Patent application number | Description | Published |
20080203424 | DIODE AND APPLICATIONS THEREOF - A diode with low substrate current leakage and suitable for BiCMOS process technology. A buried layer is formed on a semiconductor substrate. A connection region and well contact the buried layer. Isolation regions are adjacent to two sides of the buried layer, each deeper than the buried layer. The isolation regions and the buried layer isolate the connection zone and the well from the substrate. The first doped region in the well is a first electrode. The well and the connection region are electrically connected, acting as a second electrode. | 08-28-2008 |
20080232013 | High-Voltage Tolerant Power-Rail ESD Clamp Circuit for Mixed-Voltage I/O Interface - A circuit for electrostatic discharge (ESD) protection includes a resistor a capacitor connected in series with the resistor, a first transistor including a gate, the gate being connected to a first power supply providing a first voltage to the gate via the resistor and a first terminal connected to the first power supply, a second transistor including a gate, the gate being connected to a second power supply, the second power supply providing a second voltage smaller than the first voltage, the second transistor having a first terminal connected to a second terminal of the first transistor, and a third transistor including a gate, the gate being connected to the second power supply, a first terminal of the third transistor being connected to a second terminal of the second transistor, and a second terminal being connected to a reference voltage different from the first voltage and the second voltage. | 09-25-2008 |
20090002028 | MIXED-VOLTAGE I/O BUFFER TO LIMIT HOT-CARRIER DEGRADATION - A Mixed-voltage input and output (I/O) buffer including a pre-driver unit, a bulk-voltage generating unit, a first to a third transistors and an input stage unit is provided. The pre-driver unit outputs a first source/drain and a second signal. The bulk-voltage generating unit determines whether a first voltage or a pad voltage is used as a bulk voltage according to the pad voltage level. A gate of the first transistor receives the first signal, and a bulk, a first source/drain and a second source/drain of the first transistor are respectively coupled to the bulk voltage, the first voltage and the pad. A gate of the third transistor receives the second signal, and a first source/drain and a second source/drain of the third transistor are respectively coupled to the input stage unit for receiving an input signal from the pad and a second voltage. | 01-01-2009 |
20090009229 | HIGH/LOW VOLTAGE TOLERANT INTERFACE CIRCUIT AND CRYSTAL OSCILLATOR CIRCUIT - A high/low voltage tolerant interface circuit and a crystal oscillator circuit using the same are provided herein. The interface circuit includes a first transistor, a bulk-voltage generator module and an bias module. The first transistor includes a gate, a first source/drain, a bulk coupled to the first source/drain of the first transistor and a second source/drain coupled to an input node. The bulk-voltage generator module is, used to determine whether a first voltage or a predetermined voltage is being provided to the bulk of the first transistor according to the voltage of the input node. The bias module is coupled to the gate of the first transistor. The bias module is used to provide an bias voltage to the gate of the first transistor and makes the first transistor conduct in order to control the voltage of the second source/drain voltage of the first transistor. | 01-08-2009 |
20090009916 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE FOR MIXED VOLTAGE INTERFACE - An electrostatic discharge protection circuit that includes at least two transistors connected in a stacked configuration, a first diffusion region of a first dopant type shared by two adjacent transistors, and a second diffusion region of a second dopant type formed in the first diffusion region. A substrate-triggered site is induced into the device structure of the stacked transistors to improve ESD robustness and turn-on speed. An area-efficient layout to realize the stacked transistors is proposed. The stacked transistors may be implemented in ESD protection circuits with a mixed-voltage I/O interface, or in integrated circuits with multiple power supplies. The stacked transistors are fabricated without using a thick-gate mask. | 01-08-2009 |
20090086392 | POWER-RAIL ESD PROTECTION CIRCUIT WITHOUT LOCK-ON FAILURE - An ESD protection circuit including a discharge device, a first detection circuit, and a second detection circuit. The discharge device provides a discharge path between a first power rail and a second power rail when the discharge device is activated. The discharge device stops providing the discharge path when the discharge device is de-activated. The first detection circuit is coupled between the first and the second power rails. The first detection circuit activates the discharge device when an ESD event occurs in the first power rail. The second detection circuit de-activates the discharge device when the ESD event does not occur in the first power rail. | 04-02-2009 |
20090167663 | Liquid Crystal Display Apparatus and Bandgap Reference Circuit Thereof - A liquid crystal display apparatus comprises a system-on-glass (SOG) and a bandgap reference (BGR) circuit. The BGR circuit, which is formed on the SOG, comprises a current mirror set and a diode set. The current mirror set is configured to generate a plurality of fixed currents. The diode set, which is formed by a plurality of diode-connected thin film transistors (TFT), is configured to generate a BGR voltage according to the fixed currents. | 07-02-2009 |
20090187361 | TRANSIENT DETECTION CIRCUIT FOR ESD PROTECTION - A transient detection circuit including a detecting unit, a setting unit, and a memory unit. The transient detection circuit provides an information signal to an external instrument when an electrostatic discharge (ESD) event occurs. The detecting unit is coupled between a first power line and a second power line for detecting the ESD event. The setting unit sets a level of a first node according to the detection result. The memory unit controls the information signal according to the level of the first node. The information signal is at a first level when the ESD event occurs in the first power line. | 07-23-2009 |
20090195269 | INPUT STAGE FOR MIXED-VOLTAGE-TOLERANT BUFFER WITH REDUCED LEAKAGE - A mixed-voltage buffer circuit coupled between a first circuit operative at a first power supply voltage and a second circuit operative at a second power supply voltage. The buffer circuit is connectable to the second power supply voltage and a third power supply voltage and includes an input circuit coupled to the first circuit through a first node and to the second circuit through a second node. The input circuit includes a first part coupled to the first node and an inverter coupled to the second node. The first part provides a signal having a voltage level approximately equal to the third power supply voltage to the inverter in response to a first signal on the first node, and provides a signal having a voltage level approximately equal to the second power supply voltage to the inverter in response to a second signal on the first node. | 08-06-2009 |
20090231765 | TRANSIENT TO DIGITAL CONVERTERS - A digital converter including a first adjustment unit and a first transient detection unit. The first adjustment unit adjusts amplitude of an electrostatic discharge (ESD) pulse to generate a first adjustment signal when an ESD event occurs in a first power line and a second power line is at a complementary level. The first transient detection unit generates a first digital code according to the first adjustment signal. | 09-17-2009 |
20090267584 | TRANSIENT DETECTION CIRCUIT - A transient detection circuit coupled between a first power line and a second power line and including a first control unit, a setting unit, and a voltage regulation unit. The first control unit generates a first control signal. The first control signal is at a first level when an electrostatic discharge (ESD) event occurs. The first control signal is at a second level when the ESD event does not occur. The setting unit sets a first node. The first node is set at the second level when the first control signal is at the first level. The voltage regulation unit regulates the first node. The voltage regulation unit regulates the level of the first node at the second level when the first control signal is at the second level. | 10-29-2009 |
20100033164 | TRANSIENT NOISE DETECTION CIRCUIT - A transient noise detection circuit for detecting a level of a transient noise voltage is disclosed. The transient noise detection circuit comprises a triggering circuit, a rectifying circuit, and a controller. The triggering circuit is coupled between a power rail and a ground node. When the triggering circuit receives a transient noise, the triggering circuit generates a triggering signal. The rectifying circuit comprises a rectifying unit and a current-limiting unit coupled in series. When the rectifying unit receives the triggering signal from the triggering circuit, the rectifying unit will be triggered by the triggering signal. The controller is coupled to a detection node between the rectifying unit and the current-limiting unit. The controller is used for determining the level of the transient noise voltage based on the voltage of the detection node. | 02-11-2010 |
20110013326 | INITIAL-ON SCR DEVICE FOR ON-CHIP ESD PROTECTION - A semiconductor device for electrostatic discharge (ESD) protection comprises a silicon controlled rectifier (SCR) including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, a first p-type region formed in the first well to serve as an anode, and a first n-type region partially formed in the second well to serve as a cathode, a p-type metal-oxide-semiconductor (PMOS) transistor formed in the first well including a gate, a first diffused region and a second diffused region separated apart from the first diffused region, a second n-type region formed in the first well electrically connected to the first diffused region of the PMOS transistor, and a second p-type region formed in the substrate electrically connected to the second diffused region of the PMOS transistor. | 01-20-2011 |
20110294253 | POLYDIODE STRUCTURE FOR PHOTO DIODE - An integrated circuit device for converting an incident optical signal into an electrical signal comprises a semiconductor substrate, a well region formed inside the semiconductor substrate, a dielectric layer formed over the well region, and a layer of polysilicon for receiving the incident optical signal, formed over the dielectric layer, including a p-type portion, an n-type portion and an undoped portion disposed between the p-type and n-type portions, wherein the well region is biased to control the layer of polysilicon for providing the electrical signal. | 12-01-2011 |
20120080716 | INITIAL-ON SCR DEVICE FOR ON-CHIP ESD PROTECTION - A semiconductor device for electrostatic discharge (ESD) protection comprises a silicon controlled rectifier (SCR) including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, a first p-type region formed in the first well to serve as an anode, and a first n-type region partially formed in the second well to serve as a cathode, a p-type metal-oxide-semiconductor (PMOS) transistor formed in the first well including a gate, a first diffused region and a second diffused region separated apart from the first diffused region, a second n-type region formed in the first well electrically connected to the first diffused region of the PMOS transistor, and a second p-type region formed in the substrate electrically connected to the second diffused region of the PMOS transistor. | 04-05-2012 |
20120236445 | On-Chip Noise Filter Circuit - A noise filter circuit for an IC is provided. The noise filter circuit comprises a decoupling unit coupled to a power pad of the IC and a current amplifier circuit coupled to the decoupling unit and the power pad of the IC. The decoupling unit generates a first current in response to a transient voltage being on the power pad of the IC. The current amplifier circuit drains a second current from the power pad of the IC according to the first current. | 09-20-2012 |
20130155566 | SELF-RESET TRANSIENT-TO-DIGITAL CONVERTOR AND ELECTRONIC PRODUCT UTILIZING THE SAME - A self-reset transient-to-digital convertor which includes at least one transient detection circuit is disclosed. The transient detection circuit, coupled between a first power line and a second power line, includes at least one voltage drop unit, a current amplifier unit, and a time control unit. When an ESD event occurs, the voltage drop unit is conducted to pass through an ESD current. The current amplifier unit, coupled between the voltage drop unit and the first power line, is conducted by the ESD current to set the level of a first node. The time control unit, coupled between the first node and the second power line, is configured to gradually drain the ESD current away. Wherein, each of the transient detection circuit generates a digital code according to the level of the first node. | 06-20-2013 |