Patent application number | Description | Published |
20090026073 | SPUTTERING SYSTEM - A plurality of magnets are rotatably supported and when a ratio between revolution angle and rotation angle per unit time is set to 1:R, R is set to a value which is not less than 1 and not more than 5, and is not a common divisor of 360, so that the time variation of regions where a magnetic field (line of magnetic force) generated by the each magnet is orthogonal to an electric field is prevented from becoming monotonous. Further, the respective magnets are arranged to make the distances between the center of rotation and the center of revolution of the respective magnets different from each other, so that the regions where the magnetic field (line of magnetic force) generated by the each magnet is orthogonal to the electric field are dispersed in the radial direction of a target. | 01-29-2009 |
20090206224 | Device-Positioning Pedestal and Handler Having the Device-Positioning Pedestal - A device-positioning pedestal capable of positioning devices of different sizes. The device-positioning pedestal comprises a plurality of guide members corresponding to the sides of the device and coming in contact with the sides of the device to position the device, at least one guide member includes a slide mechanism that supports the guide member so as to slide relative to the device-positioning pedestal member and a fixing mechanism that fixes the guide members at desired positions. The guide members are set to be adapted to the size of the device by the guide member-adjusting means separate from the device-positioning pedestal. The guide member-adjusting means adjust the position of the guide members based on the size of the device measured by device size-measuring means separate from the guide member-adjusting means or based on the data of data-recording means attached to the device-positioning pedestal. | 08-20-2009 |
20100006422 | SPUTTERING SYSTEM AND METHOD FOR DEPOSITING THIN FILM - A sputtering system for depositing a thin film on the surface of a disc substrate in which high precision positioning of an inner mask and an outer mask is facilitated. The sputtering system has a mask member placed on the surface of the substrate mounted on a substrate holder to cover a partial region on the surface of the substrate. A thin film is deposited by sputtering in a region on the surface of the substrate not covered by the mask member. A section for carrying in and carrying out the substrate has mechanically holds and releases the substrate holder mounting the substrate, and mechanically holds and releases the mask member. | 01-14-2010 |
20100104404 | Handler Having Position Correcting Function and Method of Loading Uninspected Device into Measuring Socket - A handler includes a device holding portion, which holds an uninspected device and loads the device in a measuring socket on a device tester, having a suction means for sucking the device by a very weak pushing force at the time of sucking the device from an uninspection tray and for loading the device in a measuring socket and also having a clamper capable of outputting a pushing force which can be changed at the time of the measurement contact. The device holding portion includes a position correcting mechanism for making a device position correction executed by an image recognizing and position correcting means. | 04-29-2010 |
20100300834 | SOLAR CELL MODULE CONVEYER LINE - A solar cell module conveyer comprising an assembly line for intermittently feeding solar cells that constitute a solar cell module, and having machinery arranged for successively executing the working/treating steps; belt conveyers working as an inspection line which is synchronized with the assembly line to inspect the solar cell module fabricated on the assembly line through various working/treatment steps; and a transfer mechanism for transferring the solar cell module from the assembly line onto the belt conveyers. | 12-02-2010 |
Patent application number | Description | Published |
20140103117 | RFID TAG - There is provided an RFID tag, which includes: a first substrate having flexibility and configured to include an antenna provided on a first surface of the first substrate; a second substrate; an IC chip mounted on a first surface of the second substrate; an anisotropic conductive rubber configured to contact the first substrate to the second substrate with the IC chip facing the first surface of the first substrate and to contact a terminal of the IC chip to the antenna; and an exterior rubber configured to cover the first substrate, the second substrate, and the IC chip. | 04-17-2014 |
20140339713 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method includes sealing a first surface of a semiconductor wafer with a resin, causing a resin-made warp suppression member to be adhered to a second surface on the opposite side of the first surface of the semiconductor wafer and causing the warp suppression member to shrink, measuring the amount of warp of the semiconductor wafer, and forming cuts in the warp suppression member in accordance with the amount of warp of the semiconductor wafer. | 11-20-2014 |
20150212285 | OPTICAL MODULE, METHOD FOR MANUFACTURING OPTICAL MODULE, AND OPTICAL TRANSCEIVER - An optical module comprising: an optical waveguide transports light, the optical waveguide including a first mirror which reflects first light; an adhesive sheet formed over the optical waveguide, the adhesive sheet including a first gap above the first mirror; a first light-transmissive layer formed in the first gap; a lens sheet arranged over the adhesive sheet, the lens sheet including a first lens which is formed above the first light-transmissive layer; and a light-emitting device formed above the lens sheet, the light-emitting device including a light-emitting portion which emits the first light to the first lens. | 07-30-2015 |
20150346434 | FABRICATION METHOD FOR OPTICAL CONNECTOR AND OPTICAL CONNECTOR - A fabrication method for an optical connector, includes: inserting an optical waveguide sheet, in a direction of an optical path of the optical waveguide sheet, into an insertion hole of an optical connector including lenses disposed in a juxtaposed relationship on a first end face of the optical connector, the insertion hole extending from a second end face of the optical connector at an opposite side to the first end face toward the lenses; and performing first adjustment of adjusting a position of a tip end of the optical path with respect to the lenses by pressing a side end portion of the optical waveguide sheet inserted in the insertion hole from at least one of sides of a first direction along a disposition direction of the lenses, through a first hole portion that is provided in the optical connector and extends to the insertion hole. | 12-03-2015 |
20150362675 | OPTICAL WAVEGUIDE SHEET, OPTICAL UNIT, AND METHOD FOR MANUFACTURING THE SAME - An optical waveguide sheet, includes: an optical path; and a clad member that covers the optical path, wherein the clad member has a portion formed by removing a part of the clad member which is on a first surface of an optical waveguide sheet on which the optical component is to be mounted and is provided within an area which is unused for propagation of light input to and output from the optical component. | 12-17-2015 |
Patent application number | Description | Published |
20080203138 | Method of mounting an electronic component and mounting apparatus - In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps. | 08-28-2008 |
20080206587 | METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT AND AN ELECTRONIC DEVICE - An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet. | 08-28-2008 |
20080265002 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same - A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip | 10-30-2008 |
20080265003 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same - A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip | 10-30-2008 |
20090146652 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090146653 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20100075493 | METHOD OF FORMING ELECTRODE CONNECTING PORTION - A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet. | 03-25-2010 |
Patent application number | Description | Published |
20140300044 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet feeding device includes a feeding tray, a conveying device, an ejecting tray, a feeding guide and a conveying rib. On the feeding tray, a sheet is placed. The conveying device feeds the sheet on the feeding tray to an image reading device. The ejecting tray receives the sheet after image reading. The feeding guide is configured to be movable in a direction intersecting a feeding direction of the sheet and to regulate a position in a width direction of the sheet on the feeding tray. The conveying rib is configured to be movable in interlocking with movement of the feeding guide and to lead the sheet to be ejected onto the ejecting tray. | 10-09-2014 |
20150027841 | DRIVING DEVICE - A driving device includes shaft, support member, restraining member, and connection portion. Shaft has a screw portion formed on an outer peripheral surface thereof. Support member rotatably supports shaft. Restraining member restrains shaft so as not to be movable in an axial direction thereof. Connection portion is formed in one end portion of shaft, and has output-side joint member detachably connected thereto. Input-side joint member is engaged by thread with screw portion of shaft so as to be rotatably supported. By being driven to rotate by drive source, input-side joint member is movable between connection position where input-side joint member is connected to output-side joint member and withdrawal position where connection is cut off. Driving device includes compression spring. When input-side joint member is moved from withdrawal position to connection position by drive source, compression spring compressively deform, while being sandwiched by input-side joint member and output-side joint member. | 01-29-2015 |
20150086241 | IMAGE FORMING APPARATUS - An image forming apparatus includes a fixing unit, a first support portion, and a second support portion. First support portion fits with and positions first supported portion, which is end of fixing unit, in up-down direction and supports first supported portion movably in insertion direction of fixing unit toward attachment position. Second support portion fits with and positions second supported portion, which is another end of fixing unit, in up-down direction and supports second supported portion movably in insertion direction. Height adjustment portion adjusts height position of fixing unit by moving second support portion in up-down direction. The first support portion includes vertical surface facing first supported portion and extending in up-down direction, and vertical surface has projection at an end thereof on foreside of insertion direction, the projection projecting from the vertical surface in first direction of going away from the vertical surface. | 03-26-2015 |