Shephard, US
Edward D. Shephard, Golden, CO US
Patent application number | Description | Published |
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20140079199 | SCALABLE AND FLEXIBLE INTERNET FAX ARCHITECTURE FOR PROCESSING OUTBOUND FAX MESSAGES - Methods and systems for processing outbound fax messages in an efficient and scalable manner are provided. According to one embodiment, a request to deliver a fax message is received by an Internet fax system. Source files associated with the request and representing at least a portion of content to be included as part of the fax message are stored to a shared storage area accessible by multiple imaging systems and multiple fax processing resources. A load score is calculated for each imaging system based on one or more of a processor load and a memory load. An imaging system is selected, based on the load scores, to convert the source files into a digital representation suitable for faxing. The source files are converted by associating the digital representation with an outbound fax job. The fax message is delivered by submitting the outbound fax job to one of the fax modems. | 03-20-2014 |
Nick Shephard, Midland, MI US
Patent application number | Description | Published |
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20090220794 | Bonding An Adherent To A Substrate Via A Primer - A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent. | 09-03-2009 |
20100092690 | Dual Curing Polymers and Methods for Their Preparation and Use - A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R | 04-15-2010 |
20100208432 | Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use - A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM | 08-19-2010 |
20100328895 | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use - A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications. | 12-30-2010 |
Nick Evan Shephard, Midland, MI US
Patent application number | Description | Published |
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20080276983 | Encapsulation of Photovoltaic Cells - This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material ( | 11-13-2008 |
20100069523 | Dual Curing Polymers and Methods for Their Preparation and Use - A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R | 03-18-2010 |
20110061724 | Photovoltaic Cell Module And Method Of Forming Same - A photovoltaic cell module, a photovoltaic array including at least two modules, and a method of forming the module are provided. The photovoltaic cell module includes a substrate and a tie layer disposed on the substrate. The tie layer has a depth of penetration of from 1.1 to 100 mm and a tack value of less than −0.6 g·sec. The photovoltaic cell module also includes a photovoltaic cell disposed on the tie layer. The method of forming the photovoltaic cell module includes the steps of disposing the tie layer on the substrate and disposing the photovoltaic cell on the tie layer to form the photovoltaic cell module. | 03-17-2011 |
Philip G. Shephard, Round Rock, TX US
Patent application number | Description | Published |
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20080270963 | SYSTEM AND COMPUTER PROGRAM FOR VERIFYING PERFORMANCE OF AN ARRAY BY SIMULATING OPERATION OF EDGE CELLS IN A FULL ARRAY MODEL - A system and computer program for verifying performance of an array by simulating operation of edge cells in a full array model reduces the computation time required for complete design verification. The edge cells of the array (or each subarray if the array is partitioned) are subjected to a timing simulation while the center cells of the array are logically disabled, but remain in the circuit model, providing proper loading. Additional cells are specified for simulation if calculations indicate a worst-case condition due to a non-edge cell. Wordline arrivals are observed to determine worst-case rows for selection. For write operations, the difference between the wordline edges and the data edges is used to locate any non-edge “outlier” cells. For read operations, the wordline delays are summed with the bitline delays determined from edge column data to locate any outliers. | 10-30-2008 |