Patent application number | Description | Published |
20080277805 | Semiconductor Device - Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like. | 11-13-2008 |
20080307777 | Exhaust Gas After-Treatment Apparatus - In an exhaust gas after-treatment apparatus ( | 12-18-2008 |
20080314485 | Pneumatic Tire for Motorcycle - The present invention provides a pneumatic tire for a motorcycle capable of satisfying all of high-speed durability, turning performance and slide controllability. | 12-25-2008 |
20090008682 | Light-Receiving Device - Disclosed is a light-receiving device comprising a substrate provided with at least one light-receiving element and a transparent cover ( | 01-08-2009 |
20090189277 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS FOR LOW STRESS, HIGH TEMPERATURE FILMS - Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: | 07-30-2009 |
20090294887 | Semiconductor device - A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion. The semiconductor device is capable of reliably preventing dust from infiltrating into the semiconductor device and capable of reliably preventing occurrence of dew condensation in an inner wall of the semiconductor device, particularly on an inner surface of a transparent substrate. | 12-03-2009 |
20100078830 | ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt % of film forming resin; (B) 30 to 80 wt % of curable resin; and (C) 1 to 20 wt % of curing agent having flux activity. | 04-01-2010 |
20100102446 | SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING THE SAME - The problem of the present invention is to provide a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits. | 04-29-2010 |
20100120937 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like. | 05-13-2010 |
20100203307 | ADHESIVE TAPE - Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy resin, and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorus compound. This adhesive tape can be used as an interlayer material for circuit boards or multilayer flexible printed wiring boards. | 08-12-2010 |
20100221744 | METHOD FOR PREDICTION OF POSTOPERATIVE PROGNOSIS AND DIAGNOSIS KIT - The present invention relates to a method for predicting the postoperative prognosis of a lung adenocarcinoma patient with high sensitivity and/or specificity by identifying a protein with an expression level that specifically varies in a lung adenocarcinoma patient, comprising: step (a) of determining expression levels of myosin IIA and/or vimentin in a biological sample collected from a lung adenocarcinoma patient; and step (b) of predicting or determining a prognosis based on the expression levels of myosin IIA and/or vimentin obtained as a result of determination. | 09-02-2010 |
20100302361 | SIGN RECOGNITION DEVICE - A sign recognition device includes a sign effective range data recording unit for prestoring effective range conditions shown by a sign and an auxiliary sign, a sign recognition unit for recognizing a sign and an auxiliary sign by using a captured image of a roadway in front of a vehicle, a vehicle information acquiring unit for acquiring vehicle information, a map information acquiring unit for acquiring map information about a map of an area surrounding the vehicle, and a sign effective range determining unit for determining whether or not the vehicle is staying in the effective range specified with the sign and the auxiliary sign which have been recognized by the sign recognition unit by using the effective range conditions stored in the sign effective range data recording unit, the vehicle information, and the map information. | 12-02-2010 |
20110006419 | FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A film for use in manufacturing a semiconductor device having at least one semiconductor element of the present invention is characterized by comprising: a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity. Further, it is preferred that in the film of the present invention, the semiconductor element is of a flip-chip type and has a functional surface, and the bonding layer is adapted to be bonded to the functional surface of the semiconductor element. | 01-13-2011 |
20110269410 | RADIO COMMUNICATION APPARATUS, RADIO NETWORK SYSTEM, AND DATA LINK CONSTRUCTION METHOD USED FOR THE SAME - The present invention provides a radio communication apparatus that does not need installation of multiple radio devices in a communication node and requires only a single radio device to construct a data link of any of line-of-sight communication, over-the-horizon communication and aerial-vehicle communication. A radio communication apparatus includes a line-of-sight communication processing part that controls a beam from a phased array antenna to establish a line-of-sight communication, which is used when there is no obstacle in a radio transmission channel, an over-the-horizon communication processing part that controls the beam from the phased array antenna to establish an over-the-horizon communication, which is used when there is an obstacle in the radio transmission channel, and an aerial-vehicle communication processing part that controls the beam from the phased array antenna to establish an aerial-vehicle communication, which is used for communication with a communication node on a flying object, and the phased array antenna switches among the line-of-sight communication, the over-the-horizon communication and the aerial-vehicle communication. | 11-03-2011 |
20110291300 | DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE - The present invention includes a dicing sheet-attached film for forming a semiconductor protection film ( | 12-01-2011 |
20120100484 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME - A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: | 04-26-2012 |
20130311083 | OBJECT DETECTION DEVICE AND NAVIGATION DEVICE - An object detection device includes: an ultrasonic sensor for transmitting a signal and further receiving reflected signals of the transmitted signal; a delay-sum processing unit for generating two-dimensional distance information in which the reflected signals received by the ultrasonic sensor are delay-summed in a plurality of reference planes set in advance; a distance information integration unit for generating integrated distance information in which the two-dimensional distance information in the plurality of reference planes generated by the delay-sum processing unit is summed in a vertical direction to the reference planes; and an object detection unit for detecting an object at a position where an intensity in the vertical direction is equal to or larger than a threshold value by referring to an intensity in the vertical direction of the integrated distance information generated by the distance information integration unit. | 11-21-2013 |