angle detector. A predictive impact point is calculated according to the angle of dip and at least one calculation parameter, and an impact point indication is accordingly displayed in the display unit. When the angle of dip is changed, the predictive impact point is recalculated according to the new angle of dip, and the corresponding impact point indication is displayed. | 03-12-2015 |